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Gaseous cleaning method for silicon devices

Assignee: Eastman Kodak Co
•
Filing: 1988-12-23
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Granted: 1989-07-18
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Expires: 2008-12-23
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Abstract

Abstract A method for cleaning the surface of a silicon semiconductor device comprising the steps of: (a) exposing, for a first time, said device for a predetermined time period to an anhydrous cleaning gas mixture containing nitric oxide and hydrogen chloride together with an inert carrier gas; and (b) exposing, for a second time, said device for a predetermined second time period to a gaseous plasma formed of CF4, H2 and N2 at RF power.

Inventors

  • 👤 Ronald Gluck
  • 👤 David P. Hamblen

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-01 20:11
CPC Classifications
H; H10; H10P; H10P70/00; H10P70/10; H10P70/12; Y; Y10; Y10S; Y10S148/00; Y10S148/017

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 98 words
A method for the manufacture of a silicon semiconductor device in which metallic impurities and a silicon oxynitrochloride film is removed from the surface of said device, said method comprising in sequence the steps of: (a) exposing, for a first time, said device for a predetermined time period to an anhydrous cleaning gas mixture containing nitric oxide and hydrogen chloride together with an inert carrier gas; and (b) exposing, for a second time, said device for a predetermined second time period to a gaseous plasma formed of CF 4 , H 2 and N 2 at RF power.
Claim 2
Independent Claim 98 words
A method for the manufacture of a silicon semiconductor device in which metallic impurities and a silicon oxynitrochloride film is removed from the surface of said device, said method comprising in sequence the steps of: (a) exposing, for a first time, said device for a predetermined time period to an anhydrous cleaning gas mixture containing nitric oxide and hydrogen chloride together with an inert carrier gas; and (b) exposing, for a second time, said device for a predetermined second time period to a gaseous plasma formed of CF 4 , H 2 and N 2 at RF power.
Claim 3
Dependent Claim 19 words
The method of claim 1 wherein sequence of steps (a) and (b) is repeated at least one more time.
Claim 4
Dependent Claim 25 words
The method of claim 1 wherein step (a) is carried out using an RF plasma of the cleaning gas mixture at temperatures below 1100° C.
Claim 5
Dependent Claim 19 words
The method of claim 3 wherein sequence of steps (a) and (b) is repeated a multiple number of times.
Claim 6
Dependent Claim 32 words
The method of claim 1 wherein during step (a) the device is heated between 850 to 1100° C. and in step (b) the device is heated between 115° C. and 200° C.
Claim 7
Dependent Claim 17 words
The method of claim 5 wherein steps (a) and (b) is repeated a multiple number of times.

References Cited (Backward Citations)

US4159917A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1992-07-17 1993-01-16 1993-07-18 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1996-07-17 1997-01-16 1997-07-18 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2000-07-17 2001-01-16 2001-07-18 $7700.00 Window Closed / Lapsed

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