Patent US1782599A successfully refreshed from Google Patents.
Patent US4845335A successfully refreshed from Google Patents.
US4845335A
Expired / Lapsed
US
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Laser Bonding apparatus and method
Assignee: Rateze Remote Mgmt LLC
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Filing: 1988-01-28
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Granted: 1989-07-04
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Expires: 2008-01-28
Abstract
Abstract A method and apparatus of bonding two electrical members together uses a pulsed YAG laser. Various apparatus and methods may be used to hold the electrical members in contact under pressure to insure uniform bonding. Automation production equipment provides for the automatic bonding of the flat electrical leads of a TAB tape to the flat electrical bumps on a plurality of integrated circuit dies.
Inventors
- 👤 Daniel M. Andrews
- 👤 Philip J. Spletter
- 👤 Richard L. Simmons
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 18:35
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/50; B; B23; B23K; B23K1/00; B23K1/005; B23K1/0056; H10P72/04; H10P72/0444; H10W; H10W72/00; H10W72/071; H10W72/077; H10W72/701
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
113 words
A method of bonding a plurality of electrical leads of a TAB tape to a plurality of electrical bumps on an integrated circuit die by a laser comprising, providing the electrical leads with a coating that has the property of being coupled to the wavelength of the laser and which has a lower melting point than the melting point of the lead and the bumps, aligning the bumps and leads with each other with the tape positioned above the integrated circuit die, holding each of the leads in contact with one of the electrical bumps to form an interface, and bonding the leads and the bumps together at the interface with a laser.
Claim 2
Independent Claim
113 words
A method of bonding a plurality of electrical leads of a TAB tape to a plurality of electrical bumps on an integrated circuit die by a laser comprising, providing the electrical leads with a coating that has the property of being coupled to the wavelength of the laser and which has a lower melting point than the melting point of the lead and the bumps, aligning the bumps and leads with each other with the tape positioned above the integrated circuit die, holding each of the leads in contact with one of the electrical bumps to form an interface, and bonding the leads and the bumps together at the interface with a laser.
Claim 3
Independent Claim
164 words
A method of bonding the electrical leads of a TAB tape to electrical bumps on an integrated circuit die by a laser comprising, providing the electrical leads with a coating that has the property of being coupled to the wavelength of the laser and which has a lower melting point than the melting point of the lead and the bumps, aligning the bumps and leads with each other with the tape positioned above the integrated circuit die, holding each of the leads in contact with one of the electrical bumps to form an interface, bonding the leads and the bumps together at the interface with a laser, moving the tape horizontally across the integrated circuit die and moving the integrated circuit die vertically for aligning the bumps and leads, holding the leads in contact with the bumps by a gas stream, after bonding, the tape and attached integrated circuit is raised and moved horizontally, and the cycle is repeated with another integrated circuit die.
Claim 4
Independent Claim
164 words
A method of bonding the electrical leads of a TAB tape to electrical bumps on an integrated circuit die by a laser comprising, providing the electrical leads with a coating that has the property of being coupled to the wavelength of the laser and which has a lower melting point than the melting point of the lead and the bumps, aligning the bumps and leads with each other with the tape positioned above the integrated circuit die, holding each of the leads in contact with one of the electrical bumps to form an interface, bonding the leads and the bumps together at the interface with a laser, moving the tape horizontally across the integrated circuit die and moving the integrated circuit die vertically for aligning the bumps and leads, holding the leads in contact with the bumps by a gas stream, after bonding, the tape and attached integrated circuit is raised and moved horizontally, and the cycle is repeated with another integrated circuit die.
Claim 5
Independent Claim
161 words
A method of bonding the electrical leads of a TAB tape to electrical bumps on an integrated circuit die by a laser comprising, providing the electrical leads with a coating that has the property of being coupled to the wavelength of the laser and which has a lower melting point than the melting point of the lead and the bumps, aligning the bumps and leads with each other with the tape positioned above the integrated circuit die, holding each of the leads in contact with one of the electrical bumps to form an interface, bonding the leads and the bumps together at the interface with a laser, positioning a silicon wafer on a resilient support, cutting the wafer into a plurality of integrated circuits, positioning the support and cut integrated circuits beneath the tape, stretching the support separating the integrated circuits from each other, and sequential bonding the integrated circuits to the tape by a laser while positioned on the support.
