US4869930A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for preparing substrates for deposition of metal seed from an organometallic vapor for subsequent electroless metallization
Assignee: International Business Machines Corp
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Filing: 1988-07-12
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Granted: 1989-09-26
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Expires: 2008-07-12
Abstract
Abstract A process for preparing a substrate, e.g., an epoxy printed circuit board, for subsequent metallization. Active chemical sites are formed adhering to the substrate surface. The substrate is then exposed to a vapor of a volatile organometallic compound, which chemically reacts with the active sites and is decomposed to at least a species of the metal constituent of the compound. This species adheres to the substrate and can be transformed into the free metal which is useful as a seed for subsequent electroless deposition of a metal thereon. If selective deposition is desired, a resist masking layer is used prior to forming the seed layer. Volatile organopalladium compounds, such as (cyclopentadienyl)(allyl)palladium and bis(allyl)pallidium, are particularly effective for depositing a palladium seed which is particularly effective for electroless deposition of copper.
Inventors
- 👤 Thomas C. Clarke
- 👤 Caroline A. Kovac
- 👤 Dae Y. Jung
- 👤 Jae M. Park
- 👤 Richard R. Thomas
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 18:02
CPC Classifications
C; C23; C23C; C23C16/00; C23C16/04; C23C16/06; C23C16/18; C23C18/00; C23C18/16; C23C18/1601; C23C18/1603; C23C18/1605; C23C18/1607; C23C18/1608; C23C18/18; C23C18/1851; C23C18/1862; C23C18/1865; C23C18/1872; C23C18/1875; C23C18/1879; C23C18/1886; C23C18/1893; C23C18/20; C23C18/2006; C23C18/2026; C23C18/2033; C23C18/2046; C23C18/2073; C23C18/2086; C23C18/28; C23C18/30; C23C18/31; C23C18/32; C23C18/38; C23C18/42; H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181; H05K3/14; H05K3/146; H05K3/182; H05K3/184
Claims Analysis
Total Claims: 38
Claim 1
Independent Claim
174 words
A method for preparing a substrate surface for subsequent metallization comprising the steps of: forming active chemical sites adherent to the substrate surface, said active chemical sites having the property of being capable of chemically reacting with a volatile organometallic compound exposed to said sites; contacting a portion of said substrate surface with a vapor of said volatile organometallic compound for a time sufficient for said active sites to chemically react with said volatile organometallic compound, the chemical reaction releasing a saturated organic ligand from said organometallic compound and the chemical reaction forming a second compound, which is a species of said organometallic compound, from said active site and the remainder of said organometallic compound, said second compound adheres to said substrate surface, said second compound contains the metal constituent of said volatile organometallic compound; transforming said second compound to said constituent metal adhering to said substrate surface; said constituent metal of said organometallic compound is palladium; and depositing copper by electroless deposition on those areas of said substrate to which said palladium adheres.
Claim 2
Independent Claim
174 words
A method for preparing a substrate surface for subsequent metallization comprising the steps of: forming active chemical sites adherent to the substrate surface, said active chemical sites having the property of being capable of chemically reacting with a volatile organometallic compound exposed to said sites; contacting a portion of said substrate surface with a vapor of said volatile organometallic compound for a time sufficient for said active sites to chemically react with said volatile organometallic compound, the chemical reaction releasing a saturated organic ligand from said organometallic compound and the chemical reaction forming a second compound, which is a species of said organometallic compound, from said active site and the remainder of said organometallic compound, said second compound adheres to said substrate surface, said second compound contains the metal constituent of said volatile organometallic compound; transforming said second compound to said constituent metal adhering to said substrate surface; said constituent metal of said organometallic compound is palladium; and depositing copper by electroless deposition on those areas of said substrate to which said palladium adheres.
