Electrical connections via unidirectional conductive elastomer for pin carrier outside lead bond

Claim 1

A PGA integrated circuit package comprising: a package substrate (12) being formed of a generally rectangular configuration and having top and bottom surfaces; a plurality of metal terminal pins (24) extending from the bottom surface of said package substrate (12) and protruding slightly above the top surface thereof to form terminal pin ends (30); a unidirectional electrically conductive elastomeric layer (14) being deposited over said substrate (12) for engagement with said terminal pin ends (30); a plastic tape layer (16) having a centrally disposed semiconductor chip (18), said tape layer and chip being deposited over said elastomeric layer (14), said tape layer (16) having a metalized trace pattern deposited on its bottom surface, said metalized trace pattern terminating at its outer ends with spaced apart metal terminal pads (32) which are in substantially vertical alignment with said respective terminal pin ends (30); said terminal pads (32) including a dimple (36) formed on its bottom surface to create contact points to facilitate proper electrical contact; an insulator layer (20) being deposited over said tape layer (16) and said semiconductor chip (18); a cover member (22) having a generally rectangular configuration and being deposited over said insulator layer (20); and said insulator (16) and said cover member (22) being compressed to establish only electrical conductive paths in the vertical direction between the dimples on said terminal pads and said respective terminal pin ends through said elastomeric layer (14) due to the pressurized contact points.