US4936252A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Equipment for manufacturing semiconductor devices
Assignee: Hitachi Ltd
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Filing: 1988-04-11
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Granted: 1990-06-26
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Expires: 2008-04-11
Abstract
Abstract An equipment for manufacturing semiconductor devices has: a reaction chamber in which a substrate to be processed is placed; means for evacuating the reaction chamber; means for introducing a reaction gas into the reaction chamber; means for applying polarized light to the surface of the substrate for the purpose of depositing a thin film on the surface of the substrate using a photochemical reaction between the light and the reaction gas; and means for adjusting the direction of polarization of the light so as to be substantially perpendicular to the longitudinal axis of a stepped circuit pattern present on the surface of the substrate for the purpose of flattening the circuit pattern.
Inventors
- 👤 Yusuke Yajima
- 👤 Hidekazu Okuhira
- 👤 Kanji Tsujii
- 👤 Seiichi Murayama
- 👤 Akira Shintani
- 👤 Yasuo Wada
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 02:03
CPC Classifications
C; C23; C23C; C23C16/00; C23C16/44; C23C16/48; C23C16/482; C23C16/04
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
154 words
An equipment for manufacturing semiconductor devices comprising a reaction chamber provided with a substrate stage upon which a substrate having a stepped circuit pattern to be processed is placed; means for evacuating said reaction chamber; means for introducing a reaction gas into said reaction chamber; means for applying linearly polarized light to the surface of said substrate to deposit a thin film on the surface of said substrate using a photochemical reaction between said light and said reaction gas; said light application means comprising a light source for supplying light and a polarizer for making uniform the direction of polarization of light emitted from said light source; and means for adjusting a direction of polarization of said light so that said direction of polarization is in a plane including both a normal direction with respect to a side surface of said stepped circuit pattern and an incident direction of said light to said substrate.
Claim 2
Dependent Claim
154 words
An equipment for manufacturing semiconductor devices comprising a reaction chamber provided with a substrate stage upon which a substrate having a stepped circuit pattern to be processed is placed; means for evacuating said reaction chamber; means for introducing a reaction gas into said reaction chamber; means for applying linearly polarized light to the surface of said substrate to deposit a thin film on the surface of said substrate using a photochemical reaction between said light and said reaction gas; said light application means comprising a light source for supplying light and a polarizer for making uniform the direction of polarization of light emitted from said light source; and means for adjusting a direction of polarization of said light so that said direction of polarization is in a plane including both a normal direction with respect to a side surface of said stepped circuit pattern and an incident direction of said light to said substrate.
Claim 3
Dependent Claim
37 words
An equipment for manufacturing semiconductor devices according to claim 1, wherein said adjustment means comprises a polarization rotator capable of rotating within a horizontal plane to adjust the direction of polarization of said light to said substrate.
Claim 4
Dependent Claim
38 words
An equipment for manufacturing semiconductor devices according to claim 2, wherein said adjustment means further comprises said substrate stage capable of rotating within a horizontal plane to adjust the direction of polarization of said light to said substrate.
Claim 5
Dependent Claim
44 words
An equipment for manufacturing semiconductor devices according to claim 1, wherein said adjustment means comprises a polarization rotator rotatable within a horizontal plane and said substrate stage rotatable within a horizontal plane to adjust the direction of polarization of said light to said substrate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-06-25 | 1993-12-25 | 1994-06-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-06-25 | 1997-12-25 | 1998-06-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-06-25 | 2001-12-25 | 2002-06-26 | $7700.00 | Window Closed / Lapsed |