Patent US4927697A successfully refreshed from Google Patents.
US4927697A
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Surface mounting leadless components on conductor pattern supporting substrates
Assignee: BAE Systems PLC
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Filing: 1988-11-28
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Granted: 1990-05-22
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Expires: 2008-11-28
Abstract
Abstract Flux residue drawn by capillary action into the small gap between a conductor pattern support e.g. a printed circuit board, and a leadless electronic component surface mounted on the support is hard to remove and may corrode the conductor pattern. Herein the component is fixed to the support by a pad of adhesive elastomer so as to give a larger and hence more easily cleanable gap between component and support and the component connector pads are coupled to the conductor pattern by way of solder pillars formed by pre-loading the component connector pads and the pattern with precisely defined amounts of solder and, e.g. during a vapor phase re-flow, causing the pre-loads to merge and form the solder pillars.
Inventors
- 👤 Peter F. Hill
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 13:08
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3442; H05K3/303; H05K3/305; H05K1/00; H05K1/02; H05K1/0271; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0133; H05K2201/06; H05K2201/068; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10636; H05K2201/10727; H05K2201/10954; H05K2201/10984; H05K2201/20; H05K2201/2036; H05K2203/00; H05K2203/08; H05K2203/087; H05K3/22; H05K3/26; H05K3/3494; H10; H10W; H10W72/00; H10W72/20; H10W72/281; H10W72/287; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052; Y10T156/1056; Y10T156/1062; Y10T156/1064; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24826; Y10T428/24917
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
58 words
An assembly of a conductor pattern supporting substrate and a leadless component comprising: a pad of adhesive material fixing the component to the substrate; solder pillars between connection pads of the component and the conductor pattern on the substrate further fixing the component to said substrate such that a stand-off distance formed between the component and the substrate.
Claim 2
Dependent Claim
58 words
An assembly of a conductor pattern supporting substrate and a leadless component comprising: a pad of adhesive material fixing the component to the substrate; solder pillars between connection pads of the component and the conductor pattern on the substrate further fixing the component to said substrate such that a stand-off distance formed between the component and the substrate.
Claim 3
Dependent Claim
19 words
The apparatus claimed in claim 1 wherein said distance is in the range from 0.003 inches to 0.025 inches.
Claim 4
Independent Claim
91 words
A method of mounting a leadless component on a conductor pattern supporting substrate, said method comprising the steps of: holding said component in position on the substrate by way of a pad of adhesive material between the component and the substrate; connecting connector pads of the leadless component by way of solder pillars to the conductor pattern on the substrate; and maintaining a stand-off distance between the component and the substrate so as to alleviate difficulties experienced when cleaning excess material from a space formed between the component and the substrate.
Claim 5
Independent Claim
91 words
A method of mounting a leadless component on a conductor pattern supporting substrate, said method comprising the steps of: holding said component in position on the substrate by way of a pad of adhesive material between the component and the substrate; connecting connector pads of the leadless component by way of solder pillars to the conductor pattern on the substrate; and maintaining a stand-off distance between the component and the substrate so as to alleviate difficulties experienced when cleaning excess material from a space formed between the component and the substrate.
Claim 6
Dependent Claim
23 words
A method as in claim 3, wherein said maintaining step includes maintaining said distance in a range from 0.003 inches to 0.025 inches.
Claim 7
Dependent Claim
23 words
A method as in claim 3, wherein said connecting step includes curing the adhesive and then reflow soldering the component to the substrate.
References Cited (Backward Citations)
GB2047973A
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EP0075890A2
Cited
EP0127682A1
Cited
EP0131492A1
Cited
GB2147148A
Cited
EP0150928A2
Cited
US4666545A
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US4755249A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-05-21 | 1993-11-20 | 1994-05-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-05-21 | 1997-11-20 | 1998-05-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-05-21 | 2001-11-20 | 2002-05-22 | $7700.00 | Window Closed / Lapsed |