Mass transferable semiconductor substrate processing and handling full shell carrier (boat)

Claim 1

A carrier for mass transferable semiconductor substrate processing and handling, comprising: a two part shell including top and bottom semicylindrical halves made from clear fused quartz tubing and releasably assembled to form a cylindrical shell, wherein both shell halves have a relief cut in all four corners to define four slots when the halves are assembled; and a semiconductor substrate carrier suspendable in the shell when the two halves are assembled including four clear fused quartz rods having axially running slots for supporting substrates and clear fused quartz end braces connected to the ends of the rods and clear fused quartz pick-up tubes connected to, and in a same plane with, the end braces and each pick-up tube having end portions extending outwardly from the end braces and configured to be accommodated in the four slots to removably suspendable in the shell when the two halves are assembled.