Patent US4845542A successfully refreshed from Google Patents.
US4845542A
Expired / Lapsed
US
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Interconnect for layered integrated circuit assembly
Assignee: Unisys Corp
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Filing: 1989-01-17
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Granted: 1989-07-04
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Expires: 2009-01-17
Abstract
Abstract Enhanced density of electrical and/or mechanical interconnections between adjacent wafers within integrated circuit assemblies and structural integrity of those interconnections under temperature cycling conditions, is attained by utilizing laser assisted chemical vapor deposition to fabricate precisely configured metal posts which serve as such interconnections.
Inventors
- 👤 Steve J. Bezuk
- 👤 Tushar R. Gheewala
- 👤 Stephen A. Campbell
- 👤 Robert J. Baseman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 14:21
CPC Classifications
H; H10; H10W; H10W90/00; H10W72/00; H10W72/20; H10W72/251; H10W90/701; H10W90/721; H10W90/722; Y; Y10; Y10S; Y10S257/00; Y10S257/915
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
145 words
A layered, integrated circuit assembly, comprising: a substrate having a planar major surface; electrical conductors lying on said major surface; elongated metal posts which have a first end connected to said conductors and which extend therefrom substantially perpendicular to said major surface; each of said metal posts having a second end which lies above said surface; a semiconductor device connected to said second end of said metal posts; said semiconductor device and said substrate being made of materials that expand and contract at different rates when they are subjected to temperature changes; and each of said metal posts having a length-to-width ratio which exceeds that which is possible for a metal bump of the same length; said posts being relatively flexible in comparison to said metal bumps and of the same length and operating to accommodate said different expansion rates without overstressing said semiconductor device.
Claim 2
Dependent Claim
145 words
A layered, integrated circuit assembly, comprising: a substrate having a planar major surface; electrical conductors lying on said major surface; elongated metal posts which have a first end connected to said conductors and which extend therefrom substantially perpendicular to said major surface; each of said metal posts having a second end which lies above said surface; a semiconductor device connected to said second end of said metal posts; said semiconductor device and said substrate being made of materials that expand and contract at different rates when they are subjected to temperature changes; and each of said metal posts having a length-to-width ratio which exceeds that which is possible for a metal bump of the same length; said posts being relatively flexible in comparison to said metal bumps and of the same length and operating to accommodate said different expansion rates without overstressing said semiconductor device.
Claim 3
Dependent Claim
19 words
The circuit assembly of claim 1 wherein each post has a length-to-width ratio of at least 10 to 1.
Claim 4
Dependent Claim
26 words
The circuit assembly of claim 1 wherein each post is tapered from a maximum circular cross section at only one end to a right circular cylinder.
Claim 5
Dependent Claim
18 words
The circuit assembly of claim 2 wherein each post has a width of no more than one mil.
Claim 6
Dependent Claim
21 words
The circuit assembly of claim 2 wherein each post has a graded metalization, with solder disposed as the final grade thereof.
Claim 7
Dependent Claim
12 words
The circuit assembly of claim 2 wherein each post consists of aluminum.
Claim 8
Dependent Claim
12 words
The circuit assembly of claim 2 wherein each post consists of nickel.
Claim 9
Dependent Claim
18 words
The circuit assembly of claim 3 wherein each post has a width of no more than one mil.
Claim 10
Dependent Claim
21 words
The circuit assembly of claim 3 wherein each post has a graded metalization, with solder disposed as the final grade thereof.
Claim 11
Dependent Claim
12 words
The circuit assembly of claim 3 wherein each post consists of aluminum.
Claim 12
Dependent Claim
12 words
The circuit assembly of claim 3 wherein each post consists of nickel.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-07-03 | 1993-01-02 | 1993-07-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-07-03 | 1997-01-02 | 1997-07-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-07-03 | 2001-01-02 | 2001-07-04 | $7700.00 | Window Closed / Lapsed |