Claim 3
Independent Claim
165 words
A method for preparing a substrate surface for subsequent metallization comprising the steps of: forming active chemical sites adherent to the substrate surface, said active chemical sites having the property of being capable of chemically reacting with a volatile organometallic compound exposed to said sites; contacting a portion of said substrate surface with a vapor of said volatile organometallic compound for a time sufficient for said active sites to chemically react with said volatile organometallic compound, the chemical reaction releasing a saturated organic ligand from said organometallic compound and the chemical reaction forming a second compound, which is a species of said organometallic compound, from said active site and the remainder of said organomettallic compound, said second compound adheres to said substrate surface, said second compound contains the metal constituent of said volatile organometallic compound; transforming said second compound to said constituent metal adhering to the substrate surface; and electrolessly depositing a metal on those areas of said substrate to which said constituent metal adheres.
Claim 4
Independent Claim
165 words
A method for preparing a substrate surface for subsequent metallization comprising the steps of: forming active chemical sites adherent to the substrate surface, said active chemical sites having the property of being capable of chemically reacting with a volatile organometallic compound exposed to said sites; contacting a portion of said substrate surface with a vapor of said volatile organometallic compound for a time sufficient for said active sites to chemically react with said volatile organometallic compound, the chemical reaction releasing a saturated organic ligand from said organometallic compound and the chemical reaction forming a second compound, which is a species of said organometallic compound, from said active site and the remainder of said organomettallic compound, said second compound adheres to said substrate surface, said second compound contains the metal constituent of said volatile organometallic compound; transforming said second compound to said constituent metal adhering to the substrate surface; and electrolessly depositing a metal on those areas of said substrate to which said constituent metal adheres.
Claim 5
Independent Claim
146 words
A method for preparing a substrate surface for subsequent metallization comprising the steps of: forming active chemical sites adherent to the substrate surface, said active chemical sites having the property of being capable of chemically reacting with a volatile organometallic compound exposed to said sites; contacting a portion of said substrate surface with a vapor of said volatile organometallic compound for a time sufficient for said active sites to chemically react with said volatile organometallic compound, the chemical reaction releasing a saturated organic ligand from which is a species of said organometallic compound, from said active site and the remainder of said organometallic compound, said second compound adheres to said substrate surface, said second compound contains the metal constituent of said volatile organometallic compound; said species is said constituent metal; electrolessly depositing a metal onto those areas of said substrate to which said constituent metal adheres.
Claim 6
Independent Claim
146 words
A method for preparing a substrate surface for subsequent metallization comprising the steps of: forming active chemical sites adherent to the substrate surface, said active chemical sites having the property of being capable of chemically reacting with a volatile organometallic compound exposed to said sites; contacting a portion of said substrate surface with a vapor of said volatile organometallic compound for a time sufficient for said active sites to chemically react with said volatile organometallic compound, the chemical reaction releasing a saturated organic ligand from which is a species of said organometallic compound, from said active site and the remainder of said organometallic compound, said second compound adheres to said substrate surface, said second compound contains the metal constituent of said volatile organometallic compound; said species is said constituent metal; electrolessly depositing a metal onto those areas of said substrate to which said constituent metal adheres.
Claim 7
Independent Claim
145 words
A method for preparing a substrate surface for subsequent metallization comprising the steps of: forming active chemical sites adherent to the substrate surface, said active chemical sites having the property of being capable of chemically reacting with a volatile organometallic compound exposed to said sites; contacting a portion of said substrate surface with a vapor of said volatile organometallic compound for a time sufficient for said active sites to chemically react with said volatile organometallic compound, the chemical reaction releasing a saturated organic ligand from said organometallic compound and the chemical reaction forming a second compound, which is a species of said organometallic compound, from said active site and the remainder of said organometallic compound, said second compound adheres to said substrate surface, said second compound contains the metal constituent of said volatile organometallic compound; and said constituent metal of said organometallic compound is palladium.
