US3228091A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making printed circuit board
Assignee: Bendix Corp
•
Filing: 1960-12-30
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Granted: 1966-01-11
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Expires: 1980-12-30
Abstract
No abstract record available.
Inventors
- 👤 Bernard L Rice
- 👤 Frederick W Winger
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 22:17
CPC Classifications
B; B30; B30B; B30B15/00; B30B15/06; B30B15/061; H; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/115; H05K1/116; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09472; H05K2201/095; H05K2201/096; H05K2201/10; H05K2201/10613; H05K2201/10742; H05K2201/1075; H05K2201/10757; H05K2201/10765; H05K2203/00; H05K2203/06; H05K2203/068; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3447; H05K3/46; H05K3/4697; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
183 words
A METHOD OF FORMING A THERMOSETTING MULTI-LAYER PRINTED CIRCUIT BOARD ASSEMBLY HAVING A FIRST LAYER OF EPOXY GLASS LAMINATE WITH A PRINTED CIRCUIT AND FIXED SOLDER TERMINALS ON THE UNDERSURFACE THEREOF, A SECOND LAYER OF A GLASS CLOTH ADHESIVE IMPREGNATED WITH AN EPOXY RESIN CURED TO THE "B" STAGE AND HAVING OPENINGS CORRESPONDING WITH SAID SOLDER TERMINALS, AND A THIRD LAYER OF EPOXY GLASS LAMINATE WITH A PRINTED CIRCUIT THEREON AND OPENINGS CORRESPONDING WITH SAID SOLDER TERMINALS COMPRISING THE STEPS OF, INSERTING SMALL PADS OF SILICONE RUBBER IN SAID OPENINGS, SAID PADS BEING OF SIZE AND SHAPE TO CORRESPOND WITH SAID OPENINGS, PLACING SAID ASSEMBLED LAYERS BETWEEN HEATED PLATENS FOR BONDING SAID BER PADDING ADJACENT THERETO, WITHDRAWING SAID ASSEMBLY FROM BETWEEN SAID LAYERS AND REMOVING SAID PADS FROM SAID OPENINGS, DRILLING HOLES THROUGH SAID LAYERS AT THE LOCATION OF SAID SOLDER TERMINALS, ATTACHING THE DESIRED ELECTRICAL COMPONENTS TO THE BACK OF SAID ASSEMBLY SO THAT THE LEADS EXTEND THROUGH SAID HOLES AND MAKE CONTACT WITH SAID SOLDER TERMINALS, AND DIP SOLDERING SAID ASSEMBLY TO MAKE SOLDERED JUNCTIONS AT ALL OF SAID SOLDER TERMINALS.
Claim 2
Independent Claim
183 words
A METHOD OF FORMING A THERMOSETTING MULTI-LAYER PRINTED CIRCUIT BOARD ASSEMBLY HAVING A FIRST LAYER OF EPOXY GLASS LAMINATE WITH A PRINTED CIRCUIT AND FIXED SOLDER TERMINALS ON THE UNDERSURFACE THEREOF, A SECOND LAYER OF A GLASS CLOTH ADHESIVE IMPREGNATED WITH AN EPOXY RESIN CURED TO THE "B" STAGE AND HAVING OPENINGS CORRESPONDING WITH SAID SOLDER TERMINALS, AND A THIRD LAYER OF EPOXY GLASS LAMINATE WITH A PRINTED CIRCUIT THEREON AND OPENINGS CORRESPONDING WITH SAID SOLDER TERMINALS COMPRISING THE STEPS OF, INSERTING SMALL PADS OF SILICONE RUBBER IN SAID OPENINGS, SAID PADS BEING OF SIZE AND SHAPE TO CORRESPOND WITH SAID OPENINGS, PLACING SAID ASSEMBLED LAYERS BETWEEN HEATED PLATENS FOR BONDING SAID BER PADDING ADJACENT THERETO, WITHDRAWING SAID ASSEMBLY FROM BETWEEN SAID LAYERS AND REMOVING SAID PADS FROM SAID OPENINGS, DRILLING HOLES THROUGH SAID LAYERS AT THE LOCATION OF SAID SOLDER TERMINALS, ATTACHING THE DESIRED ELECTRICAL COMPONENTS TO THE BACK OF SAID ASSEMBLY SO THAT THE LEADS EXTEND THROUGH SAID HOLES AND MAKE CONTACT WITH SAID SOLDER TERMINALS, AND DIP SOLDERING SAID ASSEMBLY TO MAKE SOLDERED JUNCTIONS AT ALL OF SAID SOLDER TERMINALS.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1969-01-10 | 1969-07-12 | 1970-01-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1973-01-10 | 1973-07-12 | 1974-01-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1977-01-10 | 1977-07-12 | 1978-01-11 | $7700.00 | Window Closed / Lapsed |