Patent US4412246A successfully refreshed from Google Patents.
Patent US2073758A successfully refreshed from Google Patents.
Patent US4910094A successfully refreshed from Google Patents.
US4910094A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multilayer plating method and multilayer plated film
Assignee: Hitachi Ltd
•
Filing: 1988-09-22
•
Granted: 1990-03-20
•
Expires: 2008-09-22
Abstract
Abstract A primary plated film is formed on the surface of underlayer metal. Next, the heating process is performed and diffusion layers of the underlayer metal and primary plated film are formed. A mechanical abrasion is performed to the surface of the primary plated film, thereby exposing the diffusion layers. Thereafter, a secondary plated film is formed on the exposed diffusion layers. With this multilayer plating method, even in the case of the dissimilar metals, a uniform multilayer plated film of a good adhesive property is derived.
Inventors
- 👤 Tetsuya Watanabe
- 👤 Masao Sekibata
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 15:06
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/22; H05K3/24; H05K3/245; H05K3/246; B; B23; B23K; B23K20/00; B23K20/22; B23K20/233; C; C23; C23C; C23C26/00; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/60; H10W70/62; H10W70/66; H05K1/00; H05K1/02; H05K1/09; H05K1/092; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12458; Y10T428/12493; Y10T428/12771; Y10T428/12806; Y10T428/12826; Y10T428/1284; Y10T428/12861; Y10T428/12944
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
73 words
A multilayer plating method comprising the steps of: forming a primary plated film onto a surface of underlayer metal; performing a heating process thereafter; forming a diffusion layer near a boundary surface between said underlayer metal and said primary plated film by a mutual diffusion; executing a mechanical abrasion to the surface of said primary plated film thereafter; exposing said diffusion layer; and forming a secondary plated film onto said exposed diffusion layer.
Claim 2
Dependent Claim
73 words
A multilayer plating method comprising the steps of: forming a primary plated film onto a surface of underlayer metal; performing a heating process thereafter; forming a diffusion layer near a boundary surface between said underlayer metal and said primary plated film by a mutual diffusion; executing a mechanical abrasion to the surface of said primary plated film thereafter; exposing said diffusion layer; and forming a secondary plated film onto said exposed diffusion layer.
Claim 3
Dependent Claim
20 words
A method according to claim 1, wherein said secondary plated metal is made of metal dissimilar to said underlayer metal.
Claim 4
Dependent Claim
19 words
A method according to claim 1, wherein a mechanical abrasion is executed to the surface of said underlayer metal.
Claim 5
Dependent Claim
23 words
A method according to claim 3, wherein an alumina honing is used for the mechanical abrasion of the surface of said underlayer metal.
Claim 6
Dependent Claim
24 words
A method according to claim 1, wherein an alumina honing is used for the mechanical abrasion of the surface of said primary plated film.
Claim 7
Dependent Claim
19 words
A method according to claim 1, wherein the heating process is reexecuted after said secondary plated film was formed.
Claim 8
Dependent Claim
37 words
A method according to claim 1, wherein a wiring metalized layer made of tungsten on a module substrate is used as underlayer metal, and nickel is used as the primary plated film and the secondary plated film.
Claim 9
Dependent Claim
33 words
A method according to claim 7, wherein a thickness of film of nickel serving as the secondary plated film is set to a value within a range from 2 μm to 5 μm.
Claim 10
Dependent Claim
66 words
A multilayer plated film which is formed on underlayer metal and comprises: a diffusion layer which is formed by mutually diffusing said underlayer metal and a primary plated film formed on the surface of the underlayer metal by a heating process and in which an upper surface of said diffusion layer is a mechanically abraded surface; and a secondary plated film formed on the diffusion layer.
Claim 11
Dependent Claim
66 words
A multilayer plated film which is formed on underlayer metal and comprises: a diffusion layer which is formed by mutually diffusing said underlayer metal and a primary plated film formed on the surface of the underlayer metal by a heating process and in which an upper surface of said diffusion layer is a mechanically abraded surface; and a secondary plated film formed on the diffusion layer.
Claim 12
Dependent Claim
36 words
A multilayer plated film according to claim 9, wherein a wiring metalized layer made of tungsten on a module substrate constructs the underlayer metal, and nickel constructs the primary plated film and the secondary plated film.
Claim 13
Dependent Claim
35 words
A multilayer plated film according to claim 10, wherein a thickness of film of nickel serving as the secondary plated film is set to a value within a range from 2 μm to 5 μm.
References Cited (Backward Citations)
US3963455A
Cited
JPS58204194A
Cited
US4626479A
Cited
US4685030A
Cited
US4752499A
Cited
US4655884A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-03-19 | 1993-09-18 | 1994-03-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-03-19 | 1997-09-18 | 1998-03-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-03-19 | 2001-09-18 | 2002-03-20 | $7700.00 | Window Closed / Lapsed |