Method of making a mounting base pad for semiconductor devices

Claim 1

In the method of fabricating mounting means for use in combination with solid-state semiconductive translating devices and which comprise a base pad having edge surfaces including opposed ends and opposed sides, and with flange walls coupled to opposed side edges of said base pad, and wherein said base pad and flange walls comprise a generally rigid laminate with a core having outer metal foil layers disposed on opposite surfaces thereof and co-extensive therewith, the core being composed of a thin layer of silicone base rubber, and a silicone base rubber mounting pad means being secured to the outer surface of said base pad, wherein said method comprises: (a) selecting and preparing an elongated strip of a generally rigid laminate with a silicone rubber core having a thickness of between about 8 and 12 mils and outer metal foil layers disposed on opposite surfaces thereof and co-extensive therewith, with the outer metal foil layers being selected from the group consisting of aluminum and copper and having a thickness of between about 2 and 200 mils; (b) forming a first pair of generally parallelly disposed score lines longitudinally along the surface of said elongated strip at a point spaced laterally inwardly from the outer edge surfaces thereof, and forming a second pair of parallelly disposed score lines transversely at regularly spaced intervals disposed score lines transversely at regularly spaced intervals of said strip to form a breaking-off line for said strip; and (c) applying an adherent and coherent film pad of silicone rubber to the outer surface of said elongated strip generally between said parallelly disposed score lines.