US4923928A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Thermosetting bismaleimide resin composition containing an adduct of a propenylphenol and an epoxy compound
Assignee: Cytec Technology Corp
•
Filing: 1988-02-18
•
Granted: 1990-05-08
•
Expires: 2008-02-18
Abstract
Abstract Prereact modifiers prepared by reacting a propenylphenol with an epoxy resin are useful in toughening heat curable bismaleimide resin systems so as to minimize impact produced damage, and which have exceptional gel times.
Inventors
- 👤 Jack D. Boyd
- 👤 Hong-Son Ryang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-10 00:38
CPC Classifications
C; C08; C08L; C08L63/00; C08G; C08G59/00; C08G59/02; C08G59/04; C08G59/06; C08G59/063; C08G59/14; C08G59/1433; C08G59/1438; C08G59/1444; C08L79/00; C08L79/04; C08L79/08; C08L79/085
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
105 words
A heat curable resin composition comprising: (a) a maleimide-group-containing, heat curable resin, and (b) a toughening amount of one or more prereact modifiers prepared by reacting a propenylphenol with an epoxy resin, and having the formula: ##STR4## wherein R 1 is selected from the group consisting of C 1 -C 4 lower alkyl, C 1 -C 4 halogenated alkyl, and aryl radicals; wherein m is 1 or 2; wherein R is a mononuclear or polynuclear aromatic hydrocarbon; wherein n is an integer from 2 to about 4; and wherein X is the residuum of an epoxy resin having an epoxy functionality of 2 to 4.
Claim 2
Dependent Claim
105 words
A heat curable resin composition comprising: (a) a maleimide-group-containing, heat curable resin, and (b) a toughening amount of one or more prereact modifiers prepared by reacting a propenylphenol with an epoxy resin, and having the formula: ##STR4## wherein R 1 is selected from the group consisting of C 1 -C 4 lower alkyl, C 1 -C 4 halogenated alkyl, and aryl radicals; wherein m is 1 or 2; wherein R is a mononuclear or polynuclear aromatic hydrocarbon; wherein n is an integer from 2 to about 4; and wherein X is the residuum of an epoxy resin having an epoxy functionality of 2 to 4.
Claim 3
Dependent Claim
13 words
The composition of claim 1 wherein R 1 is methyl, R is phenylene.
Claim 4
Dependent Claim
38 words
The composition of claim 2 wherein X is the residuum of an epoxy resin selected from the group consisting of the glycidyl ethers of 4,4,-dihydroxydiphenylmethane, the glycidyl ethers of 1,6-dihydroxynaphthalene, and the glycidyl eters of the phenolated dicyclopentadienes.
Claim 5
Dependent Claim
21 words
The heat-curable resin composition of claim 1 wherein said prereact comprises from 10 to about 50 weight percent of said composition.
Claim 6
Dependent Claim
21 words
The heat-curable resin composition of claim 2 wherein said prereact comprises from 10 to about 50 weight percent of said composition.
Claim 7
Dependent Claim
21 words
The heat-curable resin composition of claim 3 wherein said prereact comprises from 10 to about 50 weight percent of said composition.
Claim 8
Dependent Claim
21 words
The heat-curable resin composition of claim 1 wherein said prereact comprises from 30 to about 45 weight percent of said composition.
Claim 9
Dependent Claim
21 words
The heat-curable resin composition of claim 2 wherein said prereact comprises from 30 to about 45 weight percent of said composition.
Claim 10
Dependent Claim
21 words
The heat-curable resin composition of claim 3 wherein said prereact comprises from 30 to about 45 weight percent of said composition.
Claim 11
Dependent Claim
50 words
A heat-curable resin composition, comprising: (a) a maleimide-group-containing, heat-curable resin; and (b) a toughening amount of a prereact modifier having the formula ##STR5## wherein the portion in brackets is the residuum of a difunctional epoxy resin derived from a dihydric alcohol or phenol containing an organic group R 2 .
Claim 12
Dependent Claim
50 words
A heat-curable resin composition, comprising: (a) a maleimide-group-containing, heat-curable resin; and (b) a toughening amount of a prereact modifier having the formula ##STR5## wherein the portion in brackets is the residuum of a difunctional epoxy resin derived from a dihydric alcohol or phenol containing an organic group R 2 .
Claim 13
Dependent Claim
30 words
The composition of claim 10 wherein the bracketed portion is the residue of an epoxy resin selected from the group consisting of the glycidyl ethers of 1,6-dihydroxynaphthalene and phenolated dicyclopentadienes.
Claim 14
Dependent Claim
22 words
The heat-curable resin composition of claim 1 wherein the 177° C. gel time of said resin is less than about 20 minutes.
Claim 15
Dependent Claim
22 words
The heat-curable resin composition of claim 2 wherein the 177° C. gel time of said resin is less than about 20 minutes.
Claim 16
Dependent Claim
19 words
The heat-curable resin composition of claim 11 wherein the 177° C. gel time is less than about 10 minutes.
References Cited (Backward Citations)
US4127615A
Cited
US4130600A
Cited
US4273889A
Cited
US4384129A
Cited
US4708996A
Cited
US4544731A
Cited
US4579887A
Cited
EP0230741A2
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-05-07 | 1993-11-06 | 1994-05-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-05-07 | 1997-11-06 | 1998-05-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-05-07 | 2001-11-06 | 2002-05-08 | $7700.00 | Window Closed / Lapsed |