Claim 8
Independent Claim
145 words
A method for preparing a substrate surface for subsequent metallization comprising the steps of: forming active chemical sites adherent to the substrate surface, said active chemical sites having the property of being capable of chemically reacting with a volatile organometallic compound exposed to said sites; contacting a portion of said substrate surface with a vapor of said volatile organometallic compound for a time sufficient for said active sites to chemically react with said volatile organometallic compound, the chemical reaction releasing a saturated organic ligand from said organometallic compound and the chemical reaction forming a second compound, which is a species of said organometallic compound, from said active site and the remainder of said organometallic compound, said second compound adheres to said substrate surface, said second compound contains the metal constituent of said volatile organometallic compound; and said constituent metal of said organometallic compound is palladium.
Claim 9
Independent Claim
146 words
A method for preparing a substrate surface for subsequent metallization comprising the steps of: forming active chemical sites adherent to the substrate surface, said active chemical sites having the property of being capable of chemically reacting with a volatile organometallic compound exposed to said sites; contacting a portion of said substrate surface with a vapor of said volatile organometallic compound for a time sufficient for said active sites to chemically react with said volatile organometallic compound, the chemical reaction releasing a saturated organic ligand from said organometallic compound and the chemical reaction forming a second compound, which is a species of said organometallic compound, from said active site and the remainder of said organometallic compound, said second compound adheres to said substrate surface, said second compound contains the metal constituent of said volatile organometallic compound; said species is said constituent metal; said substrate is an epoxy.
Claim 10
Independent Claim
146 words
A method for preparing a substrate surface for subsequent metallization comprising the steps of: forming active chemical sites adherent to the substrate surface, said active chemical sites having the property of being capable of chemically reacting with a volatile organometallic compound exposed to said sites; contacting a portion of said substrate surface with a vapor of said volatile organometallic compound for a time sufficient for said active sites to chemically react with said volatile organometallic compound, the chemical reaction releasing a saturated organic ligand from said organometallic compound and the chemical reaction forming a second compound, which is a species of said organometallic compound, from said active site and the remainder of said organometallic compound, said second compound adheres to said substrate surface, said second compound contains the metal constituent of said volatile organometallic compound; said species is said constituent metal; said substrate is an epoxy.
Claim 11
Dependent Claim
22 words
The method of claim 5 wherein the constituent metal of said organometallic compound is palladium and said electrolessly deposited metal is copper.
Claim 12
Independent Claim
12 words
The method of clain 2 wherein the electrolessly deposited metal is copper.
Claim 13
Independent Claim
12 words
The method of clain 2 wherein the electrolessly deposited metal is copper.
Claim 14
Dependent Claim
25 words
The method of claim 2 is wherein the electrolessly deposited metal is selected from the group consisting of copper, cobalt, palladium, nickel, silver and gold.
Claim 15
Independent Claim
154 words
A method for preparing a substrate surface for subsequent metallization comprising the steps of: forming active chemical sites adherent to the substrate surface, said active chemical sites having the property of being capable of chemically reacting with a volatile organometallic compound exposed to said sites; contacting a portion of said substrate surface with a vapor of said volatile organometallic compound for a time sufficient for said active sites to chemically react with said volatile organometallic compound, the chemical reaaction releasing a saturated organic ligand from said organometallic compound and the chemical reaction forming a second compound, which is a species of said organometallic compound, from said active site and the remainder of said organometallic compound, said second compound adheres to said substrate surface, said second compound contains the metal constituent of said volatile organometallic compound; and said constituent metal of said organometallic compound is selected from the group consisting of nickel, copper and palladium.
