Adhesion promoting product and process for treating an integrated circuit substrate therewith

Claim 2

In a method of producing microelectronic components by photolithography the improvement comprising applying an adhesion promoting alkoxysilane to a microelectronic component substrate, the adhesion promoting alkoxy silane being selected from the group consisting of p-aminophenyltriethoxysilane; beta-trimethoxysilylethyl-2-pyridine; 4,5-dihydro-1-(3-(triethoxysilyl)propyl)-1H-imidazole, and (aminoethylaminomethyl)phenylethyltrimethoxysilane, the adhesion promoter being effective to increase the bond of a microelectronic coating to the substrate.

Claim 3

The method of claim 1 wherein the adhesion promoter is p-aminophenyltriethoxysilane.

Claim 4

The method of claim 1 wherein the adhesion promoter is beta-trimethoxysilylethyl-2pyridine.

Claim 5

The method of claim 1 wherein the adhesion promoter is 4,5-dihydro-1(3-triethoxysilyl)propyl)-1H imidazole.

Claim 6

The method of claim 1 wherein the adhesion promoter is (aminoethylaminomethyl)phenylethyltrimethoxysilane.

Claim 7

In a method of producing microelectronic components by photolithography the improvement comprising applying an adhesion promoter to the microelectronic component substrate, the adhesion promoter comprising an adhesion promoting alkoxy silane and an activating catalyst, the catalyst being selected from the group consisting of acidic catalysts and basic catalysts, the catalyst being effective to increase the bonding of the alkoxy silane and the combination being effective to increase the bond of a microelectronic coating to the substrate. PG,19

Claim 8

In a method of producing microelectronic components by photolithography the improvement comprising applying an adhesion promoter to the microelectronic component substrate, the adhesion promoter comprising an adhesion promoting alkoxy silane and an activating catalyst, the catalyst being selected from the group consisting of acidic catalysts and basic catalysts, the catalyst being effective to increase the bonding of the alkoxy silane and the combination being effective to increase the bond of a microelectronic coating to the substrate. PG,19

Claim 9

The method of claim 6 wherein the catalyst is selected from the group consisting of ammonia, water soluble amines, carboxylic acids, sulfonic acids and mineral acids, the catalyst being effective to increase the bonding of, alkoxy silane adhesion promoters and being free of inhibiting and deleterious constituents including anions destructive to microelectronic circuitry.

Claim 10

The method of claim 6 wherein the catalyst is ethanolamine.

Claim 11

The method of claim 6 wherein the catalyst is acetic acid.

Claim 12

In a method of producing microelectronic components by photolithography the improvement comprising applying an adhesion promoter to a microelectronic substrate, the adhesion promoter comprising an adhesion promoting alkoxy silane and an adjuvant polymer, the polymer being effective when combined with the alkoxy silane to increase the activity of the alkoxy silane and the combination being effective to increase the bond of a microelectronic coating to the substrate.

Claim 13

In a method of producing microelectronic components by photolithography the improvement comprising applying an adhesion promoter to a microelectronic substrate, the adhesion promoter comprising an adhesion promoting alkoxy silane and an adjuvant polymer, the polymer being effective when combined with the alkoxy silane to increase the activity of the alkoxy silane and the combination being effective to increase the bond of a microelectronic coating to the substrate.

Claim 14

The method of claim 10 wherein the adjuvant polymer is selected from the group consisting of polycarbohydrate polymers, polyalkylamine polymers, polycarboxylic acid polymers, polyalcohol polymers, polyglycol polymers and copolymers and mixtures thereof, the polymer being effective to increase the bond of the alkoxy silane and the combination being effective to increase the bond of a microelectronic coating to the substrate, the combination being effective to bond a microelectronic coating to a substrate without baking the adhesion promoter on the substrate.

Claim 15

The method of claim 10 wherein the adjuvant polymer is polyethyleneimine.

