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US4874438A
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Intermetallic compound semiconductor thin film and method of manufacturing same
Assignee: Toyo Communication Equipment Co Ltd
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Filing: 1987-04-01
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Granted: 1989-10-17
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Expires: 2007-04-01
Abstract
Abstract An intermetallic compound semiconductor thin film comprises a single crystalline deposition thin film made of a III-V group intermetallic compound having a stoichiometry composition ratio of 1:1. When forming the III-V group semiconductor thin film by an evaporation method, a substrate temperature is initially maintained at a high level while the evaporation source temperature is gradually raised, and when the intermetallic composition of the III-V group begins to deposit on the substrate, the substrate temperature is lowered while the evaporation source temperature is maintained at the same level as existed at the time when the intermetallic compound is deposited, and the deposition time is controlled.
Inventors
- 👤 Masahide Oshita
- 👤 Masaaki Isai
- 👤 Toshiaki Fukunaka
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 10:19
CPC Classifications
H; H10; H10N; H10N50/00; H10N50/01; H10N52/00; H10N52/01; H10P; H10P14/00; H10P14/20; H10P14/29; H10P14/2901; H10P14/2921; H10P14/34; H10P14/3402; H10P14/3414; H10P14/3421; H10P14/3422; H10P14/36; H10P14/3602; Y; Y10; Y10S; Y10S148/00; Y10S148/005; Y10S148/065; Y10S148/169; Y10S438/00; Y10S438/971
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
224 words
A method for manufacturing an intermetallic compound semiconductor thin film comprising the steps of: (a) providing an evaporation source containing a III-V Group intermetallic composition; (b) providing a deposition substrate and raising the deposition substrate temperature to a first elevated level; (c) maintaining said deposition substrate temperature at said first elevated level while gradually increasing the temperature of said evaporation source to vaporize said III-V Group intermetallic composition; (d) passing vapors from said evaporation source to said deposition substrate; (e) terminating the increase in temperature of the evaporation source when an early stage of the deposition of a thin film of III Group material occurs on the surface of said deposition substrate; (f) maintaining the temperature of the evaporation source at the temperature where said early stage of film deposition occurs on the deposition substrate to begin deposition of a III-V Group intermetallic compound on said deposition substrate; (g) lowering the temperature of said deposition substrate to a predetermined second elevated level of temperature below said first elevated level when formation of an initial nucleus of III-V Group intermetallic compound begins on the surface of said deposition substrate; and (h) maintaining said deposition substrate temperature at said predetermined second elevated level for a predetermined amount of time to produce a III-V Group intermetallic compound semiconductor thin film on the surface of said deposition substrate.
Claim 2
Independent Claim
224 words
A method for manufacturing an intermetallic compound semiconductor thin film comprising the steps of: (a) providing an evaporation source containing a III-V Group intermetallic composition; (b) providing a deposition substrate and raising the deposition substrate temperature to a first elevated level; (c) maintaining said deposition substrate temperature at said first elevated level while gradually increasing the temperature of said evaporation source to vaporize said III-V Group intermetallic composition; (d) passing vapors from said evaporation source to said deposition substrate; (e) terminating the increase in temperature of the evaporation source when an early stage of the deposition of a thin film of III Group material occurs on the surface of said deposition substrate; (f) maintaining the temperature of the evaporation source at the temperature where said early stage of film deposition occurs on the deposition substrate to begin deposition of a III-V Group intermetallic compound on said deposition substrate; (g) lowering the temperature of said deposition substrate to a predetermined second elevated level of temperature below said first elevated level when formation of an initial nucleus of III-V Group intermetallic compound begins on the surface of said deposition substrate; and (h) maintaining said deposition substrate temperature at said predetermined second elevated level for a predetermined amount of time to produce a III-V Group intermetallic compound semiconductor thin film on the surface of said deposition substrate.
Claim 3
Dependent Claim
34 words
The method of manufacturing an intermetallic compound semiconductor thin film as set forth in claim 1 wherein said predetermined second elevated level of temperature is maintained between about 395° C. and about 425° C.
Claim 4
Dependent Claim
62 words
A method according to claim 2 wherein said III-V Group intermetallic composition comprises In-Sb, and said III-V Group intermetallic compound semiconductor thin film comprises In-Sb having a thickness of from about 0.15 to about 0.6μm, an electron mobility of from about 10 4 to about 5×10 4 cm 2 /V.sec, and a stoichiometric composition ratio of In to Sb of about 1:1.