Claim 16
Independent Claim
154 words
A method for preparing a substrate surface for subsequent metallization comprising the steps of: forming active chemical sites adherent to the substrate surface, said active chemical sites having the property of being capable of chemically reacting with a volatile organometallic compound exposed to said sites; contacting a portion of said substrate surface with a vapor of said volatile organometallic compound for a time sufficient for said active sites to chemically react with said volatile organometallic compound, the chemical reaaction releasing a saturated organic ligand from said organometallic compound and the chemical reaction forming a second compound, which is a species of said organometallic compound, from said active site and the remainder of said organometallic compound, said second compound adheres to said substrate surface, said second compound contains the metal constituent of said volatile organometallic compound; and said constituent metal of said organometallic compound is selected from the group consisting of nickel, copper and palladium.
Claim 17
Independent Claim
153 words
A method for preparing a substrate surface for subsequent metallization comprising the steps of: forming active chemical sites adherent to the substrate surface, said active chemical sites having the property of being capable of chemically reacting with a volatile organometallic compound exposed to said sites; contacting a portion of said substrate surface with a vapor of said volatile organometallic compound for a time sufficient for said active sites to chemically react with said volatile organometallic compound, the chemical reaction releasing a saturated organic ligand from said organometallic compound and the chemical reaction forming a second compound, which is a species of said organometallic compound, from said active site and the remainder of said organometallic compound, said second compound adheres to said substrate surface, said second compound contains the metal constituent of said volatile organometallic compound; and said organometallic compound is selected from the group consisting of a (cyclopentadienyl)(allyl)palladium(II) compound and a bis(allyl)palladium(II) compound.
Claim 18
Independent Claim
153 words
A method for preparing a substrate surface for subsequent metallization comprising the steps of: forming active chemical sites adherent to the substrate surface, said active chemical sites having the property of being capable of chemically reacting with a volatile organometallic compound exposed to said sites; contacting a portion of said substrate surface with a vapor of said volatile organometallic compound for a time sufficient for said active sites to chemically react with said volatile organometallic compound, the chemical reaction releasing a saturated organic ligand from said organometallic compound and the chemical reaction forming a second compound, which is a species of said organometallic compound, from said active site and the remainder of said organometallic compound, said second compound adheres to said substrate surface, said second compound contains the metal constituent of said volatile organometallic compound; and said organometallic compound is selected from the group consisting of a (cyclopentadienyl)(allyl)palladium(II) compound and a bis(allyl)palladium(II) compound.
Claim 19
Independent Claim
164 words
A method for preparing a substrate surface for subsequent metallization comprising the steps of: forming active chemical sites adherent to the substrate surface, said active chemical sites having the property of being capable of chemically reacting with a volatile organometallic compound exposed to said sites; contacting a portion of said substrate surface with a vapor of said volatile organometallic compound for a time sufficient for said active sites to chemically react with said volatile organometallic compound, the chemical reaction releasing a saturated organic ligand from said organometallic compound and the chemical reaction forming a second compound, which is a species of said organometallic compound, from said active site and the remainder of said organometallic compound, said second compound adheres to said substrate surface, said second compound contains the metal constituent of said volatile organometallic compound; and said organometallic compound is selected from the group constiting of a (cyclopentadienyl)(allyl)palladium(II) compound, a bis(allyl)palladium(II) compound, a nickel carbonyl compound, a diallynickel(II) compound and a (cyclopentadienyl)(triethylphosphine)copper I compound.
Claim 20
Independent Claim
164 words
A method for preparing a substrate surface for subsequent metallization comprising the steps of: forming active chemical sites adherent to the substrate surface, said active chemical sites having the property of being capable of chemically reacting with a volatile organometallic compound exposed to said sites; contacting a portion of said substrate surface with a vapor of said volatile organometallic compound for a time sufficient for said active sites to chemically react with said volatile organometallic compound, the chemical reaction releasing a saturated organic ligand from said organometallic compound and the chemical reaction forming a second compound, which is a species of said organometallic compound, from said active site and the remainder of said organometallic compound, said second compound adheres to said substrate surface, said second compound contains the metal constituent of said volatile organometallic compound; and said organometallic compound is selected from the group constiting of a (cyclopentadienyl)(allyl)palladium(II) compound, a bis(allyl)palladium(II) compound, a nickel carbonyl compound, a diallynickel(II) compound and a (cyclopentadienyl)(triethylphosphine)copper I compound.
