Abstract A dielectric die for use in heat sealing thermoplastic sheets comprising a laminate consisting of a rigid thermoset resin sheet having thin metal layers bonded to each side thereof with the metal layers being electrically connected through the thermoset resin layer at a plurality of locations. One of the copper layers has portions etched away to form an electrode of a desired configuration. The other metal layer is adapted for electrical connection to a source of electrostatic microwave energy. The invention includes a method for making the die which includes the steps of electrically connecting the metal sheets by drilling holes through the laminate and electroplating an electrical conducting metal in the holes, and etching away portions of one of the metal sheets to form an electrode of the desired configuration.
A die for dielectrically heat sealing thermoplastic materials comprising a rigid thermoset resin sheet of uniform thickness, a copper sheet about 0.003 inch in thickness bonded to one side of said resin sheet, a second sheet of copper about 0.003 inch in thickness bonded to the opposite side of said resin sheet, said second sheet having a configuration of the desired pattern in which it is desired to heat seal with said die, said resin sheet and said metal sheets having openings therethrough at a plurality of locations, the walls of said openings having an electrodeposited copper layer thereon whereby said first copper sheet is electrically connected to said second copper sheet at said plurality of locations, said locations being distributed to provide a uniform distribution of electrical charge on said second copper sheet when said first copper sheet is subjected to an electrostatic charge.
Claim 2
Dependent Claim
193 words
A dielectric heat sealing apparatus for heat sealing thermoplastic sheets comprising a stationary platen and a movable platen and a die mounted on one of said platens, said die comprising a rigid thermoset resin sheet of uniform thickness, a first relatively thin layer of electrically conductive metal bonded to one side of said resin sheet and being in contact with said one of said platens, a second relatively thin layer of electrically conductive metal bonded to the other side of said resin sheet having a configuration of the pattern in which it is desired to heat seal, said resin sheet and said metal sheets having openings therethrough at a plurality of locations, the walls of said openings having an electrically conductive metal layer thereon whereby said first metal layer is electrically connected to said second metal layer at said plurality of locations, said locations being distributed to provIde a uniform distribution of electrical charge on said second metal layer when said first metal layer is subjected to an electrical charge and said second metal layer being adapted to serve as an electrode when said first metal layer is subjected to an electrostatic charge.