Claim 5
Dependent Claim
62 words
A method according to claim 2 wherein said III-V Group intermetallic composition comprises In-As, and said III-V Group intermetallic compound semiconductor thin film comprises In-As having a thickness of from about 0.15 to about 0.6μm, an electron mobility of from about 10 4 to about 2×10 4 cm 2 /V.sec, and a stoichiometric composition ratio of In to As of about 1:1.
Claim 6
Dependent Claim
13 words
An intermetallic compound semiconductor thin film manufactured by the method of claim 2.
Claim 7
Dependent Claim
34 words
The method of manufacturing an intermetallic compound semiconductor thin film as set forth in claim 1 wherein said predetermined second elevated level of temperature is maintained between about 395° C. and about 410° C.
Claim 8
Dependent Claim
62 words
A method according to claim 6 wherein said III-V Group intermetallic composition comprises In-Sb, and said III-V Group intermetallic compound semiconductor thin film comprises In-As As having a thickness of from about 0.15 to 0.6μm, an electron mobility of from about 10 4 to about 5×10 4 cm 2 /V.sec, and a stoichiometric composition ratio of In to Sb of about 1:1.
Claim 9
Dependent Claim
61 words
A method according to claim 6 wherein said III-V Group intermetallic composition comprises In-As, and said III-V Group intermetallic compound semiconductor thin film comprises In-As having a thickness of from about 0.15 to 0.6μm, an electron mobility of from about 10 4 to about 2×10 4 cm 2 /V.sec, and a stoichiometric composition ratio of In to As of about 1:1.
Claim 10
Dependent Claim
13 words
An intermetallic compound semiconductor thin film manufactured by the method of claim 6.
Claim 11
Dependent Claim
62 words
A method according to claim 1 wherein said III-V Group intermetallic composition comprises In-Sb, and said III-V Group intermetallic compound semiconductor thin film comprises In-Sb having a thickness of from about 0.15 to about 0.6μm, an electron mobility of from about 10 4 to about 5×10 4 cm 2 /V.sec, and a stoichiometric composition ratio of In to Sb of about 1:1.
Claim 12
Dependent Claim
62 words
A method according to claim 1 wherein said III-V Group intermetallic composition comprises In-As, and said III-V Group intermetallic compound semiconductor thin film comprises In-As having a thickness of from about 0.15 to about 0.6μm, an electron mobility of from about 10 4 to about 2×10 4 cm 2 /V.sec, and a stoichiometric composition ratio of In to As of about 1:1.
Claim 13
Dependent Claim
13 words
An intermetallic compound semiconductor thin film manufactured by the method of claim 1.
Claim 14
Dependent Claim
70 words
A method according to claim 1 further comprising the step of raising the temperature of the evaporation source by about 10° C. at a time while said deposition substrate temperature is maintained at said predetermined second elevated level, and maintaining the raised temperature of the evaporation source while said deposition substrate temperature is maintained at said predetermined second elevated level to prevent reevaporation of the depositions on the deposition substrate.
Claim 15
Dependent Claim
50 words
An intermetallic compound semiconductor thin film comprising a single crystal deposition film of In-Sb having a thickness of from about 0.15 to about 0.6μm, an electron mobility from about 10 4 to about 5×10 4 cm 2 /V.sec, and a stoichiometric composition ratio of In to Sb of about 1:1.
Claim 16
Dependent Claim
50 words
An intermetallic compound semiconductor thin film comprising a single crystal deposition film of In-Sb having a thickness of from about 0.15 to about 0.6μm, an electron mobility from about 10 4 to about 5×10 4 cm 2 /V.sec, and a stoichiometric composition ratio of In to Sb of about 1:1.
Claim 17
Dependent Claim
50 words
An intermetallic compound semiconductor thin film comprising a single crystal deposition film of In-As having a thickness of from about 0.15 to about 0.6μm, an electron mobility from about 10 4 to about 5×10 4 cm 2 /V.sec, and a stoichiometric composition ratio of In to As of about 1:1.
Claim 18
Dependent Claim
50 words
An intermetallic compound semiconductor thin film comprising a single crystal deposition film of In-As having a thickness of from about 0.15 to about 0.6μm, an electron mobility from about 10 4 to about 5×10 4 cm 2 /V.sec, and a stoichiometric composition ratio of In to As of about 1:1.
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| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1992-10-16 | 1993-04-17 | 1993-10-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-10-16 | 1997-04-17 | 1997-10-17 | $3760.00 | Window Closed / Lapsed |
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