Cooling device for a sputter target and source

Claim 2

An assembly for use in a deposition apparatus, comprising a source of material to be deposited having a surface, a cathode having a surface disposed in contact with the surface of said source, and coupling means comprising at least one annular member or segment thereof disposed between said cathode and said source, said annular member or segment thereof extending into a corresponding recessed region within one of said surfaces, said recessed region bound by a recessed wall surface arranged normal to said surface of said source and said cathode, said annular member or segment thereof having an upstanding wall surface extending into said recessed region and arranged parallel to said recessed wall surface, said upstanding wall surface engaging said recessed wall surface within said recessed region upon expansion of said source upon radial heating thereof for increasing the thermal coupling between said cathode and said source and for thermally securing said source to said cathode during the operation of said cathode.

Claim 3

The assembly of claim 1, wherein said coupling means includes a member projecting from said source, said cathode having said recessed region facing said source for receiving said member, said member and said recessed region being configured so that said member expands against said cathode upon heating of said source.

Claim 4

The assembly of claim 1, wherein said coupling means includes a member projecting from said cathode, said source having said recessed region facing said cathode for receiving said member, said member and said recessed region being configured so that said source expands against said member upon heating of said source.

Claim 5

The assembly of claim 3, wherein said coupling means comprises said annular member and said recessed region comprises a first annular recess.

Claim 6

The assembly of claim 4, wherein said annular member includes a base, said annular member being disposed substantially perpendicularly to said base.

Claim 7

The assembly of claim 5, wherein said cathode includes a second annular recess facing said first annular recess, said base being disposed in said second annular recess and said annular member being disposed in said first annular recess.

Claim 8

The assembly of claim 3, wherein said coupling means comprises a plurality of annular members concentrically arranged, and said recessed region comprising a corresponding first plurality of annular recesses each having one of said plurality of annular members disposed therein.

Claim 9

The assembly of claim 7, wherein said plurality of annular members each include a base, said annular members being disposed substantially perpendicular to a respective base.

Claim 10

The assembly of claim 8, wherein said cathode includes a second plurality of annular recesses, the bases of said plurality of annular members being disposed in, respectively, said second plurality of annular recesses and the remaining portion of said plurality of annular members being disposed in, respectively, said first plurality of annular recesses.

Claim 11

The assembly of claim 9, wherein said plurality of annular member are individually disposed within said source at preselected regions corresponding to locations of preselected values of power flux.

Claim 12

The assembly of claim 3, wherein said coupling means comprises said corresponding segment, and said recessed region comprises a recess configured as a segment of an annulus.

Claim 13

The assembly of claim 11, wherein said segment comprises a base and the remaining portion of said member being disposed substantially perpendicularly to said base, said cathode including a recess configured as a segment of an annulus, said base being disposed in said recess of said cathode, and said remaining portion of said member being disposed in said recess of said source.

Claim 14

The assembly of claim 1, wherein said coupling means is arranged at a preselected region corresponding to a location of a preselected value of power flux.

Claim 15

The assembly of claim 1, wherein said source comprises a target.

Claim 16

The assembly of claim 1, wherein said source includes a first planar surface portion, said cathode includes a second planar surface portion disposed against said first planar surface portion, and said annular member or segment thereof includes a member of rectangular cross-section projecting away from one of said surface portions.

Claim 17

The assembly of claim 15, wherein said recessed region is of corresponding rectangular cross-section extending within another of said surface portions for releasably receiving said member so as to maintain said first and second planar surface portions disposed against each other.

Claim 18

The assembly of claim 16, wherein said upstanding wall surface is arranged transverse to said first and second planar surface portions, said recessed region defined by at least one of said recessed wall surface arranged transverse to said first and second planar surface portions, whereby the radial expansion of said source causing engagement of said upstanding wall surface of said member with said recessed wall surface of said recessed region for increasing the thermal coupling between said source and said electrode.

Claim 19

The assembly of claim 17, wherein the radial expansion of said source causes engagement of said upstanding wall surface of said member with said recessed wall surface of said recessed region from a location adjacent said first and second planar surface portions to the free end of said member for increasing the thermal coupling between said source and said cathode.

Claim 20

A deposition apparatus comprising a source of material to be deposited having a surface a cathode having a surface disposed in contact with the surface of said source, coupling means comprising at least one annular member or segment thereof disposed between said cathode and said source, said annular member or segment thereof extending into a corresponding recessed region within one of said surfaces, said recessed region bound by a recessed wall surface arranged normal to said surfaces of said source and said cathode, said annular member or segment thereof having an upstanding wall surface extending into said recessed region and arranged parallel to said recessed wall surface, said upstanding wall surface engaging said recessed wall surface within said recessed region upon radial expansion of said source upon heating thereof for increasing the thermal coupling between said cathode and said source and for thermally securing said source to said cathode during the operation of said cathode, means coupled to said source for removal of material to be deposited, mounting means for mounting a workpiece for receiving a layer of said material, and a housing for receiving said source, said cathode, said coupling means and said mounting means.

