Semiconductor integrated circuits with a protection device

Claim 2

A semiconductor integrated circuit device, comprising: a semiconductor substrate having a circuit region thereon; a pad means formed on said semiconductor substrate; a first semiconductor region of one conductivity type, formed at the surface of said semiconductor substrate and forming a PN junction with said semiconductor substrate; first and second electrodes, each contacting said first semiconductor region, the contacting regions of said electrodes facing each other with a ring-shaped region between; first connection means for connecting said pad means to said first electrode; and second connection means for connecting said second electrode to said circuit region.

Claim 3

A semiconductor integrated circuit as claimed in claim 1, further comprising: a first insulating layer formed on said semiconductor substrate, and having a round-shaped contact hole and a ring-shaped contact hole formed concentrically around said round-shaped contact hole; wherein said first electrode contacts said first semiconductor region through said ring-shaped contact hole, and said second electrode contacts said first semiconductor region through said round-shaped contact hole.

Claim 4

A semiconductor integrated circuit as claimed in claim 2, further comprising: a second insulating layer having a contact hole disposed over said second electrode; wherein one of said first and second connection means comprises a third electrode connected to said second electrode through said contact hole in said second insulating layer, and a wire connected to said third electrode and extending over the surface of said second insulating layer.

Claim 5

A semiconductor integrated circuit as claimed in claim 1, wherein said first electrode surround said second contact electrode.

Claim 6

A semiconductor integrated circuit device, comprising: a semiconductor substrate having a circuit region thereon; a pad means formed on said semiconductor substrate; a first semiconductor region formed at the surface of said semiconductor substrate and forming a PN junction with said semiconductor substrate; first and second electrodes, each contacting said first semiconductor region, the contacting regions of said electrodes facing each other with a ring-shaped region between; first connection means for connecting said pad means to said first electrode; and second connection means for connecting said second electrode to said circuit region, wherein said first semiconductor region is round and further including a second semiconductor region having a ring-shaped and being formed around said first semiconductor region, said second semiconductor region having the same conductivity as said first semiconductor region, and being a ground voltage semiconductor region.

Claim 7

A semiconductor integrated circuit device, comprising: a semiconductor substrate having a circuit region thereon; a pad means formed on said semiconductor substrate; a first semiconductor region formed at the surface of said semiconductor substrate and forming a PN junction with said semiconductor substrate; first and second electrodes, each contacting said first semiconductor region, the contacting regions of said electrodes facing each other with a ring-shaped region between; first connection means for connecting said pad means to said first electrode; and second connection means for connecting said second electrode to said circuit region, wherein said first semiconductor region is round and further including a second semiconductor region having a ring-shaped and being formed around said first semiconductor region, said second semiconductor region having the same conductivity as said first semiconductor region, and being a ground voltage semiconductor region.

Claim 8

A semiconductor integrated circuit as claimed in claim 5, further comprising: a first field insulating layer formed between said second semiconductor region and said first semiconductor region; and a second field insulating layer surrounding said second semiconductor region.

Claim 9

A semiconductor integrated circuit as claimed in claim 5, further comprising: an insulating layer formed on said semiconductor substrate and having a round-shaped contact hole and a ring-shaped contact hole formed concentrically around said round-shaped contact hole, said round-shaped contact hole being formed over said first semiconductor region; wherein said first electrode contacts said first semiconductor region at said ring-shaped contact hole, and the second electrode is connected to said first semiconductor region through said round-shaped contact hole.

Claim 10

A semiconductor integrated circuit as claimed in claim 7, wherein said first electrode has a break, and said second electrode extends over the surface of said insulating layer through said break.

Claim 11

A semiconductor integrated circuit as claimed in claim 8, further comprising: a third electrode having a ring shape with a break and contacting said ring-shaped semiconductor region; wherein said insulating layer further has a ring-shaped contact hole having a break and corresponds in shape to said third electrode.

