Tapered laser or waveguide optoelectronic method

Claim 1

A method for forming regions of varying thickness of Group III-V material compound layers and varying ratio of the Group III materials relative to each other in the compound layers to produce compound semiconductor layers with varying bandgap on a substrate comprising the steps of: (a) providing a substrate in an epitaxial growth chamber; (b) bringing the substrate to a first warmer growth temperature in one region of the substrate and to a second cooler growth temperature in another region of the substrate; (c) introducing at least two Group III semiconductor materials and a Group V semiconductor material into the chamber and growing said materials over said substrate, such that a compound III-V material layer is formed over the substrate which layer varies in thickness from one region to another in accordance with the sticking coefficients of the Group III materials some of which sticking coefficients are lower at a higher temperature and because of this the thickness of the compound layer is greater over the region of the lower temperature than in the region of the warmer temperature and the content of the Group III material with the lower sticking coefficient at higher temperature is greater over the region of the lower temperature than in the region of the warmer temperature to produce a change in bandgap of the compound III-V material layer across the layer in accordance with the temperature change in the different regions of the substrate.

Claim 2

A method for forming regions of varying thickness of Group III-V material compound layers and varying ratio of the Group III materials relative to each other in the compound layers to produce compound semiconductor layers with varying bandgap on a substrate comprising the steps of: (a) providing a substrate in an epitaxial growth chamber; (b) bringing the substrate to a first warmer growth temperature in one region of the substrate and to a second cooler growth temperature in another region of the substrate; (c) introducing at least two Group III semiconductor materials and a Group V semiconductor material into the chamber and growing said materials over said substrate, such that a compound III-V material layer is formed over the substrate which layer varies in thickness from one region to another in accordance with the sticking coefficients of the Group III materials some of which sticking coefficients are lower at a higher temperature and because of this the thickness of the compound layer is greater over the region of the lower temperature than in the region of the warmer temperature and the content of the Group III material with the lower sticking coefficient at higher temperature is greater over the region of the lower temperature than in the region of the warmer temperature to produce a change in bandgap of the compound III-V material layer across the layer in accordance with the temperature change in the different regions of the substrate.

Claim 8

A method for forming regions of varying thickness of GaAs compound layers comprising the steps of: (a) providing a substrate in an a molecular beam epitaxial chamber; (b) bringing the substrate to a high temperature in one region on the substrate and to a lower temperature in another region of the substrate; (c) introducing a flux of Ga material and a flux of As material into said chamber and growing said materials over said substrate, such that a Ga As material layer is formed over the substrate which layer varies in thickness in accordance with the sticking coefficient of the Ga and wherein the thickness is greater over the region of the cooler temperature than in the region of the warmer temperature.

Claim 9

A method for forming regions of varying thickness of GaAs compound layers comprising the steps of: (a) providing a substrate in an a molecular beam epitaxial chamber; (b) bringing the substrate to a high temperature in one region on the substrate and to a lower temperature in another region of the substrate; (c) introducing a flux of Ga material and a flux of As material into said chamber and growing said materials over said substrate, such that a Ga As material layer is formed over the substrate which layer varies in thickness in accordance with the sticking coefficient of the Ga and wherein the thickness is greater over the region of the cooler temperature than in the region of the warmer temperature.

Claim 12

The method of forming optical guiding channels with unguided regions comprising the steps of: (a) forming a first cladding layer of cladding material formed of a III-V alloy of GaAlAs on a suitable substrate; (b) heating the substrate to form growth temperature regions of higher temperature separated from growth temperature regions of lower temperature by a transition growth temperature region in which the temperature gradually decreases to said lower temperature; (c) growing an updoped III-V layer of a III-V alloy on said first cladding layer by introducing group III elements, aluminum, and gallium, along with a group V element, arsenic, into a chamber with said heated substrate such that in the region of the lower temperature the III-V layer is thicker and of lower bandgap than in the region of higher temperature; and (d) forming a second cladding layer as in (a) over the layer formed in step (c).

Claim 13

The method of forming optical guiding channels with unguided regions comprising the steps of: (a) forming a first cladding layer of cladding material formed of a III-V alloy of GaAlAs on a suitable substrate; (b) heating the substrate to form growth temperature regions of higher temperature separated from growth temperature regions of lower temperature by a transition growth temperature region in which the temperature gradually decreases to said lower temperature; (c) growing an updoped III-V layer of a III-V alloy on said first cladding layer by introducing group III elements, aluminum, and gallium, along with a group V element, arsenic, into a chamber with said heated substrate such that in the region of the lower temperature the III-V layer is thicker and of lower bandgap than in the region of higher temperature; and (d) forming a second cladding layer as in (a) over the layer formed in step (c).

Claim 14

A method of forming an optical antenna comprising the steps of: (a) forming a first aluminum gallium arsenide cladding layer on a uniformly heated substrate; (b) forming an aluminum gallium arsenide guiding layer on said first cladding layer while said substrate is heated non-uniformly with a gradient thermal profile causing a transition region in said guiding layer wherein the thickness and gallium content of the guiding layer gradually changes in accordance with the thermal profile.

Claim 15

A method of forming an optical antenna comprising the steps of: (a) forming a first aluminum gallium arsenide cladding layer on a uniformly heated substrate; (b) forming an aluminum gallium arsenide guiding layer on said first cladding layer while said substrate is heated non-uniformly with a gradient thermal profile causing a transition region in said guiding layer wherein the thickness and gallium content of the guiding layer gradually changes in accordance with the thermal profile.