Claim 21
Independent Claim
187 words
A method for preparing a substrate surface for subsequent metallization comprising the steps of: forming active chemical sites adherent to the substrate surface, said active chemical sites having the property of being capable of chemically reacting with a volatile organometallic compound exposed to said sites; contacting a portion of said substrate surface with a vapor of said volatile organometallic compound for a time sufficient for said active sites to chemically react with said volatile organometallic compound, the chemical reaction releasing a saturated organic ligand from said organometallic compound and the chemical reaction forming a second compound, which is a species of said organometallic compound, from said active site and the remainder of said organometallic compound, said second compound adheres to said substrate surface, said second compound contains the metal constituent of said volatile organometallic compound; transforming said second compound to said constituent metal adhering to the substrate surface; and wherein said step of contacting a portion of the substrate surface includes th steps of, prior to contacting the substrate surface with the organometallic vapor, covering the substrate with a resist-type material and selectively removing said resist material.
Claim 22
Independent Claim
187 words
A method for preparing a substrate surface for subsequent metallization comprising the steps of: forming active chemical sites adherent to the substrate surface, said active chemical sites having the property of being capable of chemically reacting with a volatile organometallic compound exposed to said sites; contacting a portion of said substrate surface with a vapor of said volatile organometallic compound for a time sufficient for said active sites to chemically react with said volatile organometallic compound, the chemical reaction releasing a saturated organic ligand from said organometallic compound and the chemical reaction forming a second compound, which is a species of said organometallic compound, from said active site and the remainder of said organometallic compound, said second compound adheres to said substrate surface, said second compound contains the metal constituent of said volatile organometallic compound; transforming said second compound to said constituent metal adhering to the substrate surface; and wherein said step of contacting a portion of the substrate surface includes th steps of, prior to contacting the substrate surface with the organometallic vapor, covering the substrate with a resist-type material and selectively removing said resist material.
Claim 23
Independent Claim
151 words
A method for preparing a substrate surface for subsequent metallization comprising the steps of: forming active chemical sites adherent to the substrate surface, said active chemical sites having the property of being capable of chemically reacting with a volatile organometallic compound exposed to said sites; contacting a portion of said substrate surface with a vapor of said volatile organometallic compound for a time sufficient for said active sites to chemically react with said volatile organometallic compound, the chemical reaction releasing a saturated organic ligand from said organometallic compound and the chemical reaction forming a second compound, which is a species of said organometallic compound, from said active site and the remainder of said organometallic compound, said second compound adheres to said substrate surface, said second compound contains the metal constituent of said volatile organometallic compound; and wherein said substrate is selected from the group consisting of polymers, epoxies, semiconductors and ceramics.
Claim 24
Independent Claim
151 words
A method for preparing a substrate surface for subsequent metallization comprising the steps of: forming active chemical sites adherent to the substrate surface, said active chemical sites having the property of being capable of chemically reacting with a volatile organometallic compound exposed to said sites; contacting a portion of said substrate surface with a vapor of said volatile organometallic compound for a time sufficient for said active sites to chemically react with said volatile organometallic compound, the chemical reaction releasing a saturated organic ligand from said organometallic compound and the chemical reaction forming a second compound, which is a species of said organometallic compound, from said active site and the remainder of said organometallic compound, said second compound adheres to said substrate surface, said second compound contains the metal constituent of said volatile organometallic compound; and wherein said substrate is selected from the group consisting of polymers, epoxies, semiconductors and ceramics.
