US4943491A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Structure for improving interconnect reliability of focal plane arrays
Assignee: Lockheed Martin Corp
•
Filing: 1989-11-20
•
Granted: 1990-07-24
•
Expires: 2009-11-20
Abstract
Abstract An improved structure for interconnecting focal plane arrays. A first body having a first coefficient of expansion comprising a detector array is connected by interconnection apparatus to a second body having a second coefficient of expansion. The second body comprises semiconductor electronics and includes a bottom surface which opposes the surface connected to the first body. A layer of material is bonded with an adhesive to the second body's bottom surface wherein the bonded layer has a third coefficient of expansion which is greater than the first and second coefficients of expansion. In one aspect of the invention, the interconnection apparatus comprises interconnect columns made substantially of indium, the second body is substantially comprised of silicon and the first body is substantially comprised of material selected from the group consisting of CdTe and HgCdTe. The bonded layer may advantageously be substantially comprised of copper.
Inventors
- 👤 Peter W. Norton
- 👤 James A. Stobie
- 👤 Peter H. Zimmermann
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 07:41
CPC Classifications
H; H10; H10F; H10F39/00; H10F39/10; H10F39/12; H10F39/191; H10F39/193; H10F39/1935; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12528
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
87 words
An improved structure for interconnecting focal plane arrays comprising: (a) a first body having a first coefficient of thermal expansion comprising a detector array; (b) a second body having a second coefficient of thermal expansion comprising semiconductor electronics having a bottom surface; (c) means for interconnecting the first and second bodies; and (d) a layer of material bonded with adhesive to the second body's bottom surface wherein the bonded layer has a third coefficient of thermal expansion greater than the first and second coefficients of thermal expansion.
Claim 2
Dependent Claim
87 words
An improved structure for interconnecting focal plane arrays comprising: (a) a first body having a first coefficient of thermal expansion comprising a detector array; (b) a second body having a second coefficient of thermal expansion comprising semiconductor electronics having a bottom surface; (c) means for interconnecting the first and second bodies; and (d) a layer of material bonded with adhesive to the second body's bottom surface wherein the bonded layer has a third coefficient of thermal expansion greater than the first and second coefficients of thermal expansion.
Claim 3
Dependent Claim
23 words
The structure of claim 1 wherein the first body is substantially comprised of material selected from the group consisting of CdTe and HgCdTe.
Claim 4
Dependent Claim
14 words
The structure of claim 2 wherein the second body is substantially comprised of Si.
Claim 5
Dependent Claim
13 words
The structure of claim 3 wherein the bonded layer is an alloyed metal.
Claim 6
Dependent Claim
14 words
The structure of claim 4 wherein the bonded layer is substantially comprised of Cu.
Claim 7
Dependent Claim
13 words
The structure of claim 1 wherein the bonded layer is an alloyed metal.
Claim 8
Dependent Claim
14 words
The structure of claim 1 wherein the bonded layer is substantially comprised of Cu.
Claim 9
Dependent Claim
13 words
The structure of claim 1 wherein the second body comprises a readout multiplexer.
Claim 10
Dependent Claim
14 words
The structure of claim 8 wherein the second body is substantially comprised of Si.
Claim 11
Dependent Claim
16 words
The structure of claim 1 wherein the interconnection means comprises a plurality of metal column interconnects.
Claim 12
Dependent Claim
15 words
The structure of claim 10 wherein the metal column interconnects are substantially comprised of indium.
Claim 13
Dependent Claim
126 words
An improved structure for interconnecting infrared focal plane arrays comprising: (a) a first body having a first coefficient of expansion including a detector array which is substantially comprised of material selected from the group consisting of CdTe and HgCdTe; (b) a second body having a second coefficient of expansion including multiplexer electronics substantially comprised of material selected from the group consisting of Si and sapphire, wherein the second body includes a bottom surface; (c) a plurality of indium column interconnects wherein the interconnects bond the first and second bodies; and (d) a layer bonded with adhesive to the second body's bottom surface, and wherein the layer has a third coefficient of thermal expansion at least twice as great as the first and second coefficients of expansion.
Claim 14
Dependent Claim
126 words
An improved structure for interconnecting infrared focal plane arrays comprising: (a) a first body having a first coefficient of expansion including a detector array which is substantially comprised of material selected from the group consisting of CdTe and HgCdTe; (b) a second body having a second coefficient of expansion including multiplexer electronics substantially comprised of material selected from the group consisting of Si and sapphire, wherein the second body includes a bottom surface; (c) a plurality of indium column interconnects wherein the interconnects bond the first and second bodies; and (d) a layer bonded with adhesive to the second body's bottom surface, and wherein the layer has a third coefficient of thermal expansion at least twice as great as the first and second coefficients of expansion.
Claim 15
Dependent Claim
72 words
An improved structure for interconnecting focal plane arrays comprising: (a) a first body having a first coefficient of thermal expansion including a detector array; (b) a second body having a second coefficient of expansion substantially equal to the first coefficient of expansion; (c) a third body which is epitaxially grown on the second body and whereon multiplexer electronics are fabricated; and (d) means for interconnecting the multiplexer electronics and the detector array.
Claim 16
Dependent Claim
72 words
An improved structure for interconnecting focal plane arrays comprising: (a) a first body having a first coefficient of thermal expansion including a detector array; (b) a second body having a second coefficient of expansion substantially equal to the first coefficient of expansion; (c) a third body which is epitaxially grown on the second body and whereon multiplexer electronics are fabricated; and (d) means for interconnecting the multiplexer electronics and the detector array.
Claim 17
Dependent Claim
23 words
The structure of claim 13 wherein the first body is substantially comprised of material selected from the group consisting of CdTe and HgCdTe.
Claim 18
Dependent Claim
14 words
The structure of claim 14 wherein the third body is substantially comprised of Si.
Claim 19
Dependent Claim
13 words
The structure of claim 15 wherein the second body is an alloyed metal.
Claim 20
Dependent Claim
14 words
The structure of claim 16 wherein the second body is substantially comprised of Cu.
Claim 21
Dependent Claim
13 words
The structure of claim 13 wherein the second body is an alloyed metal.
Claim 22
Dependent Claim
14 words
The structure of claim 13 wherein the second body is substantially comprised of Cu.
References Cited (Backward Citations)
US3808435A
Cited
US4064533A
Cited
US4039833A
Cited
US4067104A
Cited
US4379232A
Cited
US4228365A
Cited
US4536658A
Cited
US4783584A
Cited
US4792672A
Cited
US4740700A
Cited
US4757210A
Cited
US4868902A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-07-23 | 1994-01-22 | 1994-07-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-07-23 | 1998-01-22 | 1998-07-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-07-23 | 2002-01-22 | 2002-07-24 | $7700.00 | Window Closed / Lapsed |