US4297397A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Catalytic promoters in electroless plating catalysts in true solutions
Assignee: Individual
•
Filing: 1980-04-28
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Granted: 1981-10-27
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Expires: 2000-04-28
Abstract
Abstract A composition for catalyzing a substrate prior to electroless metal deposition. The catalyst formulation comprises the admixture of a principal catalytic agent and a catalytic promoting agent. The principal catalytic agent is selected preferably from the metals of Period 4 and Groups IB and VIII of the Periodic Table of the Elements while the catalytic promoting agents are selected from metals of Period 4, 5, 6 and Groups IVB, VB, VIB, and VIIB of the Periodic Table of the Elements.
Inventors
- 👤 Nathan Feldstein
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 16:31
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/20; C23C18/28; H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
157 words
A process for the electroless metal deposition onto a non-conductor comprising: (1) contacting said non-conductor with a catalytic solution comprising the admixture of a principal catalytic agent wherein said principal catalytic agent is a compound of a metal selected from the group of metals consisting of copper, nickel, cobalt, and iron and mixtures thereof and a catalytic promoter agent wherein said catalytic promoter agent is a compound of a metal selected from the group of metals consisting of Mg, Ca, Sr, Sc, Y, La, Ti, Zr, Hf, Nb, Ta, Cr, Mn, Tc and Re and mixtures thereof and further wherein the concentrations for the principal catalytic agent and the catalytic promoter agent are so adjusted as to yield a catalytic solution having a greater catalytic activity for electroless metal deposition in comparison to the same catalytic solution in the absence of said catalytic promoter agent, and (2) contacting the treated non-conductor with an electroless metal deposition bath.
Claim 2
Dependent Claim
157 words
A process for the electroless metal deposition onto a non-conductor comprising: (1) contacting said non-conductor with a catalytic solution comprising the admixture of a principal catalytic agent wherein said principal catalytic agent is a compound of a metal selected from the group of metals consisting of copper, nickel, cobalt, and iron and mixtures thereof and a catalytic promoter agent wherein said catalytic promoter agent is a compound of a metal selected from the group of metals consisting of Mg, Ca, Sr, Sc, Y, La, Ti, Zr, Hf, Nb, Ta, Cr, Mn, Tc and Re and mixtures thereof and further wherein the concentrations for the principal catalytic agent and the catalytic promoter agent are so adjusted as to yield a catalytic solution having a greater catalytic activity for electroless metal deposition in comparison to the same catalytic solution in the absence of said catalytic promoter agent, and (2) contacting the treated non-conductor with an electroless metal deposition bath.
Claim 3
Dependent Claim
26 words
The process according to claim 1 wherein said catalytic promoter agent is selected from at least one member of the group consisting of chromium, and zirconium.
Claim 4
Dependent Claim
14 words
The process according to claim 1 wherein said electroless metal deposition is electroless copper.
Claim 5
Dependent Claim
15 words
The process according to claim 1 wherein said electroless metal deposition yields an image intensification.
Claim 6
Dependent Claim
24 words
The process according to claim 1 wherein said principal catalytic agent is copper ions in the presence of a molar excess of stannous ions.
Claim 7
Dependent Claim
13 words
The process according to claim 1 wherein said non-conductor surface is selectively catalyzed.
Claim 8
Dependent Claim
22 words
The process according to claim 1 further containing the step of activation whereby the induction time for the actual deposition is reduced.
Claim 9
Dependent Claim
11 words
The process according to claim 1 wherein said non-conductor is ABS.
Claim 10
Dependent Claim
22 words
The process according to claim 1 wherein said principal catalytic agent is a compound of copper and further contains a nickel compound.
Claim 11
Dependent Claim
22 words
The process according to claim 1 wherein said principal catalytic agent is a compound of copper and further contains a cobalt compound.
Claim 12
Dependent Claim
24 words
The process according to claim 1 wherein the concentration of the principal catalytic agent is greater than the concentration of the catalytic promoter agent.
Claim 13
Dependent Claim
39 words
The process according to claim 1 further containing the step of activation and wherein said activation comprises a reduction step and wherein said reduction may be effected via a chemical reducing agent or light or heat and combinations thereof.
Claim 14
Dependent Claim
23 words
The process according to claim 1 wherein the concentration of said catalytic promoter agent is from about 0.12 g/l to about 1.2 g/l.
Claim 15
Dependent Claim
45 words
The process according to claim 1 further containing the step of activation, said activation taking place subsequent to the contacting of said non-conductor with the catalytic solution, however prior to the step of electroless deposition, said activation encompassing contacting said non-conductor with a reducing composition.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1984-10-26 | 1985-04-27 | 1985-10-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1988-10-26 | 1989-04-27 | 1989-10-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1992-10-26 | 1993-04-27 | 1993-10-27 | $7700.00 | Window Closed / Lapsed |