Claim 12

A semiconductor integrated circuit as claimed in claim 7, wherein the outer edge of said first electrode is positioned above said ring-shaped semiconductor region; and including a second insulating layer having a second round-shaped contact hole and a second ring-shaped contact hole formed concentrically around said second round-shaped contact hole, said second ring-shaped contact hole having a break; wherein one of said first and second connection means comprises a further ring shaped electrode having a break and formed in said second ring-shaped contact hole and a wire extending from said further ring-shaped electrode, and the other of said first and second connection means comprises a further round-shaped electrode formed in said second round-shaped contact hole and a wire extending from said further round-shaped electrode through said break of said further ring-shaped electrode.

Claim 13

A semiconductor integrated circuit as claimed in claim 5, wherein said first electrode surrounds said second electrode.

Claim 14

A semiconductor integrated circuit as claim in claim 7, wherein said ring-shaped contact hole has a break, and has rounded ends.

Claim 15

A semiconductor integrated circuit as claimed in claim 5, wherein the ratio of the area of the ring-shaped semiconductor region (S 2 ) to the area of the round-shaped semiconductor (S 1 ) is set at S 2 /S 1 =1±0.2.

Claim 16

A semiconductor integrated as claimed in claim 1, wherein said pad means is signal output pad means.

Claim 17

A semiconductor integrated circuit as claimed in claim 5, wherein said pad means is a signal pad means.

Claim 18

A semiconductor integrated circuit as claimed in claim 15, wherein said pad means is a signal output pad means.

Claim 19

A semiconductor integrated circuit device, comprising; a semiconductor substrate having a circuit region thereon; a signal pad means formed on said semiconductor substrate; a first semiconductor region of one conductivity type, formed at the surface of said semiconductor substrate and forming a PN junction with said semiconductor substrate, said first semiconductor region being round in shape; first and second electrodes, each contacting said first semiconductor region, the contacting regions of said electrodes facing each other with a ring-shaped region between said first electrode configured to surround said second electrode; first connection means for connecting said pad means to said first electrode; and second connection means for connecting said second electrode to said circuit region, wherein said signal pad means is an output signal pad means, said circuit region including an output buffer, and said output buffer is connected to said second electrode with said second connection means.

Claim 20

A semiconductor integrated circuit device, comprising; a semiconductor substrate having a circuit region thereon; a signal pad means formed on said semiconductor substrate; a first semiconductor region of one conductivity type, formed at the surface of said semiconductor substrate and forming a PN junction with said semiconductor substrate, said first semiconductor region being round in shape; first and second electrodes, each contacting said first semiconductor region, the contacting regions of said electrodes facing each other with a ring-shaped region between said first electrode configured to surround said second electrode; first connection means for connecting said pad means to said first electrode; and second connection means for connecting said second electrode to said circuit region, wherein said signal pad means is an output signal pad means, said circuit region including an output buffer, and said output buffer is connected to said second electrode with said second connection means.

Claim 21

A semiconductor integrated circuit as claimed in claim 17, further comprising: a first insulating layer formed on said semiconductor substrate, and having a round-shaped contact hole and a ring-shaped contact hole formed concentrically around said round-shaped contact hole; wherein said first electrode contacts said first semiconductor region through said ring-shaped contact hole, and said second electrode contacts said first semiconductor region through said round-shaped contact hole.

Claim 22

A semiconductor integrated circuit as claimed in claim 18, further comprising: a second insulating layer having a contact hole disposed over said second electrode; wherein said second connection means comprises a third electrode connected to said second electrode through said contact hole in said second insulating layer, and a wire connected to said third electrode and extending over the surface of said second insulating layer.

Claim 23

A semiconductor integrated circuit device, comprising: a semiconductor substrate having a circuit region thereon; a signal pad means formed on said semiconductor substrate; a first semiconductor region of one conductivity type, formed at the surface of said semiconductor substrate and forming a PN junction with said semiconductor substrate, said first semiconductor region being round in shape; first and second electrodes, each contacting said first semiconductor region, the contacting region of said electrodes facing each other with a ring-shaped region between said first electrode configured to surround said second electrode; first connection means for connecting said pad means to said first electrode; and second connection means for connecting said second electrode to said circuit region; wherein said signal pad means is an input signal pad means, said circuit region including an input buffer, and said input buffer is connected to said second electrode with said second connection means.

