Abstract A high output semiconductor device of the type which is tightly encased in a plastic coating, and includes a wafer-shaped semiconductor body having electrodes at its opposed major surfaces, two cylindrical metal bodies serving as current connecting and heat dissipating members contacting the electrodes of the semiconductor body at the respective major surfaces, and an insulating ring which encloses the metal bodies and the semiconductor body thereby centering the same. A pair of annular sheet metal strips, each having a dished portion adjacent the inner periphery, are each fastened at their inner peripheries to the superficies of a respective one of the two metal bodies. The dished portion of each of the annular strips encloses one frontal face or edge surface of the insulating ring while leaving an air gap therebetween and the outer edge portion of each annular strip extends into and is rigidly embedded in the plastic coating which has been produced by encasing or spraying under pressure around the outer surface of the insulating ring. The insulating ring is made of a material which does not adhere to the metal bodies or the annular strips and has a high softening temperature.
In a high output semiconductor device which is tightly encased in a plastic coating, said device including a wafer-shaped semiconductor body having electrodes at its opposed major surfaces, two cylindrical metal bodies serving as current connecting means and as means for dissipating heat contacting said electrodes of said semiconductor body at said respective major surfaces, a hollow cylindrical insulating ring which encloses and centers said metal bodies and said semiconductor body, and a pair of annular sheet metal strips each connecting one of said metal bodies to said plastic jacket so as to seal said semiconductor body; the improvement wherein: said pair of annular sheet metal strips each has a dished portion adjacent its inner periphery; the inner periphery of each of said strips is fastened to the superficies of a respective one of said two metal bodies with said dished portions enclosing the respective edge surfaces of said insulating ring while leaving an air gap therebetween; said insulating ring is formed of an insulating material which does not adhere to said metal bodies or said metal strips and which has a high softening temperature; and the outer periphery of said annular strips is rigidly embedded in said plastic coating which has been produced by encasing or spraying under pressure around the outer surface of said insulating ring.
Claim 2
Dependent Claim
218 words
In a high output semiconductor device which is tightly encased in a plastic coating, said device including a wafer-shaped semiconductor body having electrodes at its opposed major surfaces, two cylindrical metal bodies serving as current connecting means and as means for dissipating heat contacting said electrodes of said semiconductor body at said respective major surfaces, a hollow cylindrical insulating ring which encloses and centers said metal bodies and said semiconductor body, and a pair of annular sheet metal strips each connecting one of said metal bodies to said plastic jacket so as to seal said semiconductor body; the improvement wherein: said pair of annular sheet metal strips each has a dished portion adjacent its inner periphery; the inner periphery of each of said strips is fastened to the superficies of a respective one of said two metal bodies with said dished portions enclosing the respective edge surfaces of said insulating ring while leaving an air gap therebetween; said insulating ring is formed of an insulating material which does not adhere to said metal bodies or said metal strips and which has a high softening temperature; and the outer periphery of said annular strips is rigidly embedded in said plastic coating which has been produced by encasing or spraying under pressure around the outer surface of said insulating ring.
Claim 3
Dependent Claim
23 words
A semiconductor device as defined in claim 1 wherein said plastic coating which tightly encloses the semiconductor device is made of epoxy resin.
Claim 4
Dependent Claim
19 words
A semiconductor device as defined in claim 1 wherein said plastic coating is made of a pressed silicone mass.
Claim 5
Dependent Claim
21 words
A semiconductor device as defined in claim 1 wherein said insulating ring is made of a glass fiber reinforced epoxy mass.
Claim 6
Dependent Claim
37 words
A semiconductor device as defined in claim 1 wherein said insulating ring is formed of a plastic material which has a softening temperature greater than the temperature at which the material of said plastic coating becomes liquid.
Claim 7
Dependent Claim
17 words
A semiconductor device as defined in claim 1 wherein said sheet metal strips are made of copper.