Patent US4849070A successfully refreshed from Google Patents.
US4849070A
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Process for fabricating three-dimensional, free-standing microstructures
Assignee: United States Department of the Army
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Filing: 1988-09-14
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Granted: 1989-07-18
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Expires: 2008-09-14
Abstract
Abstract A sublimable layer is deposited on a substrate, holes are etched through sublimable layer, a thin-layer structure is deposited on portions of the remaining sublimable layer, and a thick structural support material is deposited to cover the sides and bottoms of the holes and portions of the thin-layer structure. When the sublimable layer is sublimed with the heat, photon enhancement (ultraviolet light) and oxygen purging, a structure is left which consists of a thin layer or layers supported by posts above a substrate.
Inventors
- 👤 Vincent T. Bly
- 👤 Alan P. Bradford
- 👤 J. Thomas Cox
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 06:09
CPC Classifications
B; B81; B81C; B81C1/00; B81C1/00436; B81C1/00444; B81C1/00468; B81C1/00476; B33; B33Y; B33Y10/00; G; G01; G01L; G01L9/00; G01L9/0041; G01L9/0042; H; H10; H10N; H10N19/00; B81B; B81B2201/00; B81B2201/02; B81B2201/0207; B81B2201/04; B81B2201/042
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
159 words
A method of fabricating a three-dimensional, free-standing microstructure including the steps of: preparing a substrate for said microstructure; depositing a sacrificial layer on said substrate; removing at least a portion of said layer in a desired pattern to form holes through said sacrificial layer which expose portions of said substrate, said holes having bottoms and having sloping sides defined by the remaining sacrificial layer; depositing at least one relatively thin layer in a pattern atop said sacrificial layer; depositing a relatively thick structural material in a pattern to continuously cover the sides and bottoms of said holes through said sacrificial layer and to cover at least a portion of said relatively thin layer; and exposing the structure from the preceeding steps to heat and electromagnetic radiation in an oxidizing atmosphere to cause sublimeton of the remaining sacrificial layer, whereby a structure is produced which has said relatively thin layer supported above said substrate by posts of said structural material.
Claim 2
Independent Claim
159 words
A method of fabricating a three-dimensional, free-standing microstructure including the steps of: preparing a substrate for said microstructure; depositing a sacrificial layer on said substrate; removing at least a portion of said layer in a desired pattern to form holes through said sacrificial layer which expose portions of said substrate, said holes having bottoms and having sloping sides defined by the remaining sacrificial layer; depositing at least one relatively thin layer in a pattern atop said sacrificial layer; depositing a relatively thick structural material in a pattern to continuously cover the sides and bottoms of said holes through said sacrificial layer and to cover at least a portion of said relatively thin layer; and exposing the structure from the preceeding steps to heat and electromagnetic radiation in an oxidizing atmosphere to cause sublimeton of the remaining sacrificial layer, whereby a structure is produced which has said relatively thin layer supported above said substrate by posts of said structural material.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-07-17 | 1993-01-16 | 1993-07-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-07-17 | 1997-01-16 | 1997-07-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-07-17 | 2001-01-16 | 2001-07-18 | $7700.00 | Window Closed / Lapsed |