US4865491A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for positioning a semiconductor wafer
Assignee: Sony Corp
•
Filing: 1988-10-11
•
Granted: 1989-09-12
•
Expires: 2008-10-11
Abstract
Abstract An improved semiconductor wafer positioning apparatus which can achieve preliminary positioning of a semiconductor wafer with accuracy. The apparatus includes a positioning stage for receiving a semiconductor wafer thereon. The positioning stage has a pair of groups of semicircular grooves formed on an upper face thereof and communicated with an air sucking and blowing ports. Thus, air is blown out from the upper face of the positioning stage so that the semiconductor wafer is rotated by a blow of air. Meanwhile, the positioning stage is inclined a small angle so that the semiconductor wafer is moved downward by its own weight on the positioning stage until a positioning element is contacted with an orientation flat of the wafer to stop rotation of the wafer, thereby positioning the wafer in position.
Inventors
- 👤 Yoshimichi Sakurai
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 10:22
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/50
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
135 words
An apparatus for positioning a semiconductor wafer, having a generally circular periphery with an orientation flat, relative to an exposure position, at which said wafer is exposed, comprising: a stage adjacent said exposure position for receiving a semiconductor wafer on an upper face thereof; a first means generating a generally circular flow of fluid between said stage and semiconductor wafer received on said stage; a second means for engaging with said orientation flat of the semiconductor wafer; a third means for inclining said stage toward said second means in the opposite direction from said exposure position; a fourth means for vacuum chucking said semiconductor wafer on said stage through openings provided on said stage, and inclining means for inclining said stage toward said exposure position, while said wafer is vacuum chucked on said upper surface.
Claim 2
Independent Claim
135 words
An apparatus for positioning a semiconductor wafer, having a generally circular periphery with an orientation flat, relative to an exposure position, at which said wafer is exposed, comprising: a stage adjacent said exposure position for receiving a semiconductor wafer on an upper face thereof; a first means generating a generally circular flow of fluid between said stage and semiconductor wafer received on said stage; a second means for engaging with said orientation flat of the semiconductor wafer; a third means for inclining said stage toward said second means in the opposite direction from said exposure position; a fourth means for vacuum chucking said semiconductor wafer on said stage through openings provided on said stage, and inclining means for inclining said stage toward said exposure position, while said wafer is vacuum chucked on said upper surface.
Claim 3
Dependent Claim
21 words
An apparatus according to claim 1, wherein said stage has a plurality of air directing grooves formed on a surface thereof.
Claim 4
Dependent Claim
20 words
An apparatus according to claim 1 or 2, wherein said first means is provided in the inside of said grooves.
Claim 5
Dependent Claim
16 words
An apparatus according to claim 2, wherein said grooves are separated into a plurality of groups.
Claim 6
Dependent Claim
18 words
An apparatus according to claim 2, wherein said grooves extend circularly in a concentrical relationship to each other.
Claim 7
Dependent Claim
15 words
An apparatus according to claim 5, wherein said grooves are interconnected by a connecting groove.
Claim 8
Dependent Claim
17 words
An apparatus according to claim 1, wherein the flow makes the semiconductor wafer kept above said stage.
Claim 9
Dependent Claim
14 words
An apparatus according to claim 1, wherein said first means generates an air flow.
Claim 10
Dependent Claim
23 words
An apparatus according to claim 1, wherein said first means is also capable of making vacuum between the semiconductor wafer and said stage.
References Cited (Backward Citations)
US3865254A
Cited
US3890508A
Cited
US3982627A
Cited
US4165132A
Cited
US4242038A
Cited
US4348139A
Cited
US4425075A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-09-11 | 1993-03-13 | 1993-09-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-09-11 | 1997-03-13 | 1997-09-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-09-11 | 2001-03-13 | 2001-09-12 | $7700.00 | Window Closed / Lapsed |