Semiconductor laser having an active layer and cladding layer

Claim 2

A semiconductor laser, comprising: an active layer; a cladding layer on the active layer; a contact layer on the cladding layer; a second electrode formed below the active layer; a first electrode formed above the contact layer; the active layer, cladding layer and contact layer each formed of semiconductors of elements from Groups III-V; the contact layer and cladding layer formed into an elongated projecting rib, with the cladding layer including a remaining planar portion disposed on the active layer, the rib containing a cavity formed along the widthof the rib along a portion of its length; and a high resistance film of a semiconductor of elements from Groups II-VI disposed on each side of the rib supported on the remaining cladding layer planar portion.

Claim 3

The semiconductor laser of claim 1, wherein the width of the base of the rib above the active layer is between 0.5 and 10.0 μm and the thickness of the remaining cladding layer planar portion on the active layer between the active layer and the high resistance film is between 0 and 2.0 μm.

Claim 4

The semiconductor laser of claim 1, wherein the junction between a side face of the projecting rib and the remaining cladding layer planar portion is an angle between 50° and 120°.

Claim 5

The semiconductor laser of claim 1, wherein the rib has an inverted trapezoidal shape with side faces inclining upwardly towards the base of the trapezoid.

Claim 6

The semiconductor laser of claim 1, wherein said active layer is flat, the width of the rib is dimensioned so that a wave guide formed by the high resistance film forms an index-guided structure near an end face of the cavity and wide enough to form a gain-guided structure in the center of the cavity.

Claim 7

The semiconductor laser of claim 5, further comprising a striped electrode for controlling the current flow path disposed on the upper portion of the wave guide.

Claim 8

The semiconductor laser of claim 5, wherein the length of the region of the index-guided structure is between 10 and 500 μm on the light output side, the length of the gain-guided region is between 10 and 500 μm, the width of the index guided region is between 1 and 10 μm, the width of the gain-guided structure is at least 5 μm and the width of the stripe which controls the current flow path is between 1 and 10 μm.

Claim 9

The semiconductor laser of claim 5, wherein the width of the rib in the index-guided region is between 0.5 and 10 μm and the thickness of the remaining cladding layer planar portion on the active layer between the active layer and the high resistance film is between 0 and 2.0 μm.

Claim 10

The semiconductor laser of claim 5, wherein the angle between the side face of the rib in the ndex-guided region and the remaining cladding layer planar portion is between 50° and 120°.

Claim 11

The semiconductor laser of claim 5, wherein the relationship between the length of the index-guided region and the length of the gain-guided region is represented by the following equations: l.sub.2 ≠l.sub.3, l.sub.1 ≠l.sub.2 0.3≦l.sub.2 /(l.sub.1 +l.sub.3)≦10 wherein l 1 and l 3 are the length of the index guided region and l 2 is the length of the gain-guided region.

Claim 12

The semiconductor laser of claim 1, wherein the high resistance film is made of ZnSe, the cladding layer is made of AlGaAs and the active layer is flat and made of either GaAs or AlGaAs.

Claim 13

The semiconductor laser of claim 2, wherein the active layer is flat, the angle between a side face of the rib and the junction with the remaining cladding layer planar portion is between 50° and 120°.

Claim 14

The semiconductor laser of claim 2, wherein the active layer is flat, the width of the rib is dimensioned so that a wave guide formed by the high resistance film forms an index-guided structure near an end face of a cavity formed by the laser and wide enough to form a gain-guided structure in the center of the cavity.

Claim 15

The semiconductor laser of claim 3, wherein the active layer is flat, the width of the rib is dimensioned so that a wave guide formed by the insulating layer forms an index-guided structure near an end face of a cavity formed by the laser and wide enough to form a gain-guided structure in the center of the cavity.

Claim 16

The semiconductor laser of claim 12 wherein the active layer is flat, the width of the rib is dimensioned so that a wave guide formed by the high resistance film forms an index guided structure near an end surface of the cavity and wide enough to form a gain-guided structure in the center of the cavity, wherein the relationship between the length of the gain-guided region and the length of the index guided region is represented by the following equations: l.sub.2 ≠l.sub.3, l.sub.1 ≠l.sub.2 0.3≦l.sub.2 /(l.sub.1 +l.sub.3)≦10 wherein l 1 and l 3 are the length of the index guided region and l 2 is the length of the gain-guided region.

