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US4857983A Expired / Lapsed US ⏱️ 0.0 years remaining

Monolithically integrated semiconductor device having bidirectional conducting capability and method of fabrication

Assignee: Fairchild Semiconductor Corp
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Filing: 1987-05-19
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Granted: 1989-08-15
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Expires: 2007-05-19
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Abstract

Abstract The present invention relates generally to monolithically integrated insulated gate semiconductor devices and more particularly to an improved structure which provides for high current density, low voltage drop conduction in both forward and reverse directions. More particularly, a single insulated gate device can initiate and interrupt current flow in both the forward and reverse directions.

Inventors

  • 👤 Bantval J. Baliga
  • 👤 Deva N. Pattanayak

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-31 19:50
CPC Classifications
H; H10; H10D; H10D84/00; H10D84/101; H10D84/121; H10D18/00; H10D18/60; H10D18/65; H10D18/655; H10D84/131

Claims Analysis

Total Claims: 25
Claim 1
Independent Claim 215 words
A monolithically integrated insulated gate semiconductor device comprising: a first layer of one type conductivity; a second layer of opposite type conductivity a first region of opposite type conductivity disposed within said first layer said first layer and said first region each forming a portion of a first surface of said device; second and third regions of one type conductivity disposed in said second layer and forming PN junctions therewith; a fourth region of opposite type conductivity disposed within said second region, said second layer and said second and fourth regions each forming a portion of a second surface of said device; fifth and sixth regions of opposite type conductivity disposed within said third region and forming PN junctions therewith, said fifth and sixth regions being disposed in opposed relation with a portion of said third region disposed therebetween, said third, fifth and sixth regions each forming a portion of said second surface of said device; a first electrode disposed in ohmic contact with said second, third, fourth and sixth regions; a second electrode disposed in ohmic contact with said first layer and said first region; insulated gate means for coupling said fourth and fifth regions to said second layer; and an additional insulated gate structure for coupling said fifth region to said sixth region.
Claim 2
Dependent Claim 215 words
A monolithically integrated insulated gate semiconductor device comprising: a first layer of one type conductivity; a second layer of opposite type conductivity a first region of opposite type conductivity disposed within said first layer said first layer and said first region each forming a portion of a first surface of said device; second and third regions of one type conductivity disposed in said second layer and forming PN junctions therewith; a fourth region of opposite type conductivity disposed within said second region, said second layer and said second and fourth regions each forming a portion of a second surface of said device; fifth and sixth regions of opposite type conductivity disposed within said third region and forming PN junctions therewith, said fifth and sixth regions being disposed in opposed relation with a portion of said third region disposed therebetween, said third, fifth and sixth regions each forming a portion of said second surface of said device; a first electrode disposed in ohmic contact with said second, third, fourth and sixth regions; a second electrode disposed in ohmic contact with said first layer and said first region; insulated gate means for coupling said fourth and fifth regions to said second layer; and an additional insulated gate structure for coupling said fifth region to said sixth region.
Claim 3
Dependent Claim 17 words
The semiconductor device of claim 1 wherein said third region includes a heavily doped ohmic contact portion.
Claim 4
Dependent Claim 15 words
The semiconductor device of claim 1 wherein said sixth region overlaps said ohmic contact portion.
Claim 5
Dependent Claim 26 words
The semiconductor device of claim 1 wherein, at said second surface, said second region comprises a heavily doped central portion and a lightly doped peripheral portion.
Claim 6
Dependent Claim 32 words
The semiconductor device of claim 4 wherein said peripheral portion of said second region is shallower than said central portion of said second region and surrounds a portion of said central portion.
Claim 7
Dependent Claim 20 words
The semiconductor device recited in claim 1 wherein: said fifth region is free of ohmic connections to said first electrode.
Claim 8
Dependent Claim 17 words
The semiconductor device of claim 6 wherein said third region includes a heavily doped ohmic contact portion.
Claim 9
Dependent Claim 29 words
The semiconductor device of claim 1 wherein said second region forms a first junction wtih said second layer and said first junction is reverse biased under forward operating conditions.
Claim 10
Dependent Claim 29 words
