Process for preparing polymeric materials for application to printed circuits

Claim 2

A process for producing masks on printed circuits by applying a curable dry film of polymeric material to the area of the printed circuit to be protected, wherein the improvement comprises: (a) forming on a carrier web a curable dry film of polymeric material having an area corresponding to the area of the printed circuit to be protected, said dry film of polymeric material being peelable from said carrier web wherein said carrier web is a polyester strip, and comprising the steps, in forming a succession of substantially indentical and uniformly spaced areas of said dry film of polymeric material on said elongated carrier web, of: applying a coating of curable polymeric film on said polyester strip; applying a cover over the polymeric film to form a composite strip; separating the cover from the composite strip; die cutting the polymeric film to form uniformly spaced, substantially identical polymeric film strips along the length of said polyester strip, said uniform spaced strips being surrounded by waste polymeric film material; stripping away the waste polymeric film material thereby leaving uniformly spaced polymeric material film strips on the polyester strip; reapplying said cover over said polyester strip and the uniformly spaced polymeric strips, said last mentioned cover having a width substantially the same as that of said polyester strip, forming said polyester strip and cover with spaced polymeric material film strips sandwiched therebetween; removing the cover; (b) applying the dry film of polymeric material to the printed circuit by conveying the printed circuit beneath the web with the dry film of polymeric material facing the printed circuit and in alignment therewith; (c) affixing the dry film of polymeric material to the area of the printed circuit to be protected by pressing the carrier web and dry film of polymeric material against the printed circuit by means of an elastomeric pad having a surface region for contacting the carrier web; and (d) peeling the carrier web away from the printed circuit.

Claim 3

A process as defined by claim 1 wherein the dry film of polymeric material is heat curable.

Claim 4

A process as defined by claim 1 wherein the dry film of polymeric material is light curable.

Claim 5

A process as defined by claim 1 wherein the dry film of polymeric material is sensitive to actinic radiation.

Claim 6

A process as defined by claim 1 including the further step in affixing the dry film of polymeric material to the printed circuit to be protected of applying heat to the carrier web and dry film of polymeric material subsequent to the pressing thereof against the printed circuit by the elastomeric pad.

Claim 7

A process as defined by claim 1 including the further step in forming the dry film of polymeric material on the carrier web of applying a plastic film to the carrier web with the dry film of polymeric material sandwiched therebetween, thereby to allow the carrier web and film composite structure to be wound up in a roll to facilitate handling, and the further step in applying the dry film of polymeric material to the printed circuit of peeling the plastic film away from the carrier web and dry film of polymeric material.

Claim 8

A process as defined by claim 6 wherein the carrier web is made of polyester and the plastic film is made of polyethylene.

Claim 9

A process as defined by claim 7 wherein the dry film of polymeric material is photosensitive.

Claim 10

A process for producing masks on each of a succession of printed circuits by applying a curable film of polymeric material to each of the areas of the printed circuits to be protected wherein the improvement comprises: (a) forming a succession of substantially identical and uniformly spaced areas of a film of polymeric material on an elongated carrier web, each of said areas of film of polymeric material corresponding to the areas of the printed circuits to be protected wherein said elongated carrier web is a polyester strip and comprising the steps in forming a succesion of substantially identical and uniformly spaced areas of said film of polymeric material on said elongated carrier web, of: applying a coating of curable polymeric film on said polyester strip, applying a cover over the polymeric film to form a composite strip, separating the cover from the composite strip, die cutting the polymeric film to form uniformly spaced, substantially identical polymeric film strips along the length of said polyester strip, said uniformly spaced strips being surrounded by waste polymeric film material, stripping away the waste polymeric film material thereby leaving uniformly spaced polymeric material film strips on the polyester strip, reapplying said cover over said polyester strip and the uniformly spaced polymeric strip, said last mentioned cover having a width substantially the same as that of said polyester strip forming said polyester strip and cover with spaced polymeric material film strips sandwiched therebetween; removing the cover; (b) applying, in succession, each of the areas of film of polymeric material to an individually associated one of the printed circuits by conveying each of the printed circuits into operative relation with the carrier web and relatively moving the carrier web and each such printed circuit to bring an area of film of polymeric material into alignment with the area of each such printed circuit to be protected; (c) affixing the area of film of polymeric material so aligned to the area of the printed circuit then in operative relation therewith by pressing the carrier web and film of polymeric material against the printed circuit by means of an elastomeric pad having a surface region for contacting the carrier web, and (d) peeling the carrier web away from each such printed circuit, in turn.

