US4946547A — Method of preparing silicon carbide surfaces for …

Claim 1

Independent Claim 135 words

A method of epitaxially growing a monocrystalline silicon carbide thin film on a silicon carbide surface that reduces defect density in the resulting thin film and in the interface between the thin film and the silicon carbide surface, the method comprising: forming a substantially planar surface on a monocrystalline silicon carbide crystal; exposing the substantially planar surface to an etching plasma until any surface or subsurface damage caused by the mechanical preparation is substantially removed, but for a time period less than that over which the plasma etch will develop new defects in the surface or aggravate existing ones, and while using a plasma gas and electrode system that do not themselves cause substantial defects in the surface; and depositing a thin film of monocrystalline silicon carbide upon the etched surface by chemical vapor deposition.

Claim 2

Independent Claim 135 words

A method of epitaxially growing a monocrystalline silicon carbide thin film on a silicon carbide surface that reduces defect density in the resulting thin film and in the interface between the thin film and the silicon carbide surface, the method comprising: forming a substantially planar surface on a monocrystalline silicon carbide crystal; exposing the substantially planar surface to an etching plasma until any surface or subsurface damage caused by the mechanical preparation is substantially removed, but for a time period less than that over which the plasma etch will develop new defects in the surface or aggravate existing ones, and while using a plasma gas and electrode system that do not themselves cause substantial defects in the surface; and depositing a thin film of monocrystalline silicon carbide upon the etched surface by chemical vapor deposition.

Claim 3

Dependent Claim 33 words

A method according to claim 1 wherein the step of forming a substantially planar surface on a silicon carbide crystal comprises mechanically preparing the silicon carbide crystal to form a substantially planar surface.

Claim 4

Dependent Claim 53 words

A method according to claim 2 wherein the step of mechanically preparing a silicon carbide crystal comprises: slicing a silicon carbide crystal to expose a generally planar surface; lapping the generally planar surface with an abrasive paste; and polishing the generally planar surface with an abrasive paste to produce a substantially planar surface.

Claim 5

Dependent Claim 55 words

A method according to claim 1 wherein the step of exposing the substantially planar surface to an etching plasma for a time period less than that over which the plasma etch will develop new defects in the surface or aggravate existing ones comprises limiting the depth of etch to between about 0.02 and 10 microns.

Claim 6

Dependent Claim 55 words

A method according to claim 1 wherein the step of exposing the substantially planar surface to an etching plasma for a time period less than that over which the plasma etch will develop new defects in the surface or aggravate existing ones comprises limiting the depth of etch to between about 0.5 and 1 micron.

Claim 7

Dependent Claim 67 words

A method according to claim 1 wherein the step of depositing a thin film of monocrystalline silicon carbide upon the etched surface by chemical vapor deposition comprises depositing a thin film layer of 6H silicon carbide on a flat interface 6H silicon carbide surface that is inclined more than one degree off axis with respect to a basal plane thereof substantially towards one of the <1120> directions.

Claim 8

Dependent Claim 107 words

A method according to claim 1 wherein the step of depositing a thin film of monocrystalline silicon carbide upon the etched surface by chemical vapor deposition comprises epitaxially depositing a beta silicon carbide thin film in the [111] growth direction on the (0001) Si face of a 6H silicon carbide surface such that the (111) crystallography of the beta silicon carbide thin film matches the (0001) crystallography of the 6H silicon carbide surface and such that the beta silicon carbide (101) face is parallel to the 6H silicon carbide (1120) face and the beta silicon carbide (111) face is parallel to the 6H silicon carbide (0001) face.

Claim 9

Dependent Claim 195 words

A method according to claim 1 wherein the step of exposing the substantially planar surface to an etching plasma while using a plasma gas and electrode system that do not themselves cause substantial defects in the surface comprises: applying a plasma generating potential across two electrodes; generating a plasma between the two electrodes by introducing a gas between the electrodes, and wherein the gas is easily dissociated substantially into its elemental species in the plasma and wherein substantially all of the dissociated species from the gas are volatile in the plasma and wherein at least one of the dissociated species is reactive with silicon carbide; positioning the substantially planar silicon carbide surface as a target on one of the electrodes, and wherein the electrode is formed from a material with a low sputter yield and wherein the electrode material is reactive with the dissociated species; and reacting the plasma with the silicon carbide to thereby etch the silicon carbide while the reaction of the dissociated species with the electrode and the electrode's low sputter yield prevents contamination of the target with either sputtered materials from the supporting electrode or nonvolatile dissociated species from the plasma.

Claim 10

Dependent Claim 104 words

A method according to claim 8 wherein the step of generating a plasma between the two electrodes by introducing a gas between the electrodes comprises introducing a mixture of a fluorine containing gas and an oxygen containing gas that is easily dissociated substantially into its elemental species in the plasma and wherein substantially all of the dissociated species from the gas mixture are volatile in the plasma and wherein at least one of the dissociated species is reactive with silicon carbide and with the proviso that none of the resulting species otherwise interferes with the etching process or the silicon carbide surface being prepared.

