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Process for etching light-shielding thin film

Assignee: Seiko Precision Inc
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Filing: 1988-12-27
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Granted: 1990-01-09
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Expires: 2008-12-27
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Abstract

Abstract A light shielding thin film is provided on a light transmitting substrate, and the film is covered by a photoresist. The photoresist is exposed and developed to form a pattern, and the film is etched using the pattern as a mask. The pattern is then exposed through the substrate, using the film as a mask, the pattern then being developed to form a pattern of reduced size. The film is then etched using the reduced size pattern as a mask.

Inventors

  • 👤 Noboru Motai
  • 👤 Sakae Tanaka
  • 👤 Yoshiaki Watanabe
  • 👤 Katsuo Shirai
  • 👤 Yaeko Suzuki
  • 👤 Yoshihisa Ogiwara
  • 👤 Kazunori Saito
  • 👤 Keiko Shibuki

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 04:32
CPC Classifications
H; H10; H10D; H10D30/00; H10D30/01; H10D30/021; H10D30/031; H10D30/0312; H10D30/0316; H10D30/0321; H10D30/60; H10D30/67; H10D30/6704; H10D30/6723; H10D64/00; H10D64/01; H10D64/013; H10P; H10P76/00; H10P76/20; H10P76/204; H10P76/2041

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 121 words
A process for etching a light-shielding thin film which comprises the steps of: applying a photoresist to a light-shielding thin film formed on a light-transmitting substrate; exposing the photoresist and then developing the exposed photoresist, thereby forming a photoresist pattern of desired shape; etching the light-shielding thin film by using the photoresist pattern as a mask, thereby forming a light-shielding thin film pattern matching the photoresist pattern; exposing the photoresist pattern through the reverse side of the light-transmitting substrate by using the light-shielding thin film pattern as a mask and then developing the exposed photoresist pattern, thereby reducing the size of the photoresist pattern; and etching the light-shielding thin film pattern by using the reduced size photoresist pattern as a mask.
Claim 2
Dependent Claim 121 words
A process for etching a light-shielding thin film which comprises the steps of: applying a photoresist to a light-shielding thin film formed on a light-transmitting substrate; exposing the photoresist and then developing the exposed photoresist, thereby forming a photoresist pattern of desired shape; etching the light-shielding thin film by using the photoresist pattern as a mask, thereby forming a light-shielding thin film pattern matching the photoresist pattern; exposing the photoresist pattern through the reverse side of the light-transmitting substrate by using the light-shielding thin film pattern as a mask and then developing the exposed photoresist pattern, thereby reducing the size of the photoresist pattern; and etching the light-shielding thin film pattern by using the reduced size photoresist pattern as a mask.
Claim 3
Dependent Claim 24 words
A process for etching a light-shielding thin film as claimed in claim 1 comprising using a metal thin film as the light-shielding thin film.
Claim 4
Dependent Claim 24 words
A process for etching a light-shielding thin film as claimed in claim 1 comprising using a semiconductor thin film as the light-shielding thin film.
Claim 5
Dependent Claim 24 words
A process for etching a light-shielding thin film as claimed in claim 3 comprising using a silicon thin film as the semiconductor thin film.

References Cited (Backward Citations)

US4514252A Cited
US4544445A Cited
US4715930A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1993-01-08 1993-07-10 1994-01-09 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1997-01-08 1997-07-10 1998-01-09 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2001-01-08 2001-07-10 2002-01-09 $7700.00 Window Closed / Lapsed

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