Patent US4954308A successfully refreshed from Google Patents.
US4954308A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Resin encapsulating method
Assignee: Citizen Holdings Co Ltd
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Filing: 1988-12-27
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Granted: 1990-09-04
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Expires: 2008-12-27
Abstract
Abstract A resin encapsulating method includes the steps of mounting a plate having a gate groove on a substrate to form a side gate, connected to the side surface of a cavity, between the plate and one of the upper and lower half molds, and filling a resin in the cavity.
Inventors
- 👤 Isao Yabe
- 👤 Katsuji Komatsu
- 👤 Hiroyuki Kaneko
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 08:54
CPC Classifications
G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/0772; G06K19/07724; B; B29; B29C; B29C45/00; B29C45/14; B29C45/14639; B29C45/14647; B29C45/17; B29C45/26; B29C45/27; B29C45/2701; B29C45/2708; G06K19/07745; H; H10; H10W; H10W74/00; H10W74/01; H10W74/016; B29C43/00; B29C43/32; B29C43/58; B29C2043/5825; H10W72/00; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
180 words
(New) A method of resin encapsulating an electronic part mounted on a flat resin circuit board having metallic wiring thereon, the method comprising the steps of: sandwiching said circuit board between a first mold and a second mold so as to position said electronic part in a cavity formed by at least the first mold wherein said electronic part is disposed within said cavity; selecting a gate plate having a gate groove formed on one surface thereof; arranging said gate plate adjacent to said cavity on an intermediate portion of a surface of the circuit board, the intermediate portion being spaced from the edge of the circuit board; orienting said gate plate such that said gate groove faces a surface of said mold opposite the surface on which said circuit board is disposed and forming a side gate between said first mold and said gate groove, thereby connecting said side gate to a side surface of said cavity at a position spaced from an upper surface of said circuit board; and filling said cavity with resin through said side gate.
Claim 2
Dependent Claim
180 words
(New) A method of resin encapsulating an electronic part mounted on a flat resin circuit board having metallic wiring thereon, the method comprising the steps of: sandwiching said circuit board between a first mold and a second mold so as to position said electronic part in a cavity formed by at least the first mold wherein said electronic part is disposed within said cavity; selecting a gate plate having a gate groove formed on one surface thereof; arranging said gate plate adjacent to said cavity on an intermediate portion of a surface of the circuit board, the intermediate portion being spaced from the edge of the circuit board; orienting said gate plate such that said gate groove faces a surface of said mold opposite the surface on which said circuit board is disposed and forming a side gate between said first mold and said gate groove, thereby connecting said side gate to a side surface of said cavity at a position spaced from an upper surface of said circuit board; and filling said cavity with resin through said side gate.
Claim 3
Dependent Claim
35 words
A method according to claim 1, wherein said step of sandwiching said circuit board comprises positioning said electronic part in a polygonal cavity such that said plate forms at least one side of said cavity.
Claim 4
Dependent Claim
25 words
A method according to claim 1 wherein said step of filling said cavity includes encapsulating said electronic part and wherein said circuit board remains unencapsulated.
Claim 5
Dependent Claim
25 words
A method according to claim 1, wherein said step of selecting a gate plate comprises selecting a gate plate wherein said gate groove is tapered.
Claim 6
Dependent Claim
40 words
A method according to claim 1, wherein said step of orienting said gate plate comprises forming said side gate connected to a side surface of said cavity at a position spaced apart from one of said first and second molds.
Claim 7
Dependent Claim
55 words
A method according to claim 1, further comprising the additional steps of separating the first and second molds from each other; pivotally mounting said plate on one of said first and second molds; and pivotally removing said plate from said board by driving means after said first and second molds are separated from each other.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-09-03 | 1994-03-05 | 1994-09-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-09-03 | 1998-03-05 | 1998-09-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-09-03 | 2002-03-05 | 2002-09-04 | $7700.00 | Window Closed / Lapsed |