Claim 11

Dependent Claim 22 words

A method according to claim 8 wherein the step of generating a plasma comprises forming a reactive ion plasma from nitrogen trifluoride.

Claim 12

Dependent Claim 24 words

A method according to claim 10 wherein the step of generating a reactive ion plasma comprises applying a direct current bias to the plasma.

Claim 13

Dependent Claim 31 words

A method according to claim 8 further comprising the step of applying a magnetic field to the target to enhance the etch rate of the silicon carbide target in the plasma.

Claim 14

Dependent Claim 23 words

A method according to claim 12 wherein the step of applying a magnetic field comprises placing a magnet adjacent the silicon carbide target.

Claim 15

Dependent Claim 30 words

A method according to claim 8 wherein the step of positioning the silicon carbide target on one of the electrodes comprises positioning the silicon carbide target on a carbon cathode.

Claim 16

Dependent Claim 30 words

A method according to claim 8 wherein the step of positioning the silicon carbide target on one of the electrodes comprises positioning the silicon carbide target on a quartz cathode.

Claim 17

Dependent Claim 29 words

A method according to claim 8 wherein the step of applying a plasma generating potential comprises applying between about 10 and about 400 watts of power to the electrodes.

Claim 18

Dependent Claim 35 words

A method according to claim 8 wherein the step of applying a plasma generating potential comprises applying a power density of between about 0.04 and about 2 watts per square centimeter to the powered electrode.

Claim 19

Dependent Claim 34 words

A method according to claim 8 wherein the step of applying a plasma generating potential comprises applying a power density of between about 0.4 and 0.9 watts per square centimeter to the powered electrode.

Claim 20

Dependent Claim 30 words

A method according to claim 8 wherein the step of introducing a gas between the electrodes comprises introducing the gas at a pressure of between about 5 and 5000 milliTorr.

Claim 21

Dependent Claim 33 words

A method according to claim 8 wherein the step of introducing a gas comprises introducing a gas at a flow rate of between about 1 and about 500 standard cubic centimeters per minute.

Claim 22

Dependent Claim 29 words

A method according to claim 8 wherein the step of introducing a gas comprises introducing a gas at a flow rate of about 50 standard cubic centimeters per minute.

Claim 23

Dependent Claim 33 words

A method according to claim 8 wherein the step of introducing a gas comprises introducing a mixture of about ten percent nitrous oxide in nitrogen trifluoride at a pressure of about 100 milliTorr.

Claim 24

Dependent Claim 20 words

A method according to claim 8 wherein the step of generating a plasma comprises generating a reactive ion beam plasma.

Claim 25

Dependent Claim 20 words

A method according to claim 8 wherein the step of generating a plasma comprises generating a electron cyclotron resonance plasma.

Claim 26

Independent Claim 164 words

A method of etching of a silicon carbide target comprising: applying a plasma generating potential across an anode and a quartz cathode; generating a plasma between the anode and the quartz cathode by introducing a mixture of about ten percent nitrous oxide in nitrogen trifluoride therebetween; positioning a silicon carbide target to be etched on the quartz cathode whereby the quartz cathode exhibits a low sputter yield and is reactive with dissociated fluorine from the nitrogen trifluoride; and reacting the plasma with the silicon carbide until any surface or subsurface damage caused by the mechanical preparation is substantially removed, but for a time period less than that over which the plasma etch will develop new defects in the surface or aggravate existing ones, to thereby etch the silicon carbide while the reaction of dissociating fluorine with the quartz cathode, and the cathode's low sputter yield prevents contamination of the target with either sputtered materials from the cathode or polymerized fluorine species from the plasma.

Claim 27

Independent Claim 164 words

A method of etching of a silicon carbide target comprising: applying a plasma generating potential across an anode and a quartz cathode; generating a plasma between the anode and the quartz cathode by introducing a mixture of about ten percent nitrous oxide in nitrogen trifluoride therebetween; positioning a silicon carbide target to be etched on the quartz cathode whereby the quartz cathode exhibits a low sputter yield and is reactive with dissociated fluorine from the nitrogen trifluoride; and reacting the plasma with the silicon carbide until any surface or subsurface damage caused by the mechanical preparation is substantially removed, but for a time period less than that over which the plasma etch will develop new defects in the surface or aggravate existing ones, to thereby etch the silicon carbide while the reaction of dissociating fluorine with the quartz cathode, and the cathode's low sputter yield prevents contamination of the target with either sputtered materials from the cathode or polymerized fluorine species from the plasma.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	1993-08-06	1994-02-05	1994-08-07	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	1997-08-06	1998-02-05	1998-08-07	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2001-08-06	2002-02-05	2002-08-07	$7700.00	Window Closed / Lapsed

Method of preparing silicon carbide surfaces for crystal growth

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