Claim 24

A semiconductor integrated circuit device, comprising: a semiconductor substrate having a circuit region thereon; a signal pad means formed on said semiconductor substrate; a first semiconductor region of one conductivity type, formed at the surface of said semiconductor substrate and forming a PN junction with said semiconductor substrate, said first semiconductor region being round in shape; first and second electrodes, each contacting said first semiconductor region, the contacting region of said electrodes facing each other with a ring-shaped region between said first electrode configured to surround said second electrode; first connection means for connecting said pad means to said first electrode; and second connection means for connecting said second electrode to said circuit region; wherein said signal pad means is an input signal pad means, said circuit region including an input buffer, and said input buffer is connected to said second electrode with said second connection means.

Claim 25

A semiconductor integrated circuit as claimed in claim 20, further comprising: a first insulating layer formed on said semiconductor substrate, and having a round-shaped contact hole and a ring-shaped contact hole formed concentrically around said round-shaped contact hole; wherein said first electrode contacts said first semiconductor region through said ring-shaped contact hole, and said second electrode contacts said first semiconductor region through said round-shaped contact hole.

Claim 26

A semiconductor integrated circuit as claimed in claim 21, further comprising: a second insulating layer having a contact hole disposed over said second electrode; wherein said second connection means comprises a third electrode connected to said second electrode through said contact hole in said second insulating layer, and a wire connected to said third electrode and extending over the surface of said second insulating layer.

Claim 27

A semiconductor integrated circuit device, comprising: a semiconductor substrate having an inner circuit thereon; a signal pad means formed on said semiconductor substrate; a first semiconductor region of one conductivity type, formed at the surface of said semiconductor substrate and forming a PN junction with said semiconductor substrate, said first semiconductor region being round in shape; first and second electrodes, each contacting said first semiconductor region, the contacting regions of said electrodes facing each other with a ring-shaped region between said first electrode configured to surround said second electrode; first connection means for connecting said pad means to said first electrode; second connection means for connecting said second electrode to said inner circuit region; and a second semiconductor region having a ring-shape and being formed around said first semiconductor region, said second semiconductor region having the same conductivity as said first semiconductor region, and being a ground voltage semiconductor region.

Claim 28

A semiconductor integrated circuit device, comprising: a semiconductor substrate having an inner circuit thereon; a signal pad means formed on said semiconductor substrate; a first semiconductor region of one conductivity type, formed at the surface of said semiconductor substrate and forming a PN junction with said semiconductor substrate, said first semiconductor region being round in shape; first and second electrodes, each contacting said first semiconductor region, the contacting regions of said electrodes facing each other with a ring-shaped region between said first electrode configured to surround said second electrode; first connection means for connecting said pad means to said first electrode; second connection means for connecting said second electrode to said inner circuit region; and a second semiconductor region having a ring-shape and being formed around said first semiconductor region, said second semiconductor region having the same conductivity as said first semiconductor region, and being a ground voltage semiconductor region.

Claim 29

A semiconductor integrated circuit as claimed in claim 23, wherein said signal pad means is an output signal pad means, said inner circuit including an output buffer, and said output buffer is connected to said second electrode with said second connection means.

Claim 30

A semiconductor integrated circuit as claimed in claim 23, wherein said signal pad means is an input signal pad means, said inner circuit including an input buffer, and said input buffer is connected to said second electrode with said second connection means.

Claim 31

A semiconductor integrated circuit as claimed in claim 23, wherein said second semiconductor region is a grounded region.

Claim 32

A semiconductor integrated circuit as claimed in claim 23, wherein said second semiconductor region is a region to be grounded in circuit operation.