Claim 25
Independent Claim
191 words
A method for preparing a substrate surface for subsequent metallization comprising the steps of: forming active chemical sites adherent to the substrate surface, said active chemical sites being capable of chemically reacting with a volatile organometallic compound exposed to said sites; covering said substrate with a resist type material; selectively removing said resist-type material to expose a portion of said substrate surface; contacting said active chemical sites in said exposed portion of said substrate surface with a vapor of said volatile organometallic compound for a time sufficient for said active sites to chemically react with said volatile organometallic compound, the chemical reaction releasing a saturated organic ligand from said organometallic compound and the chemical reaction forming a second compound, which is a species of said organometallic compound, from said active site and the remainder of said organometallic compound, said second compound adheres to said substrate surface, said second compound contains the metal constituent of said volatile organometallic compound; transforming said second compound to the constituent metal as a seed adhering to the substrate surface; and depositing a metal by electroless deposition on those areas of said substrate to which seed adheres.
Claim 26
Independent Claim
191 words
A method for preparing a substrate surface for subsequent metallization comprising the steps of: forming active chemical sites adherent to the substrate surface, said active chemical sites being capable of chemically reacting with a volatile organometallic compound exposed to said sites; covering said substrate with a resist type material; selectively removing said resist-type material to expose a portion of said substrate surface; contacting said active chemical sites in said exposed portion of said substrate surface with a vapor of said volatile organometallic compound for a time sufficient for said active sites to chemically react with said volatile organometallic compound, the chemical reaction releasing a saturated organic ligand from said organometallic compound and the chemical reaction forming a second compound, which is a species of said organometallic compound, from said active site and the remainder of said organometallic compound, said second compound adheres to said substrate surface, said second compound contains the metal constituent of said volatile organometallic compound; transforming said second compound to the constituent metal as a seed adhering to the substrate surface; and depositing a metal by electroless deposition on those areas of said substrate to which seed adheres.
Claim 27
Dependent Claim
23 words
The method claim 14 wherein the constituent metal of said organometallic compound is selected from the group consisting of palladium, nickel and copper.
Claim 28
Dependent Claim
15 words
The method of claim 14 wherein the constituent metal of said organometallic compound is palladium.
Claim 29
Dependent Claim
23 words
The method claim 16 wherein the electrolessly deposited metal is selected from the group consisting of copper, cobalt, palladium, nickel, silver and gold.
Claim 30
Dependent Claim
22 words
The method of claim 14 wherein said electrolessly deposited metal is copper and said constituent metal of said organometallic compound is palladium.
Claim 31
Dependent Claim
11 words
The method of claim 16 wherein said substrate is an epoxy.
Claim 32
Dependent Claim
11 words
The method of claim 18 wherein said substrate is an epoxy.
Claim 33
Independent Claim
136 words
A method for preparing a substrate surface for subsequent metallization comprising the steps of: forming active chemical sites adherent to the substrate surface, said active chemical sites having the property of being capable of chemically reacting with a volatile palladium compound exposed to said sites; and contacting a portion of said substrate surface with a vapor of said volatile palladium compound for a time sufficient for said active sites to chemically react with said volatile organopalladium compound, the chemical reaction releasing a saturated organic ligand from said organopalladium compound and the chemical reaction forming a second compound, which is a species of said organopalladium compound, from said active site and the remainder of said organopalladium compound, said second compound adheres to said substrate surface, said second compound contains the metal constituent of said volatile organopalladium compound.
Claim 34
Independent Claim
136 words
A method for preparing a substrate surface for subsequent metallization comprising the steps of: forming active chemical sites adherent to the substrate surface, said active chemical sites having the property of being capable of chemically reacting with a volatile palladium compound exposed to said sites; and contacting a portion of said substrate surface with a vapor of said volatile palladium compound for a time sufficient for said active sites to chemically react with said volatile organopalladium compound, the chemical reaction releasing a saturated organic ligand from said organopalladium compound and the chemical reaction forming a second compound, which is a species of said organopalladium compound, from said active site and the remainder of said organopalladium compound, said second compound adheres to said substrate surface, said second compound contains the metal constituent of said volatile organopalladium compound.
