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US4873177A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for forming a resist pattern on a substrate surface and a scum-remover therefor

Assignee: Tokyo Ohka Kogyo Co Ltd
•
Filing: 1988-08-05
•
Granted: 1989-10-10
•
Expires: 2008-08-05
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Abstract

Abstract The pattern-wise photoresist layer formed on the surface of a substrate according to the inventive method is imparted with a greatly improved resolving power as a result of complete removal of the scum residua left after the development treatment. Namely, the positive-working photoresist layer formed on the substrate surface is exposed pattern-wise to actinic rays, developed with a developer solution which is typically a 2-7% aqueous solution of a quaternary ammonium hydroxide and then rinsed with a scum-remover solution which is a mixture of 100 parts of a 0.1-1.5% aqueous solution of a quaternary ammonium hydroxide and 1-30 parts of a water-miscible organic solvent and capable of dissolving away the scum residua in the pattern-wise photoresist layer without affecting the quality of the photoresist pattern reproduction.

Inventors

  • 👤 Hatsuyuki Tanaka
  • 👤 Yoshiyuki Sato
  • 👤 Hidekatsu Kohara
  • 👤 Toshimasa Nakayama

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-31 21:24
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/26; G03F7/30; G03F7/32; G03F7/322

Claims Analysis

Total Claims: 4
Claim 1
Independent Claim 153 words
A method for forming a pattern-wise photoresist layer on the surface of a substrate which comprises the steps of: (a) forming a layer of photo-working photoresist composition on the surface of a substrate; (b) exposing the layer of the positive-working photoresist pattern-wise to actinic rays to increase the solubility of the photoresist composition on the areas exposed to the actinic rays; (c) dissolving away the layer of the photoresist composition on the areas exposed to the actinic rays with a developer solution to leave a pattern-wise photoresist layer on the surface of the substrate; and (d) rinsing the substrate with the pattern-wise photoresist layer on the surface thereof with a scum-remover solution which is a mixture of 100 parts by weight of an aqueous solution of from 0.5 to 1.5% by weight of tetramethylammonium hydroxide or trimethyl 2-hydroxymethyl ammonium hydroxide, and from 1 to 30 parts by weight of a water-miscible organic solvent.
Claim 2
Independent Claim 153 words
A method for forming a pattern-wise photoresist layer on the surface of a substrate which comprises the steps of: (a) forming a layer of photo-working photoresist composition on the surface of a substrate; (b) exposing the layer of the positive-working photoresist pattern-wise to actinic rays to increase the solubility of the photoresist composition on the areas exposed to the actinic rays; (c) dissolving away the layer of the photoresist composition on the areas exposed to the actinic rays with a developer solution to leave a pattern-wise photoresist layer on the surface of the substrate; and (d) rinsing the substrate with the pattern-wise photoresist layer on the surface thereof with a scum-remover solution which is a mixture of 100 parts by weight of an aqueous solution of from 0.5 to 1.5% by weight of tetramethylammonium hydroxide or trimethyl 2-hydroxymethyl ammonium hydroxide, and from 1 to 30 parts by weight of a water-miscible organic solvent.
Claim 3
Dependent Claim 66 words
The method for forming a pattern-wise photoresist layer on the surface of a substrate as claimed in claim 1 wherein the water-miscible organic solvent is selected from the group consisting of ethyl alcohol, n-propyl alcohol, isopropyl alcohol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, acetone, methyl ethyl ketone, cyclohexanone, cyclopentanone, ethylene glycol monomethyl ether acetate and ethylene glycol monoethyl ether acetate.
Claim 4
Dependent Claim 39 words
The method of forming a pattern-wise photoresist layer on the surface of a substrate as claimed in claim 1 wherein the developer solution is an aqueous solution containing from 2 to 7% by weight of a quaternary ammonium hydroxide.

References Cited (Backward Citations)

US4239661A Cited
US4530895A Cited
US4576793A Cited
US4617254A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1992-10-09 1993-04-10 1993-10-10 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1996-10-09 1997-04-10 1997-10-10 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2000-10-09 2001-04-10 2001-10-10 $7700.00 Window Closed / Lapsed

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