Patent US4833620A successfully refreshed from Google Patents.
US4833620A
Expired / Lapsed
US
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Method for fabricating a 1-chip microcomputer
Assignee: Fujitsu Ltd
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Filing: 1986-03-06
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Granted: 1989-05-23
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Expires: 2006-03-06
Abstract
Abstract A method for fabricating a 1-chip microcomputer accompanied by a so-called evaluation chip provided an interface for an external memory device in which a program to be written in a ROM of the 1-chip microcomputer is stored and evaluated in advance. The method includes producing masks for fabricating the chips of a 1-chip microcomputer and replacing ROM patterns in the masks by patterns for forming the interface means. Also included are the steps of adding patterns for additional bonding pads and wiring to the masks, where the additional bonding pads are arranged in an array at the outermost periphery of the evaluation chip, and the additional wiring connecting the additional bonding pads to the interface bonding pads which are formed at the inner region of the evaluation chip so as to have the same arrangement as in the corresponding 1-chip microcomputer chips. Patterns for the additional bonding pads and the connections to the additional bonding pads are usually added to the wiring patterns formed in the uppermost layer of a multiple-layer wiring configuration in the 1-chip microcomputer.
Inventors
- 👤 Hitoshi Takahashi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 16:08
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/01; H10W20/40; H10W20/41; H10W20/43; H10W72/00; H10W72/071; H10W72/073; H10W72/90; H10W90/00; H10W90/701; H10W90/751; H10W90/754; Y; Y10; Y10S; Y10S257/00; Y10S257/923
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
285 words
A method for fabricating a 1-chip microcomputer, comprising the steps of: (a) producing a first set of masks used for mass-producing chips of a 1-chip microcomputer, each of the masks having regions including patterns for forming first bonding pads and other circuits, a ROM region for later adding ROM patterns, and wiring patterns for connecting the other circuits to the ROM region, the first bonding pads being arranged in an array surrounding the other circuits; (b) fabricating the chip of the 1-chip microcomputer using the first set of masks; (c) producing a second set of masks for an evaluation chip, the evaluation chip being used for evaluating a program to be held in the ROM of each mass-production chip, said producing of the second set of masks comprising the steps of: (ci) adding interface patterns to the first set of masks in the ROM region for forming an interface allowing the evaluation chip to have access to an external memory device, the interface patterns substituting for the ROM patterns and including an address output buffer for transmitting address signals from the other circuits to the external memory device and a data input buffer for receiving data signals from the external memory device for the other circuits, and (cii) adding patterns to the first set of masks for forming second bonding pads and connection wiring lines between the second bonding pads and the first bonding pads, the address output buffer and the data input buffer in the interface, the second bonding pads being arranged in an array surrounding the array of the first bonding pads; and (d) fabricating the evaluation chip using the second set of masks with said interface being formed in the ROM region.
Claim 2
Independent Claim
285 words
A method for fabricating a 1-chip microcomputer, comprising the steps of: (a) producing a first set of masks used for mass-producing chips of a 1-chip microcomputer, each of the masks having regions including patterns for forming first bonding pads and other circuits, a ROM region for later adding ROM patterns, and wiring patterns for connecting the other circuits to the ROM region, the first bonding pads being arranged in an array surrounding the other circuits; (b) fabricating the chip of the 1-chip microcomputer using the first set of masks; (c) producing a second set of masks for an evaluation chip, the evaluation chip being used for evaluating a program to be held in the ROM of each mass-production chip, said producing of the second set of masks comprising the steps of: (ci) adding interface patterns to the first set of masks in the ROM region for forming an interface allowing the evaluation chip to have access to an external memory device, the interface patterns substituting for the ROM patterns and including an address output buffer for transmitting address signals from the other circuits to the external memory device and a data input buffer for receiving data signals from the external memory device for the other circuits, and (cii) adding patterns to the first set of masks for forming second bonding pads and connection wiring lines between the second bonding pads and the first bonding pads, the address output buffer and the data input buffer in the interface, the second bonding pads being arranged in an array surrounding the array of the first bonding pads; and (d) fabricating the evaluation chip using the second set of masks with said interface being formed in the ROM region.
Claim 3
Dependent Claim
46 words
A fabrication method as recited in claim 1, wherein the evaluation chip includes multiple wiring layers, and step (cii) includes forming the second bonding pads and corresponding wiring connected thereto as an uppermost wiring layer and the remainder of the wiring as a lower wiring layer.
Claim 4
Dependent Claim
32 words
A fabrication method as recited in claim 1, wherein the second bonding pads and corresponding wiring connected thereto are formed in the first set of masks for forming the first bonding pads.
Claim 5
Dependent Claim
39 words
A fabrication method as recited in claim 1, wherein the step (cii) further includes arranging the second bonding pads connected to the address input and data output buffers to form respective groups at the periphery of the evaluation chip.
Claim 6
Dependent Claim
31 words
A fabrication method as recited in claim 1, wherein step (cii) includes forming an extended area around an area equivalent to the mass-production chip for forming therein the second bonding pads.
Claim 7
Dependent Claim
54 words
A fabrication method as recited in claim 1, wherein step (a) comprises producing masks with the patterns for forming the other circuits including patterns for forming a program counter connected to the address output buffer via the wiring patterns and a programmable logic array connected to the data input buffer via the wiring patterns.
Claim 8
Dependent Claim
139 words
A one-chip microcomputer evaluation chip using an external memory device during evaluation, said chip comprising: a one-chip microcomputer, comprising: one-chip microcomputer bonding pads on a periphery of said one-chip microcomputer; a programmable logic array; a program counter; and a ROM circuit area set aside for a read only memory, said ROM circuit area including an address output buffer, operatively connected to said program counter, for transmitting address signals to the external memory device and a data input buffer, operatively connected to said programmable logic array, for receiving data signals from the external memory device; a peripheral bonding pad area peripheral to said one-chip microcomputer bonding pads, said peripheral bonding pad area including: first bonding pads operatively connected to said one-chip microcomputer bonding pads; and second bonding pads operatively connected to said address output buffer and said data input buffer.
Claim 9
Dependent Claim
139 words
A one-chip microcomputer evaluation chip using an external memory device during evaluation, said chip comprising: a one-chip microcomputer, comprising: one-chip microcomputer bonding pads on a periphery of said one-chip microcomputer; a programmable logic array; a program counter; and a ROM circuit area set aside for a read only memory, said ROM circuit area including an address output buffer, operatively connected to said program counter, for transmitting address signals to the external memory device and a data input buffer, operatively connected to said programmable logic array, for receiving data signals from the external memory device; a peripheral bonding pad area peripheral to said one-chip microcomputer bonding pads, said peripheral bonding pad area including: first bonding pads operatively connected to said one-chip microcomputer bonding pads; and second bonding pads operatively connected to said address output buffer and said data input buffer.
Claim 10
Dependent Claim
47 words
A chip as recited in claim 7, wherein said chip includes multiple wiring layers and the wiring of said one-chip microcomputer is in a first layer and the wiring connected to said first and second bonding pads is in a second layer higher than said first layer.
References Cited (Backward Citations)
US4467420A
Cited
US4513400A
Cited
US4670838A
Cited
US4688070A
Cited
JPS6089955A
Cited
US4701886A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-05-22 | 1992-11-21 | 1993-05-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-05-22 | 1996-11-21 | 1997-05-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-05-22 | 2000-11-21 | 2001-05-23 | $7700.00 | Window Closed / Lapsed |