Claim 35
Independent Claim
171 words
A method for preparing a substrate surface for subsequent metallization comprising the steps of: forming active chemical sites adherent to the substrate surface, said active chemical sites being selected from the group consisting of acidic sites and ammonia functionals, said active chemical sites having the property of being capable of chemically reacting with a volatile organopalladium compound exposed to said sites, said organopalladium compound being selected from the group consisting of a (cyclopentadienyl)(allyl)palladium (II) compound and a bis(allyl)palladium (II) compound; and contacting a portion of said substrate surface with a vapor of said volatile organopalladium compound for a time sufficient for said active sites to chemically react with said volatile oreganopalladium compound, the chemical reaction releasing a saturated organic ligand from said organopalladium compound and the chemical reaction forming a second compound, which is a species of said organopalladium compound, from said active site and the remainder of said organopalladium compound, said second compound adheres to said substrate surface, said second compound contains the metal constituent of said volatile organopalladium compound.
Claim 36
Independent Claim
171 words
A method for preparing a substrate surface for subsequent metallization comprising the steps of: forming active chemical sites adherent to the substrate surface, said active chemical sites being selected from the group consisting of acidic sites and ammonia functionals, said active chemical sites having the property of being capable of chemically reacting with a volatile organopalladium compound exposed to said sites, said organopalladium compound being selected from the group consisting of a (cyclopentadienyl)(allyl)palladium (II) compound and a bis(allyl)palladium (II) compound; and contacting a portion of said substrate surface with a vapor of said volatile organopalladium compound for a time sufficient for said active sites to chemically react with said volatile oreganopalladium compound, the chemical reaction releasing a saturated organic ligand from said organopalladium compound and the chemical reaction forming a second compound, which is a species of said organopalladium compound, from said active site and the remainder of said organopalladium compound, said second compound adheres to said substrate surface, said second compound contains the metal constituent of said volatile organopalladium compound.
Claim 37
Independent Claim
156 words
A method for preparing an epoxy substrate surface for subsequent metallization comprising the steps of: forming active chemical sites adherent to the substrate surface, said active chemical sites having the property of being capable of chemically reacting with a volatile organopalladium compound exposed to said sites, said organopalladium compound being selected from the group consisting of a (cyclopentadienyl)(allyl)palladium (II) compound and a bis(allyl)palladium (II) compound; and contacting a portion of said substrate surface with a vapor of said volatile organopalladium compound for a time sufficient for said active sites to chemically react with said volatile organopalladium compound, the chemical reaction releasing a saturated organic ligand from said organopalladium compound and the chemical reaction forming a second compound, which is a species of said organopalladium compound, from said active site and the remainder of said organopalladium compound, said second compound adheres to said substrate surface, said second compound contains the metal constituent of said volatile organopalladium compound.
Claim 38
Independent Claim
156 words
A method for preparing an epoxy substrate surface for subsequent metallization comprising the steps of: forming active chemical sites adherent to the substrate surface, said active chemical sites having the property of being capable of chemically reacting with a volatile organopalladium compound exposed to said sites, said organopalladium compound being selected from the group consisting of a (cyclopentadienyl)(allyl)palladium (II) compound and a bis(allyl)palladium (II) compound; and contacting a portion of said substrate surface with a vapor of said volatile organopalladium compound for a time sufficient for said active sites to chemically react with said volatile organopalladium compound, the chemical reaction releasing a saturated organic ligand from said organopalladium compound and the chemical reaction forming a second compound, which is a species of said organopalladium compound, from said active site and the remainder of said organopalladium compound, said second compound adheres to said substrate surface, said second compound contains the metal constituent of said volatile organopalladium compound.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1992-09-25 | 1993-03-27 | 1993-09-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-09-25 | 1997-03-27 | 1997-09-26 | $3760.00 | Window Closed / Lapsed |
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