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US4936252A Expired / Lapsed US ⏱️ 0.0 years remaining

Equipment for manufacturing semiconductor devices

Assignee: Hitachi Ltd
•
Filing: 1988-04-11
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Granted: 1990-06-26
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Expires: 2008-04-11
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Abstract

Abstract An equipment for manufacturing semiconductor devices has: a reaction chamber in which a substrate to be processed is placed; means for evacuating the reaction chamber; means for introducing a reaction gas into the reaction chamber; means for applying polarized light to the surface of the substrate for the purpose of depositing a thin film on the surface of the substrate using a photochemical reaction between the light and the reaction gas; and means for adjusting the direction of polarization of the light so as to be substantially perpendicular to the longitudinal axis of a stepped circuit pattern present on the surface of the substrate for the purpose of flattening the circuit pattern.

Inventors

  • 👤 Yusuke Yajima
  • 👤 Hidekazu Okuhira
  • 👤 Kanji Tsujii
  • 👤 Seiichi Murayama
  • 👤 Akira Shintani
  • 👤 Yasuo Wada

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 06:31
CPC Classifications
C; C23; C23C; C23C16/00; C23C16/44; C23C16/48; C23C16/482; C23C16/04

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 154 words
An equipment for manufacturing semiconductor devices comprising a reaction chamber provided with a substrate stage upon which a substrate having a stepped circuit pattern to be processed is placed; means for evacuating said reaction chamber; means for introducing a reaction gas into said reaction chamber; means for applying linearly polarized light to the surface of said substrate to deposit a thin film on the surface of said substrate using a photochemical reaction between said light and said reaction gas; said light application means comprising a light source for supplying light and a polarizer for making uniform the direction of polarization of light emitted from said light source; and means for adjusting a direction of polarization of said light so that said direction of polarization is in a plane including both a normal direction with respect to a side surface of said stepped circuit pattern and an incident direction of said light to said substrate.
Claim 2
Dependent Claim 154 words
An equipment for manufacturing semiconductor devices comprising a reaction chamber provided with a substrate stage upon which a substrate having a stepped circuit pattern to be processed is placed; means for evacuating said reaction chamber; means for introducing a reaction gas into said reaction chamber; means for applying linearly polarized light to the surface of said substrate to deposit a thin film on the surface of said substrate using a photochemical reaction between said light and said reaction gas; said light application means comprising a light source for supplying light and a polarizer for making uniform the direction of polarization of light emitted from said light source; and means for adjusting a direction of polarization of said light so that said direction of polarization is in a plane including both a normal direction with respect to a side surface of said stepped circuit pattern and an incident direction of said light to said substrate.
Claim 3
Dependent Claim 37 words
An equipment for manufacturing semiconductor devices according to claim 1, wherein said adjustment means comprises a polarization rotator capable of rotating within a horizontal plane to adjust the direction of polarization of said light to said substrate.
Claim 4
Dependent Claim 38 words
An equipment for manufacturing semiconductor devices according to claim 2, wherein said adjustment means further comprises said substrate stage capable of rotating within a horizontal plane to adjust the direction of polarization of said light to said substrate.
Claim 5
Dependent Claim 44 words
An equipment for manufacturing semiconductor devices according to claim 1, wherein said adjustment means comprises a polarization rotator rotatable within a horizontal plane and said substrate stage rotatable within a horizontal plane to adjust the direction of polarization of said light to said substrate.

References Cited (Backward Citations)

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US4260649A Cited
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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1993-06-25 1993-12-25 1994-06-26 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1997-06-25 1997-12-25 1998-06-26 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2001-06-25 2001-12-25 2002-06-26 $7700.00 Window Closed / Lapsed

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