US4885047A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for photoresist stripping
Assignee: Fusion Systems Corp
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Filing: 1988-01-11
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Granted: 1989-12-05
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Expires: 2008-01-11
Abstract
Abstract An apparatus for rapidly stripping a photoresist which utilizes an oxidizing fluid such as ozone. A very thin layer of oxidizing fluid of four millimeters or less is flowed over the photoresist. The fluid flows at high velocity over the resist, while the resist is heated. Additionally, the resist may be irradiated with ultraviolet radiation at an irradiance of at least about 800 milliwatts/cm 2 .
Inventors
- 👤 Michael G. Ury
- 👤 John C. Matthews
- 👤 Stuart N. Rounds
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 22:40
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/26; G03F7/42; Y; Y10; Y10S; Y10S134/00; Y10S134/902
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
133 words
An apparatus for stripping a layer of photoresist from a substrate made of a different material on which said photoresist layer is disposed, comprising, means for holding said substrate on which said photoresist layer is disposed, means for disposing a plane surface adjacent said photoresist layer but separated therefrom so as to create a narrow gap of four millimeters or less between said plane surface and said photoresist layer, means for feeding oxidizing fluid to said narrow gap to cause a thin layer of said oxidizing fluid of four millimeters or less to flow over said photoresist layer, means for maintaining said means for holding said substrate and said plane surface in stationary relationship to each other while said stripping occurs, and means for heating said substrate to a temperature over 200° C.
Claim 2
Independent Claim
133 words
An apparatus for stripping a layer of photoresist from a substrate made of a different material on which said photoresist layer is disposed, comprising, means for holding said substrate on which said photoresist layer is disposed, means for disposing a plane surface adjacent said photoresist layer but separated therefrom so as to create a narrow gap of four millimeters or less between said plane surface and said photoresist layer, means for feeding oxidizing fluid to said narrow gap to cause a thin layer of said oxidizing fluid of four millimeters or less to flow over said photoresist layer, means for maintaining said means for holding said substrate and said plane surface in stationary relationship to each other while said stripping occurs, and means for heating said substrate to a temperature over 200° C.
Claim 3
Dependent Claim
22 words
The apparatus of claim 1 wherein said means for heating heats said substrate to a temperature of about 260° C. or above.
Claim 4
Dependent Claim
19 words
The apparatus of claim 2 wherein said means for heating heats said substrate to a temperature above 300° C.
Claim 5
Dependent Claim
22 words
The apparatus of claim 1 wherein said means for heating heats said substrate to a temperature of about 320° C. or above.
Claim 6
Dependent Claim
15 words
The apparatus of claim 1 wherein said narrow gap is about two millimeters or less.
Claim 7
Dependent Claim
15 words
The apparatus of claim 1 wherein said narrow gap is less than about 0.6 millimeters.
Claim 8
Dependent Claim
15 words
The apparatus of claim 1 wherein said oxidizing fluid is a gaseous medium containing ozone.
Claim 9
Independent Claim
144 words
An apparatus for stripping a layer of photoresist from a substrate made of a different material on which said photoresist layer is disposed, comprising, means for holding said substrate on which said photoresist layer is disposed, means for disposing a plane surface adjacent said photoresist layer but separated therefrom so as to create a narrow gap of four millimeters or less between said plane surface and said photoresist layer, means for supplying ozone at a concentration of 4% or greater, means for feeding said ozone to said narrow gap to cause a thin layer of said oxidizing fluid of four millimeters or less to flow over said photoresist layer, means for maintaining said means of holding said substrate and said plane surface in stationary relationship to each other while said stripping occurs, and means for heating said substrate to a temperature over 200° C.
Claim 10
Independent Claim
144 words
An apparatus for stripping a layer of photoresist from a substrate made of a different material on which said photoresist layer is disposed, comprising, means for holding said substrate on which said photoresist layer is disposed, means for disposing a plane surface adjacent said photoresist layer but separated therefrom so as to create a narrow gap of four millimeters or less between said plane surface and said photoresist layer, means for supplying ozone at a concentration of 4% or greater, means for feeding said ozone to said narrow gap to cause a thin layer of said oxidizing fluid of four millimeters or less to flow over said photoresist layer, means for maintaining said means of holding said substrate and said plane surface in stationary relationship to each other while said stripping occurs, and means for heating said substrate to a temperature over 200° C.
Claim 11
Dependent Claim
51 words
The apparatus of claim 1 or 8, further comprising means for exposing the photoresist layer to ultraviolet radiation of an irradiance of at least 800 milliwatts/cm 2 while said substrate is heated and said oxidizing fluid is transported over said photoresist layer, said means for exposing comprising a focussed ultraviolet source.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-12-04 | 1993-06-05 | 1993-12-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-12-04 | 1997-06-05 | 1997-12-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-12-04 | 2001-06-05 | 2001-12-05 | $7700.00 | Window Closed / Lapsed |