US4912600A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit packaging and cooling
Assignee: Auburn University
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Filing: 1988-09-07
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Granted: 1990-03-27
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Expires: 2008-09-07
Abstract
Abstract A packaging and cooling structure for integrated circuit chips in electronic equipment is provided in which the chips are resiliently mounted on wafers which are centrally located in chambers within a housing. A liquid coolant is forced through orifices to spray the coolant on the wafers behind the chips and on the chips themselves providing both high velocity convective cooling and phase change boiling heat transfer. A temperature sensor and control are provided to sense and control the temperature within the electronic equipment.
Inventors
- 👤 Richard C. Jaeger
- 👤 John S. Goodling
- 👤 Norman V. Williamson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 09:56
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/40; H10W40/47; H10W40/475; H05; H05K; H05K7/00; H05K7/20; H05K7/2029; H05K7/20345; Y; Y10; Y10S; Y10S165/00; Y10S165/908
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
183 words
An integrated circuit assembly comprising: A housing defining at least one chamber therein; Means within said housing to support a base member within the central region of said chamber; One or more integrated circuit chips carried on said base member and in heat conducting contact therewith; Orifices positioned within said housing in regions adjacent to said one or more integrated circuit chips; Means to deliver a cooling fluid through said orifices under pressure so that it is directed as a jet of fluid against said base member in the region of said one or more integrated circuit chips; Means to return said cooling fluid to a cooling system to extract heat carried by said fluid from said chamber; Said cooling fluid being directed against said one or more integrated circuit chips resulting in the boiling of at least some of said fluid; Said orifices being positioned in pairs on opposite sides of said base member; Said support means are non-rigid; and Said base member is substantially flat and extends beyond said chamber to enable electrical connections to be made to the ends thereof.
Claim 2
Dependent Claim
183 words
An integrated circuit assembly comprising: A housing defining at least one chamber therein; Means within said housing to support a base member within the central region of said chamber; One or more integrated circuit chips carried on said base member and in heat conducting contact therewith; Orifices positioned within said housing in regions adjacent to said one or more integrated circuit chips; Means to deliver a cooling fluid through said orifices under pressure so that it is directed as a jet of fluid against said base member in the region of said one or more integrated circuit chips; Means to return said cooling fluid to a cooling system to extract heat carried by said fluid from said chamber; Said cooling fluid being directed against said one or more integrated circuit chips resulting in the boiling of at least some of said fluid; Said orifices being positioned in pairs on opposite sides of said base member; Said support means are non-rigid; and Said base member is substantially flat and extends beyond said chamber to enable electrical connections to be made to the ends thereof.
Claim 3
Dependent Claim
38 words
The integrated circuit assembly of claim 1 wherein said housing defines multiple chambers and said means to deliver a cooling fluid and means to return said cooling fluid from said multiple chambers includes manifolds attached to said housing.
Claim 4
Dependent Claim
33 words
The integrated circuit assembly of claim 1 wherein the means to deliver a cooling fluid is a manifold connected to multiple chambers in the housing and to multiple chambers in an adjacent housing.
Claim 5
Dependent Claim
13 words
The integrated circuit assembly of claim 1 wherein said base member is silicon.
Claim 6
Dependent Claim
22 words
An integrated circuit assembly of claim 4 wherein portions of the base member are etched anistropically to increase the surface area thereof.
Claim 7
Dependent Claim
19 words
An integrated circuit assembly of claim 5 wherein said etching forms pyramids in cavities of said silicon base member.
Claim 8
Dependent Claim
22 words
An integrated circuit assembly of claim 5 wherein at least one temperature sensor is positioned within said chamber to monitor the temperature.
Claim 9
Dependent Claim
19 words
An integrated circuit assembly of claim 7 wherein said temperature sensor provides a signal to control the cooling fluid.
Claim 10
Dependent Claim
17 words
An integrated circuit assembly of claim 7 wherein said temperature sensor is mounted on said base member.
Claim 11
Dependent Claim
42 words
An integrated circuit assembly of claim 8 wherein said temperature sensor is connected to a switch to disconnect the power to said one or more integrated circuit chips in the event the temperature sensed by said temperature sensor exceeds a predetermined value.
Claim 12
Dependent Claim
65 words
An integrated circuit assembly of claim 4 wherein at least one temperature sensor is mounted on said base member to provide a signal to control the cooling fluid in accordance with said temperature sensor and to activate a switch to disconnect the power to said one or more integrated circuit chips in the event the temperature sensed by said temperature sensor exceeds a predetermined amount.
Claim 13
Dependent Claim
20 words
The integrated circuit assembly of claim 11 wherein said at least one temperature sensor is deposited on said base member.
Claim 14
Dependent Claim
13 words
The integrated circuit assembly of claim 12 wherein said base member is silicon.
Claim 15
Dependent Claim
20 words
The integrated circuit assembly of claim 13 wherein said at least one temperature sensor is a thin film of metal.
Claim 16
Dependent Claim
37 words
The integrated circuit assembly of claim 1 wherein said base member divides said chamber into two substantially equal smaller chambers, and a breather passage through said base member equalizes the pressure in said substantially equal smaller chambers.
Claim 17
Dependent Claim
59 words
The integrated circuit assembly of claim 1 wherein said support means includes at least two separable support members cooperating with an O-ring to provide said non-rigid support means to said base member within said housing, and fastening means to secure said support members into engagement with said O-ring, thereby facilitating the assembly and disassembly of said integrated circuit assembly.
References Cited (Backward Citations)
US2906103A
Cited
US4138692A
Cited
SU658799A1
Cited
EP0091733A1
Cited
US4407136A
Cited
JPS60136349A
Cited
SU1352557A1
Cited
US4729424A
Cited
US4750086A
Cited
US4772980A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-03-26 | 1993-09-25 | 1994-03-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-03-26 | 1997-09-25 | 1998-03-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-03-26 | 2001-09-25 | 2002-03-27 | $7700.00 | Window Closed / Lapsed |