Claim 21

A deposition apparatus comprising a source of material to be deposited having a surface a cathode having a surface disposed in contact with the surface of said source, coupling means comprising at least one annular member or segment thereof disposed between said cathode and said source, said annular member or segment thereof extending into a corresponding recessed region within one of said surfaces, said recessed region bound by a recessed wall surface arranged normal to said surfaces of said source and said cathode, said annular member or segment thereof having an upstanding wall surface extending into said recessed region and arranged parallel to said recessed wall surface, said upstanding wall surface engaging said recessed wall surface within said recessed region upon radial expansion of said source upon heating thereof for increasing the thermal coupling between said cathode and said source and for thermally securing said source to said cathode during the operation of said cathode, means coupled to said source for removal of material to be deposited, mounting means for mounting a workpiece for receiving a layer of said material, and a housing for receiving said source, said cathode, said coupling means and said mounting means.

Claim 22

The deposition apparatus of claim 19, wherein said coupling means includes a member projecting from said source, said cathode having said recessed region facing said source for receiving said member, said member and said recessed region being configured so that said member expands against said cathode upon heating of said source.

Claim 23

The deposition apparatus of claim 19, wherein said coupling means includes a member projecting from said cathode, said source having said recessed region facing said cathode for receiving said member, said member and said recessed region being configured so that said source expands against said member upon heating of said source.

Claim 24

The deposition apparatus of claim 21, wherein said coupling means comprises said annular member and said recessed region comprises a first annular recess.

Claim 25

The deposition apparatus of claim 22, wherein said annular member includes a base, said annular member being disposed substantially perpendicularly to said base.

Claim 26

The deposition apparatus of claim 23, wherein said cathode includes a second annular recess facing said first annular recess, said base being disposed in said second annular recess and said annular member being disposed in said first annular recess.

Claim 27

The deposition apparatus of claim 21, wherein said coupling means comprises a plurality of annular members concentrically arranged, and said recessed region comprising a corresponding first plurality of annular recesses each having one of said plurality of annular members disposed therein.

Claim 28

The deposition apparatus of claim 25, wherein said plurality of annular members each include a base, said annular members being disposed substantially perpendicularly to a respective base.

Claim 29

The deposition apparatus of claim 26, wherein said cathode includes a second plurality of annular recesses, the bases of said plurality of annular members being disposed in, respectively, said second plurality of annular recesses, and the remaining portion of said plurality of annular members being disposed in, respectively, said first plurality of annular recesses.

Claim 30

The deposition apparatus of claim 27, wherein said plurality of annular members are individually disposed within said source at preselected regions corresponding to locations of preselected values of power flux.

Claim 31

The deposition apparatus of claim 21, wherein said coupling means comprises said segment, and said recessed region comprises a recess configured as a corresponding segment of an annulus.

Claim 32

The deposition apparatus of claim 29, wherein said segment comprises a base and the remaining portion of said member being disposed substantially perpendicularly to said base, said cathode including a recess configured as a segment of an annulus, said base being disposed in said recess of said cathode, and said remaining portion of said member being disposed in said recess of said source.

Claim 33

The deposition apparatus of claim 19, wherein said coupling means is arranged at a preselected region corresponding to a location of a preselected value of power flux.

Claim 34

The deposition apparatus of claim 19, wherein said source comprises a target.

Claim 35

The deposition apparatus of claim 19, wherein said source includes a first planar surface portion, said cathode includes a second planar surface portion disposed against said first planar surface portion, and said annular member or segment thereof includes a member of rectangular cross-section projecting away from one of said surface portions.

Claim 36

The deposition apparatus of claim 33, wherein said recessed region is of corresponding rectangular crosssection extending within another of said surface portions for releasably receiving said member so as to maintain said first and second planar surface portions disposed against each other.

Claim 37

The deposition apparatus of claim 34, wherein said upstanding wall surface is arranged transverse to said first and second planar surface portions, said recessed region defined by at least one of said recessed wall surface arranged transverse to said first and second planar surface portions, whereby the radial expansion of said source causing engagement of said upstanding wall surface of said member with said recessed wall surface of said recessed region for increasing the thermal coupling between said source and said cathode.

Claim 38

The deposition apparatus of claim 35, wherein the radial expansion of said source causes engagement of said upstanding wall surface of said member with said recessed wall surface of said recessed region from a location adjacent said first and second planar surface portions to the free end of said member for increasing the thermal coupling between said source and said cathode.