Claim 16

The method of claim 10 wherein the adjuvant polymer is methyl cellulose.

Claim 17

The method of claim 10 wherein the adjuvant polymer is polymethylvinylether/maleic anhydride half isopropyl ester copolymer.

Claim 18

In a method of producing microelectronic components by photolithography the improvement comprising applying an adhesion promoting alkoxy silane to a microelectronic component substrate, the adhesion promoting alkoxy silane being applied to the microelectronic substrate as a solution, the solution containing between about 0.05-0.5 weight percent alkoxy silane, an adjuvant polymer, the polymer being effective when combined with the alkoxy silane to increase the activity of the alkoxy silane, an adhesion promoting catalyst, the catalyst being effective to increase the bonding of the alkoxy silane and an aqueous solvent, the combination being effective to increase the bond of a microelectronic coating to the substrate.

Claim 19

In a method of producing microelectronic components by photolithography the improvement comprising applying an adhesion promoting alkoxy silane to a microelectronic component substrate, the adhesion promoting alkoxy silane being applied to the microelectronic substrate as a solution, the solution containing between about 0.05-0.5 weight percent alkoxy silane, an adjuvant polymer, the polymer being effective when combined with the alkoxy silane to increase the activity of the alkoxy silane, an adhesion promoting catalyst, the catalyst being effective to increase the bonding of the alkoxy silane and an aqueous solvent, the combination being effective to increase the bond of a microelectronic coating to the substrate.

Claim 20

The method of claim 15 wherein the solution contains between about 0.05-0.5 weight percent of an adjuvant polymer.

Claim 21

The method of claim 15 wherein the solution contains between about 0.05-0.1 weight percent catalyst.

Claim 22

The method of claim 15 wherein the adjuvant polymer is selected from the group consisting of polycarbonate polymers, polyalkylamine polymers, polycarboxylic acid polymers, polyalcohol polymers, polyglycol polymers and copolymers and mixtures thereof.

Claim 23

The method of claim 23 wherein the catalyst is selected from the group consisting of ammonia, water soluble amines, carboxylic acids, sulfonic acids and mineral acids, the catalyst being effective to increase the bonding of the alkoxy silane adhesion promoter and being free of inhibiting and deleterious constituents including anions destructive to microelectronic circuitry.

Claim 24

An adhesion promoter for bonding microelectronic coatings to a substrate to produce microelectronic components comprising a solution of an adhesion promoting alkoxy silane containing between about 0.05-0.5 weight percent alkoxy silane, an adjuvant polymer, the polymer being effective when combined with the alkoxy silane to increase the activity of the alkoxy silane, and an adhesion promoting catalyst, the catalyst being effective to increase the bonding of the alkoxy silane and the combination being effective to increase the bond of a microelectronic coating to a substrate.

Claim 25

An adhesion promoter for bonding microelectronic coatings to a substrate to produce microelectronic components comprising a solution of an adhesion promoting alkoxy silane containing between about 0.05-0.5 weight percent alkoxy silane, an adjuvant polymer, the polymer being effective when combined with the alkoxy silane to increase the activity of the alkoxy silane, and an adhesion promoting catalyst, the catalyst being effective to increase the bonding of the alkoxy silane and the combination being effective to increase the bond of a microelectronic coating to a substrate.

Claim 26

The adhesion promoter of claim 20 wherein the catalyst is selected from the group consisting of ammonia, water soluble amines, carboxylic acids, sulfonic acids and mineral acids, the catalyst being effective to increase the bonding of alkoxy silane adhesion promoters and being free of inhibiting and deleterious constituents including anions destructive to microelectronic circuitry.

Claim 27

The adhesion promoter of claim 20 wherein the adjuvant polymer is selected from the group consisting of polycarbohydrate polymers, polyalkylamine polymers, polycarboxylic acid polymers, polyalcohol polymers, polyglycol polymers and copolymers and mixtures thereof.