Patent US4889275A successfully refreshed from Google Patents.
US4889275A
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US
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Method for effecting solder interconnects
Assignee: Motorola Solutions Inc
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Filing: 1988-11-02
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Granted: 1989-12-26
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Expires: 2008-11-02
Abstract
Abstract A method for effecting high density solder interconnects between a substrate and at least one metalized film having through holes therein is provided. Solder is first applied to metalized portions of the substrates and the solder is then subject to a reflow process to provide reflowed solder. Pressure is applied to the reflowed solder during a second reflow process to provide prestressed or shaped solder. The metalized film is then positioned with at least one metalized portion adjacent to the shaped solder. Heat, as from a laser, is directed through the through holes in the film to melt the solder and form solder interconnections between the substrate and the metalized film.
Inventors
- 👤 William B. Mullen, III
- 👤 Douglas W. Hendricks
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 12:22
CPC Classifications
G; G02; G02B; G02B6/00; G02B6/44; G02B6/4439; G02B6/444; G02B6/4441; G02B6/4442; B; B23; B23K; B23K1/00; B23K1/20; B23K31/00; H; H01; H01R; H01R43/00; H01R43/02; H01R43/0221; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/36; H05K3/361; H05K3/363; H10; H10N; H10N30/00; H10N30/01; H10N30/06; B23K2101/00; B23K2101/36; B23K2101/40; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09709; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10666; H05K2203/00; H05K2203/02; H05K2203/0278; H05K2203/04; H05K2203/043; H05K2203/10; H05K2203/107; H05K3/3494
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
71 words
A method of forming solder interconnects, comprising the steps of: applying solder to metalized portions of a substrate, applying pressure to the solder during a reflow process to prestress the the solder, positioning at least a metalized portion of a film having through holes therein adjacent to the prestressed solder, applying heating energy through the holes to melt the solder and form solder interconnections between the substrate and the metalized film.
Claim 2
Independent Claim
71 words
A method of forming solder interconnects, comprising the steps of: applying solder to metalized portions of a substrate, applying pressure to the solder during a reflow process to prestress the the solder, positioning at least a metalized portion of a film having through holes therein adjacent to the prestressed solder, applying heating energy through the holes to melt the solder and form solder interconnections between the substrate and the metalized film.
Claim 3
Dependent Claim
23 words
A method of forming solder interconnects as defined in claim 1 wherein after applying solder to the metalized portions the solder is reflowed.
Claim 4
Dependent Claim
19 words
A method of forming solder interconnects as defined in claim 1, wherein solder is printed on the metalized portions.
Claim 5
Dependent Claim
20 words
A method of forming solder interconnects as defined in claim 1, wherein solder paste is applied to the metalized portions.
Claim 6
Dependent Claim
23 words
A method of forming solder interconnects as defined in claim 1, wherein laser energy is directed through the holes to melt the solder.
Claim 7
Dependent Claim
26 words
A method of forming solder interconnects as defined in claim 1, wherein a second metalized film is similarly soldered to a second side of the substrate.
Claim 8
Dependent Claim
17 words
A method of forming solder interconnects as defined in claim 1, wherein the metalized film is polyimide.
Claim 9
Independent Claim
91 words
A method of forming solder interconnects comprising the steps of: applying solder to metalized portions of a substrate, reflowing the solder to provide reflowed solder, applying pressure to the reflowed solder during a second reflow process to provide shaped solder, positioning a metalized film having through holes therein against the shaped solder such that at least one metalized portion of the film is adjacent to the shaped solder, and applying laser heating energy through the holes to melt the solder and form solder interconnections between the substrate and the metalized film.
Claim 10
Independent Claim
91 words
A method of forming solder interconnects comprising the steps of: applying solder to metalized portions of a substrate, reflowing the solder to provide reflowed solder, applying pressure to the reflowed solder during a second reflow process to provide shaped solder, positioning a metalized film having through holes therein against the shaped solder such that at least one metalized portion of the film is adjacent to the shaped solder, and applying laser heating energy through the holes to melt the solder and form solder interconnections between the substrate and the metalized film.
References Cited (Backward Citations)
US3589591A
Cited
US3713575A
Cited
US3926360A
Cited
US4319708A
Cited
JPS5574147A
Cited
US4412642A
Cited
US4562637A
Cited
US4661192A
Cited
GB2179578A
Cited
US4752027A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-12-25 | 1993-06-26 | 1993-12-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-12-25 | 1997-06-26 | 1997-12-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-12-25 | 2001-06-26 | 2001-12-26 | $7700.00 | Window Closed / Lapsed |