Patent US4851695A successfully refreshed from Google Patents.
US4851695A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Optoelectronic coupling element with transparent spacer elements
Assignee: Siemens AG
•
Filing: 1987-09-10
•
Granted: 1989-07-25
•
Expires: 2007-09-10
Abstract
Abstract An optoelectronic coupling element with a light-emitting semiconductor component (1), in particular a transmitter chip, and a light-receiving semiconductor component (2), in particular a receiver chip, are firmly joined together via an optic coupling medium (3). The construction of this compact coupling element is to require relatively little expense and thus to be cost-effective. To this end the invention provides that the light-emitting semiconductor component (1) and the light-receiving semiconductor component (2) are connected together directly through the coupling medium (3), and that the coupling medium (3) is a transparent adhesive or glass solder compound. The optoelectronic coupling element disclosed is highly suitable for use as an optocoupler for signal transmission.
Inventors
- 👤 Karl-Ulrich Stein
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 02:59
CPC Classifications
H; H10; H10F; H10F55/00; H10F55/20; H10F55/25; H10W; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/732
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
107 words
An optoelectronic coupling element comprising: a light-emitting semiconductor component in the form of a light-emitting semiconductor chip, and a light-receiving semiconductor component in the form of a receiver chip, an optical coupling medium providing the sole means for mechanically securing one of the chips to the other of the chips, the optical coupling medium is selected from the group consisting of a transparent adhesive and glass solder compound for directly joining together the light-emitting semiconductor chip and the light-receiving semiconductor chip, and transparent spacer particles are included in the coupling medium between the light-emitting chip and the light-receiving chip to serve as spacers for electrical isolation purposes.
Claim 2
Dependent Claim
107 words
An optoelectronic coupling element comprising: a light-emitting semiconductor component in the form of a light-emitting semiconductor chip, and a light-receiving semiconductor component in the form of a receiver chip, an optical coupling medium providing the sole means for mechanically securing one of the chips to the other of the chips, the optical coupling medium is selected from the group consisting of a transparent adhesive and glass solder compound for directly joining together the light-emitting semiconductor chip and the light-receiving semiconductor chip, and transparent spacer particles are included in the coupling medium between the light-emitting chip and the light-receiving chip to serve as spacers for electrical isolation purposes.
Claim 3
Dependent Claim
25 words
An optoelectronic coupling element according to claim 1, wherein the spacer particles are selected from the group consisting of glass fiber segments and glass balls.
Claim 4
Dependent Claim
29 words
An optoelectronic coupling element according to claim 1, wherein the dimensions of the spacer particles determine the given distance between the light-emitting semiconductor component and the light-receiving semiconductor component.
Claim 5
Dependent Claim
29 words
An optoelectronic coupling element according to claim 2, wherein the dimensions of the spacer particles determine the given distance between the light-emitting semiconductor component and the light-receiving semiconductor component.
Claim 6
Independent Claim
82 words
A method for producing an optoelectronic coupling element, wherein the construction is performed in the steps of: providing a lead-frame as a support and connecting medium, securing a first area chip to the connecting medium by bonding thereon, providing a transparent coupling medium including transparent spacers, and fastening a second area chip directly on the first area chip using the transparent coupling medium wherein at least two the transparent spacers are located between the first area chip and the second area chip.
Claim 7
Independent Claim
82 words
A method for producing an optoelectronic coupling element, wherein the construction is performed in the steps of: providing a lead-frame as a support and connecting medium, securing a first area chip to the connecting medium by bonding thereon, providing a transparent coupling medium including transparent spacers, and fastening a second area chip directly on the first area chip using the transparent coupling medium wherein at least two the transparent spacers are located between the first area chip and the second area chip.
Claim 8
Dependent Claim
23 words
A method according to claim 5, further comprising the step of coating the arrangement in an envelope of a non-transparent but reflecting medium.
Claim 9
Dependent Claim
24 words
A method according to claim 5, further comprising the step of selecting the first area chip to be larger than the second area chip.
Claim 10
Dependent Claim
36 words
A method according to claim 5, wherein the first area chip is selected to be responsive to light and the second area chip is selected to provide light emission to which the first area chip responds.
References Cited (Backward Citations)
US3229104A
Cited
US3938173A
Cited
US4100562A
Cited
US4412135A
Cited
US4446375A
Cited
US4533833A
Cited
EP0150929A2
Cited
US4588261A
Cited
US4719358A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-07-24 | 1993-01-23 | 1993-07-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-07-24 | 1997-01-23 | 1997-07-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-07-24 | 2001-01-23 | 2001-07-25 | $7700.00 | Window Closed / Lapsed |