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US4942327A Expired / Lapsed US ⏱️ 0.0 years remaining

Solid state electronic device

Assignee: Hitachi Ltd
•
Filing: 1989-05-26
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Granted: 1990-07-17
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Expires: 2009-05-26
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Abstract

Abstract A solid state electronic device having a thin film of an Al (aluminum) alloy Li (lithium) on the surface of a substrate for a surface acoustic wave (SAW). Interdigital electrodes, electric wiring patterns and bonding pads are formed by the thin film of the Li-added Al alloy. This thin film suppresses migration which occurs when a high density current is supplied to the device or a large amplitude SAW is generated. The thin film, which provides a small loss and relatively low hardness, provides a desired power handling capability and high yield of wire bonding. The this film assures high endurance to failure of the device and sufficient life of the device.

Inventors

  • 👤 Hitoshi Watanabe
  • 👤 Norio Hosaka
  • 👤 Akitsuna Yuhara
  • 👤 Jun Yamada

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-03 10:54
CPC Classifications
H; H03; H03H; H03H9/00; H03H9/02; H03H9/125; H03H9/145; H03H9/14538; G; G10; G10K; G10K11/00; G10K11/36; H03H9/02535; H03H9/02818; H03H9/02929; H10; H10W; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5522

Claims Analysis

Total Claims: 9
Claim 1
Independent Claim 67 words
A solid state electronic device comprising: a substrate along which a surface acoustic wave propagates, and a conductive thin film provided on the surface of said substrate, said conductive thin film constituting at least one of electrodes, electric wiring patterns and bonding pads, wherein at least a part of said conductive thin film is made of a first aluminum alloy added with lithium by 0.05-3 wt %.
Claim 2
Dependent Claim 67 words
A solid state electronic device comprising: a substrate along which a surface acoustic wave propagates, and a conductive thin film provided on the surface of said substrate, said conductive thin film constituting at least one of electrodes, electric wiring patterns and bonding pads, wherein at least a part of said conductive thin film is made of a first aluminum alloy added with lithium by 0.05-3 wt %.
Claim 3
Dependent Claim 23 words
A solid state electronic device according to claim 1, wherein first aluminum alloy has a grain size set to 0.05 μm or less.
Claim 4
Dependent Claim 39 words
A solid state electronic device according to claim 1, wherein said conductive thin film consists of a first thin film of said Al alloy and a second thin film of pure aluminum, which are laminated in a multi-layer structure.
Claim 5
Dependent Claim 39 words
A solid state electronic device according to claim 2, wherein said conductive thin film consists of a first thin film of said Al alloy and a second thin film of pure aluminum, which are laminated in a multi-layer structure.
Claim 6
Dependent Claim 41 words
A solid state electronic device according to claim 1, wherein said conductive thin film consists of a first thin film of said Al alloy and a third thin film of a second Al alloy, which are laminated in a multi-layer structure.
Claim 7
Dependent Claim 41 words
A solid state electronic device according to claim 2, wherein said conductive thin film consists of a first thin film of said Al alloy and a third thin film of a second Al alloy, which are laminated in a multi-layer structure.
Claim 8
Dependent Claim 50 words
A solid state electronic device according to claim 1, wherein said substrate is made of ST-cut quartz, and said electrodes include a set of interdigital electrodes and a pair of grating reflectors provided on both sides of said interdigital electrodes, each grating reflector consisting of a plurality of metal strips.
Claim 9
Dependent Claim 59 words
A solid state electronic device according to claim 1, wherein said substrate is made of LiTaO 3 cut the crystal 36° rotated around the Y-axis thereof, and said electrodes include a set of electrodes consisting of a plurality of interdigital electrodes with different resonant frequencies connected in series and a shield electrode provided intermediately between said set of electrodes.

References Cited (Backward Citations)

JPS4922397A Cited
US4489250A Cited
US4775814A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1993-07-16 1994-01-15 1994-07-17 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1997-07-16 1998-01-15 1998-07-17 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2001-07-16 2002-01-15 2002-07-17 $7700.00 Window Closed / Lapsed

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