Claim 17

The semiconductor laser of claim 13, wherein the relationship between the length of the index-guided region and the length of the gain-guided region is represented by the following equations: l.sub.2 ≠l.sub.3, l.sub.1 ≠l.sub.2 0.3≦l.sub.2 /(l.sub.1 +l.sub.3)≦10 wherein l 1 and l 3 are the length of the index guided region l 2 is the length of the gain-guided region.

Claim 18

The semiconductor laser of claim 14, wherein the relationship between the length of the index-guided region and the length of the gain-guided region is represented by the following equations: l.sub.2 ≠l.sub.3, l.sub.1 ≠l.sub.2 0.3≦l.sub.2 /(l.sub.1 +l.sub.3)≦10 wherein l 1 and l 3 are the length of the index guided region and l 2 is the length of the gain-guided region.

Claim 19

The semiconductor laser of claim 17, wherein the high resistance film in ZnSe, the cladding layer is AlGaAs and the active layer is either GaAs or AlGaAs.

Claim 20

The semiconductor laser of claim 1, further including a lower cladding layer, the active layer being disposed on the lower cladding layer.

Claim 21

The semiconductor laser of claim 19, wherein the width of the base of the rib above the active layer is between 0.5 and 10.0 μm and the thickness of the remaining cladding layer planar portion on the active layer between the active layer and high resistance film is between 0 and 2.0 μm.

Claim 22

The semiconductor laser of claim 19, wherein the junction between a side face of the projecting rib and the remaining cladding layer planar portion is an angle between 50° and 120°.

Claim 23

The semiconductor laser of claim 19, wherein the active layer is flat and further including a cavity formed along the width of the rib along a portion of its length, the width of the rib is dimensioned so that a wave guide formed by the high resistance layer forms an index-guided structure near an end face of the cavity and wide enough to form a gain-guided structure in the center of the cavity.

Claim 24

The semiconductor laser of claim 22, wherein the relationship between the length of the index guided region and the length of the gain-guided region is represented by the following equations: l.sub.2 ≠l.sub.3, l.sub.1 ≠l.sub.2 0.3≦l.sub.2 /(l.sub.1 +l.sub.3)≦10 wherein l 1 and l 3 are the length of the index guided region and l 2 is the length of the gain-guided region.

Claim 25

A double heterostructure semiconductor laser, comprising: a substrate; a first cladding layer on the substrate; an active layer on the first cladding layer; a second cladding layer on the active layer; a contact layer on the second cladding layer; a first electrode formed above the contact layer; a second electrode formed belwo the substrate the active layer, cladding layers and contact layer each formed of semiconductors of elements from Groups III-V; the contact layer and second cladding layer formed into an elongated projecting rib, with the cladding layer including a remaining planar portion disposed across the active layer, the rib containing a cavity formed along the width of the rib along a portion of its length; and a high resistance film of a semiconductor element from Groups II-VI disposed on each side of the rib supported on the remaining cladding layer planar portion.

Claim 26

A double heterostructure semiconductor laser, comprising: a substrate; a first cladding layer on the substrate; an active layer on the first cladding layer; a second cladding layer on the active layer; a contact layer on the second cladding layer; a first electrode formed above the contact layer; a second electrode formed belwo the substrate the active layer, cladding layers and contact layer each formed of semiconductors of elements from Groups III-V; the contact layer and second cladding layer formed into an elongated projecting rib, with the cladding layer including a remaining planar portion disposed across the active layer, the rib containing a cavity formed along the width of the rib along a portion of its length; and a high resistance film of a semiconductor element from Groups II-VI disposed on each side of the rib supported on the remaining cladding layer planar portion.

Claim 27

The semicondutor laser of claim 11, wherein the zinc source of the high resistance film is formed by metal organic chemical vapor deposition using a zinc organic as the zinc source.

Claim 28

The semiconductor laser of claim 25, wherein the zinc organic is an adduct of dyalchozinc and dyalchosulenium.