The semiconductor device of claim 1 wherein said second layer forms a second junction with said first layer and said second junction is reverse biased under reverse operating conditions.
Claim 11
Dependent Claim 49 words
The semiconductor device recited in claim 1 wherein said insulated gate means comprises: a first insulated gate structure for coupling said fifth region to said second layer; and a second insulated gate structure separate from said first insulated gate structure for coupling said fourth region to said second layer.
Claim 12
Dependent Claim 74 words
The semiconductor device of claim 10 wherein when a main bias is applied across said first and second electrodes of a polarity to cause reverse conduction and said device is conducting: said second insulated gate, in response to the application of an appropriate bias, couples said fourth region to said second layer to interrupt conduction in a four layer structure comprising said first region, said first layer, said second layer and said second region.
Claim 13
Dependent Claim 73 words
The semiconductor device of claim 1 wherein when a main bias is applied across said first and second electrodes of a polarity to cause forward conduction and said device is conducting: said additional insulated gate, in response to the application of an appropriate bias, decouples said fifth region from said sixth region to interrupt current flow in a four layer structure comprising said first and second layers and said third and fifth regions.
Claim 14
Dependent Claim 39 words
The semiconductor device of claim 10 wherein said fourth region, in combination with said second layer, defines a channel portion of said second region and said second insulated gate is disposed above said channel portion of said second region.
Claim 15
Dependent Claim 39 words
The semiconductor device of claim 10 wherein said fifth region, in combination with said second layer, defines a channel portion of said third region and said first insulated gate is disposed above said channel portion of said second region.
Claim 16
Dependent Claim 15 words
The semiconductor device of claim 6 wherein said sixth region overlaps said ohmic contact portion.
Claim 17
Dependent Claim 26 words
The semiconductor device of claim 6 wherein, at said second surface, said second region comprises a heavily doped central portion and a lightly doped peripheral portion.
Claim 18
Dependent Claim 32 words
The semiconductor device of claim 16 wherein said peripheral portion of said second region is shallower than said central portion of said second region and surrounds a portion of said central portion.
Claim 19
Dependent Claim 49 words
The semiconductor device recited in claim 6 wherein said insulated gate means comprises: a first insulated gate structure for coupling said fifth region to said second layer; and a second insulated gate structure separate from said first insulated gate structure for coupling said fourth region to said second layer.
Claim 20
Dependent Claim 39 words
The semiconductor device of claim 18 wherein said fourth region, in combination with said second layer, defines a channel portion of said second region and said second insulated gate is disposed above said channel portion of said second region.
Claim 21
Dependent Claim 39 words
The semiconductor device of claim 18 wherein said fifth region, in combination with said second layer, defines a channel portion of said third region and said first insulated gate is disposed above said channel portion of said second region.
Claim 22
Dependent Claim 29 words
The semiconductor device of claim 12 wherein said second region forms a first junction with said second layer and said first junction is reverse biased under forward operating conditions.
Claim 23
Dependent Claim 29 words
The semiconductor device of claim 6 wherein said second layer forms a second junction with said first layer and said second junction is reverse biased under reverse operating conditions.
Claim 24
Dependent Claim 74 words
The semiconductor device of claim 18 wherein when a main bias is applied across said first and second electrodes of a polarity to cause reverse condition and said device is conducting: said second insulated gate, in response to the application of an appropriate bias, couples said fourth region to said second layer to interrupt conduction in a four layer structure comprising said first region, said first layer, said second layer and said second region.
Claim 25
Dependent Claim 73 words
The semiconductor device of claim 6 wherein when a main bias is applied across said first and second electrodes of a polarity to cause forward conduction and said device is conducting: said additional insulated gate, in response to the application of an appropriate bias, decouples said fifth region from said sixth region to interrupt current flow in a four layer structure comprising said first and second layers and said third and fifth regions.

References Cited (Backward Citations)

US4199774A Cited
US4364073A Cited
US4443931A Cited
US4604638A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1992-08-14 1993-02-13 1993-08-15 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1996-08-14 1997-02-13 1997-08-15 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2000-08-14 2001-02-13 2001-08-15 $7700.00 Window Closed / Lapsed

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