Claim 11

A process for producing masks on each of a succession of printed circuits by applying a curable film of polymeric material to each of the areas of the printed circuits to be protected wherein the improvement comprises: (a) forming a succession of substantially identical and uniformly spaced areas of a film of polymeric material on an elongated carrier web, each of said areas of film of polymeric material corresponding to the areas of the printed circuits to be protected wherein said elongated carrier web is a polyester strip and comprising the steps in forming a succesion of substantially identical and uniformly spaced areas of said film of polymeric material on said elongated carrier web, of: applying a coating of curable polymeric film on said polyester strip, applying a cover over the polymeric film to form a composite strip, separating the cover from the composite strip, die cutting the polymeric film to form uniformly spaced, substantially identical polymeric film strips along the length of said polyester strip, said uniformly spaced strips being surrounded by waste polymeric film material, stripping away the waste polymeric film material thereby leaving uniformly spaced polymeric material film strips on the polyester strip, reapplying said cover over said polyester strip and the uniformly spaced polymeric strip, said last mentioned cover having a width substantially the same as that of said polyester strip forming said polyester strip and cover with spaced polymeric material film strips sandwiched therebetween; removing the cover; (b) applying, in succession, each of the areas of film of polymeric material to an individually associated one of the printed circuits by conveying each of the printed circuits into operative relation with the carrier web and relatively moving the carrier web and each such printed circuit to bring an area of film of polymeric material into alignment with the area of each such printed circuit to be protected; (c) affixing the area of film of polymeric material so aligned to the area of the printed circuit then in operative relation therewith by pressing the carrier web and film of polymeric material against the printed circuit by means of an elastomeric pad having a surface region for contacting the carrier web, and (d) peeling the carrier web away from each such printed circuit, in turn.

Claim 12

A process as defined by claim 9 wherein the dry film of polymeric material is heat curable.

Claim 13

A process as defined by claim 9 wherein the dry film of polymeric material is light curable.

Claim 14

A process as defined by claim 9 wherein the dry film of polymeric material is sensitive to actinic radiation.

Claim 15

A process as defined by claim 9 including the further step in affixing the area of film of polymeric material to the area of the printed circuit then in operative relation therewith of applying heat to the carrier web and film of polymeric material subsequent to the pressing thereof against the printed circuit by the elastomeric pad.

Claim 16

A process as defined by claim 9 including the further step in forming a succession of substantially identical and uniformly spaced areas of a film of polymeric material on an elongated carrier web of applying a plastic film to the carrier web with the film of polymeric material sandwiched therebetween, thereby to allow the carrier web and film composite structure to be wound up in a roll to facilitate handling, and the further step in applying the film of polymeric material to each of the printed circuits of peeling the plastic film away from the carrier web and film of polymeric material.

Claim 17

A process as defined by claim 14 wherein the carrier web is made of polyester and the plastic film is made of polyethylene.

Claim 18

A process as defined by claim 15 wherein the film of polymeric material is photosensitive.

Claim 19

A process as defined by claim 9 wherein the film of polymeric material is a heat curable film and the succession of spaced areas thereof on the carrier web are formed thereon by the known silk-screen process.

Claim 20

A process as defined by claim 9 wherein the film of polymeric material is heat curable film and the succession of spaced areas thereof on the carrier web is formed thereon by printing.