Photocurable laminate

Claim 1

A process for forming electroless copper plating patterns comprising: (a) laminating a substrate with a photocurable laminate, (b) exposing said photocurable laminate to a high energy ray, (c) removing unexposed parts of the laminate, and (d) electrolessly plating a desired part of the laminate with copper; wherein said photocurable laminate comprises a photocurable layer and a film-shaped substrate capable of substantially transmitting high-energy rays, said photocurable layer comprises (a) 100 parts by weight of a compound having recurring units represented by the following formulae [A] and [B] ##STR45## wherein R 0 is a vinyl group, an epoxy group or an episulfide group; R 1 is a hydrogen atom, an alkyl group of 1 to 6 carbon atoms or a halogen atom; and R 1 and R 0 are attached to the position ortho, meta or para to the carbon atom of the main chain; and wherein W, X, Y and Z are each a hydrogen atom, a halogen atom, a cyano group, an alkyl group of 1 to 6 carbon atoms, a halogenated alkyl group of 1 to 6 carbon atoms, an aryl group of 6 to 30 carbon atoms substituted with alkyl or halogenated alkyl groups of 1 to 6 carbon atoms, an aryl group of 6 to 30 carbon atoms substituted with silicon-containing groups, an aryl group of 6 to 30 carbon atoms, --COOR 2 , --COR 2 , --O--COR 2 (R 2 is an alkyl or halogenated alkyl group of 1 to 12 carbon atoms, an aryl group of 6 to 30 carbon atoms substituted with alkyl or halogenated alkyl groups of 1 to 6 carbon atoms, an aryl group of 6 to 30 carbon atoms substituted with silicon-containing groups, or an aryl group of 6 to 30 carbon atoms), a nitro group, a silicon-containing group, or a substituent having heterocyclic rings substituted with at least one R 3 (R 3 is a hydrogen atom, a hydroxyl group, a carboxyl group, a halogen atom, a nitro group, an amino group, a cyano group, an alkyl or halogenated alkyl group of 1 to 6 carbon atoms, an aryl group of 6 to 30 carbon atoms or a silicon-containing group) and (b) 5 to 1,000 parts by weight of a compound, which is compatible with compound (a), having a group represented by the formula --(R.sub.4).sub.n wherein R 4 is a group having a double bond and n is an integer of 1 to 50 and characterized by a viscosity at 20° C. of from 0.001 to 500 poises.