Claim 6
Independent Claim
161 words
A method of bonding the electrical leads of a TAB tape to electrical bumps on an integrated circuit die by a laser comprising, providing the electrical leads with a coating that has the property of being coupled to the wavelength of the laser and which has a lower melting point than the melting point of the lead and the bumps, aligning the bumps and leads with each other with the tape positioned above the integrated circuit die, holding each of the leads in contact with one of the electrical bumps to form an interface, bonding the leads and the bumps together at the interface with a laser, positioning a silicon wafer on a resilient support, cutting the wafer into a plurality of integrated circuits, positioning the support and cut integrated circuits beneath the tape, stretching the support separating the integrated circuits from each other, and sequential bonding the integrated circuits to the tape by a laser while positioned on the support.
Claim 7
Dependent Claim
21 words
The method of claim 3 including, moving the support for sequentially aligning each of the individual integrated circuits with the tape.
Claim 8
Dependent Claim
44 words
A laser bonder for bonding two electrical members together comprising, a laser providing a laser beam for bonding the electrical members, and gas means for providing a stream of gas for holding the members in contact with each other while bonding with the laser.
Claim 9
Dependent Claim
44 words
A laser bonder for bonding two electrical members together comprising, a laser providing a laser beam for bonding the electrical members, and gas means for providing a stream of gas for holding the members in contact with each other while bonding with the laser.
Claim 10
Dependent Claim
13 words
The apparatus of claim 5 wherein the gas means is a nitrogen stream.
Claim 11
Dependent Claim
17 words
The apparatus of claim 6 wherein the stream of gas is directed coaxial with the laser beam.
Claim 12
Dependent Claim
110 words
An automatic bonder for bonding the flat electrical leads of a TAB tape to electrical bumps on a plurality of integrated circuit dies comprising, a laser providing a laser beam for bonding the leads to the bumps, means for moving the tape transversely to the laser beam, means holding a plurality of integrated circuir dies adjacent and below the tape, means for moving a die and the tape towards each other, means for aligning the leads on the tape with the bumps on said die, and means for directing a gas stream coaxially with the laser beam against the leads for holding the leads in contact with the aligned bumps.
Claim 13
Dependent Claim
110 words
An automatic bonder for bonding the flat electrical leads of a TAB tape to electrical bumps on a plurality of integrated circuit dies comprising, a laser providing a laser beam for bonding the leads to the bumps, means for moving the tape transversely to the laser beam, means holding a plurality of integrated circuir dies adjacent and below the tape, means for moving a die and the tape towards each other, means for aligning the leads on the tape with the bumps on said die, and means for directing a gas stream coaxially with the laser beam against the leads for holding the leads in contact with the aligned bumps.
Claim 14
Dependent Claim
141 words
An automatic bonder for bonding the electrical leads of a TAB tape to electrical bumps on a plurality of integrated circuit dies comprising, a laser providing a laser beam for bonding the leads to the bumps, means for moving the tape transversely to the laser beam, a silicon wafer positioned on a resilient support on which the wafer has been cut to form a plurality of dies, said support holding the plurality of dies adjacent and below the tape, means stretching the support for separating the integrated circuit dies from each other for ease of handling the individual dies, means for moving the support and the tape towards each other, means for aligning the leads on the tape with the bumps on one of said dies for bonding the leads to the bumps while the die is positioned on the support.
Claim 15
Dependent Claim
141 words
An automatic bonder for bonding the electrical leads of a TAB tape to electrical bumps on a plurality of integrated circuit dies comprising, a laser providing a laser beam for bonding the leads to the bumps, means for moving the tape transversely to the laser beam, a silicon wafer positioned on a resilient support on which the wafer has been cut to form a plurality of dies, said support holding the plurality of dies adjacent and below the tape, means stretching the support for separating the integrated circuit dies from each other for ease of handling the individual dies, means for moving the support and the tape towards each other, means for aligning the leads on the tape with the bumps on one of said dies for bonding the leads to the bumps while the die is positioned on the support.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-07-03 | 1993-01-02 | 1993-07-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-07-03 | 1997-01-02 | 1997-07-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-07-03 | 2001-01-02 | 2001-07-04 | $7700.00 | Window Closed / Lapsed |