Semiconductor device having parallel-connected, self turn-off type semiconductor elements

Claim 1

A semiconductor device having parallel-connected, self turn-off semiconductor elements, comprising: (a) a package for packaging self turn-off type semiconductor elements, said package including a metallic cooling fin, an insulating side case provided on one principal surface of said cooling fin, and an insulating covering case disposed on said side case; (b) a plurality of self turn-off type semiconductor elements each having a semiconductor chip having predetermined pn junctions therein and three electrodes in ohmic contact with said semiconductor chip, and mounted on said cooling fin of said package through an insulating material; and (c) a plurality of terminals mounted on said insulating covering case, each having one end disposed internally of said package and electrically connected with a respective electrode of a corresponding one of said plurality of self turn-off type elements, and the other end exposed externally of said package through said insulating covering case; and at least one of said plurality of terminals electrically connected with respective ones of said plurality of self turn-off semiconductor elements being mounted on a common terminal mount region of said insulating covering case, and said plurality of self turn-off semiconductor elements being disposed symmetrically with respect to said common terminal mount region.