Patent US4859722A successfully refreshed from Google Patents.
US4859722A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Epoxy resin composition
Assignee: Shin-Etsu Chemical Co Ltd
•
Filing: 1988-03-16
•
Granted: 1989-08-22
•
Expires: 2008-03-16
Abstract
Abstract An epoxy resin composition which comprises a curable epoxy resin, a hardener, and a block copolymer formed by the reaction of a triphenol-alkane type resin or a polymer thereof with a specific organopoly-siloxane. The composition provides a cured product having a high glass transition point, a low coefficient of expansion, good crack resistance, and is less likely to exert stress to the semiconductor devices. It exhibits distinct characteristics when used as a sealing compound for semiconductor devices, especially in the case where the element is bonded directly to a printed circuit board or heat sink. It is very unlikely that a semiconductor device sealed with it would become warped.
Inventors
- 👤 Toshio Shiobara
- 👤 Kazutoshi Tomiyoshi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 18:53
CPC Classifications
H; H01; H01B; H01B3/00; H01B3/18; H01B3/30; H01B3/40; C; C08; C08G; C08G59/00; C08G59/18; C08G59/20; C08G59/32; C08G59/3218; C08L; C08L63/00; C08L83/00; C08L83/10
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
129 words
An epoxy resin composition which comprises a curable epoxy resin, a curing agent, and a block copolymer formed by the reaction of a compound represented by the formula (1) below or an oligomer thereof, ##STR19## where R 1 denotes a hydrogen atom, ##STR20## or a monovalent organic group; R 2 denotes a monovalent hydrocarbon group having 1 to 10 carbon atoms; X denotes a halogen atom; l denotes an integer of 1 or 2; m and n each denote an integer of 0 to 2; and l+m+n≦5 with an organopolysiloxane represented by the formula (2) below, R.sup.3.sub.a R.sup.4.sub.b SiO.sub.(4-[a+b])/2 ( 2) where R 3 denotes a hydrogen atom, haloen atom, hydroxyl group, alkoxyl group, or substituted monovalent hydrocarbon group; R 4 denotes monovalent organic group; 0.001≦a≦2, 1≦b<3, and 1.001≦a+b≦3.
Claim 2
Dependent Claim
129 words
An epoxy resin composition which comprises a curable epoxy resin, a curing agent, and a block copolymer formed by the reaction of a compound represented by the formula (1) below or an oligomer thereof, ##STR19## where R 1 denotes a hydrogen atom, ##STR20## or a monovalent organic group; R 2 denotes a monovalent hydrocarbon group having 1 to 10 carbon atoms; X denotes a halogen atom; l denotes an integer of 1 or 2; m and n each denote an integer of 0 to 2; and l+m+n≦5 with an organopolysiloxane represented by the formula (2) below, R.sup.3.sub.a R.sup.4.sub.b SiO.sub.(4-[a+b])/2 ( 2) where R 3 denotes a hydrogen atom, haloen atom, hydroxyl group, alkoxyl group, or substituted monovalent hydrocarbon group; R 4 denotes monovalent organic group; 0.001≦a≦2, 1≦b<3, and 1.001≦a+b≦3.
Claim 3
Dependent Claim
40 words
The epoxy resin composition as claimed in claim 1, wherein the content of the block copolymer is 1 to 100 parts by weight per 100 parts by weight of the total amount of the curable epoxy resin and curing agent.
Claim 4
Dependent Claim
43 words
The epoxy resin composition as claimed in claim 1, wherein an inorganic filler is blended in an amount of from 100 to 1000 parts by weight per 100 parts by weight of the total of said curable epoxy resin and said curing agent.
Claim 5
Dependent Claim
19 words
The epoxy resin composition as claimed in claim 1, wherein R 1 of formula (1) is an alkenyl group.
Claim 6
Dependent Claim
17 words
The epoxy resin composition as claimed in claim 1, wherein R 1 of formula (1) is ##STR21##
Claim 7
Dependent Claim
21 words
The epoxy resin composition as claimed in claim 1, wherein R 1 of formula (1) is --CH 2 CH═CH 2 .
Claim 8
Dependent Claim
30 words
The epoxy resin composition as claimed in claim 1, wherein R 2 of formula (1) is selected from the group consisting of methyl, ethyl, propyl, allyl, t-butyl, octyl and nonyl.
Claim 9
Dependent Claim
50 words
The epoxy resin composition as claimed in claim 1, wherein R 3 of formula (2) is a substituted monovalent hydrocarbon group selected from the group consisting of --CH 2 NH 2 , --CH 2 CH 2 CH 2 NH 2 , ##STR22## and ClCH 2 CH 2 CH 2 --.
Claim 10
Dependent Claim
31 words
The epoxy resin composition as claimed in claim 1, wherein R 4 of formula (2) is a monovalent organic group selected from the group consisting of methyl, ethyl, phenyl and benzyl.
Claim 11
Dependent Claim
43 words
The epoxy resin composition as claimed in claim 1, further comprising a monoepoxy compound selected from the group consisting of styrene oxide, cyclohexene oxide, propylene oxide, methylene glycidyl ether, ethyl glycidyl ether, phenyl glycidyl ether, allyl glycidyl ether, octylene oxide, and dodecene oxide.
Claim 12
Dependent Claim
28 words
The epoxy resin composition as claimed in claim 1, wherein the curable epoxy resin is selected from the group consisting of epoxy novolak resin and alicyclic epoxy resin.
Claim 13
Dependent Claim
21 words
The epoxy rsin composition as claimed in claim 1, wherein the curable epoxy resin is in epoxy resin having halogen atoms.
Claim 14
Dependent Claim
38 words
The epoxy resin composition as claimed in claim 1, wherein the curing agent is selected from the group consisting of diaminodiphenyl-methane, diaminodiphenylsulfone, and metaphenylenediamine, phthalic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic anhydride, phenol novolak, cresol novolak and triphenol alkanes.
Claim 15
Dependent Claim
17 words
The epoxy resin composition as claimed in claim 1, further comprising an accelerator for the curing agent.
Claim 16
Dependent Claim
29 words
The epoxy resin composition as claimed in claim 14, wherein the accelerator is selected from the group consisting of an imidazole, a tertiary amine, a phosphine and a cycloamidine.
Claim 17
Dependent Claim
33 words
The epoxy resin composition as claimed in claim 3, wherein the inorganic filler is selected from the group consisting of natural silica, synthetic high-purity silica, talc, mica, silicon nitride, boron nitride and alumina.
Claim 18
Dependent Claim
16 words
The epoxy resin composition claimed in claim 3 wherein the inorganic filler is synthetic spherical silica.
References Cited (Backward Citations)
US3407169A
Cited
US4720515A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-08-21 | 1993-02-20 | 1993-08-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-08-21 | 1997-02-20 | 1997-08-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-08-21 | 2001-02-20 | 2001-08-22 | $7700.00 | Window Closed / Lapsed |