Patent US4830264A successfully refreshed from Google Patents.
US4830264A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of forming solder terminals for a pinless ceramic module
Assignee: International Business Machines Corp
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Filing: 1987-10-07
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Granted: 1989-05-16
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Expires: 2007-10-07
Abstract
Abstract Disclosed is a method of forming solder terminals for a pinless module, preferably for a pinless metallized ceramic module. The method is comprised of the following steps: forming a substrate having a pattern of conductors formed onto its top surface and preformed via-holes extending from the top to bottom surface; applying a droplet of flux at at least one of said preformed via-hole openings of the bottom surface of said substrate to fill said via-holes with flux by capillarity and form a glob of flux at the bottom openings; applying a solder preform, i.e. solder balls on each glob of flux to which it will adhere, the volume of the preform being substantially equal to the inner volume of the via hole plus the volume of the bump to be formed; heating to cause solder reflow of the solder preform to fill the via-hole and the inner volume of the eyelet with solder; and, cooling below the melting point of the solder so that the molten solder solidifies to form solder terminals at the via-hole locations while forming solder columns in the via-holes. The resultant pinless metallized ceramic module has connections between the I/O's of the module interfacing with the next level of packaging, (i.e., printed circuit boards), that consist of integral solder terminals. Each integral solder terminal comprises a column in the vias of the metallized ceramic substrate, a mound of solder at the top surface of the substrate and spherical solder bumps on the bottom level for making interconnections with the next level of packaging.
Inventors
- 👤 Alexis Bitaillou
- 👤 Michel Grandguillot
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 14:16
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3478; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/095; H10W70/099; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09572; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10666; H05K2201/10734; H05K2203/00; H05K2203/04; H05K2203/041; H05K2203/043; H05K2203/0485; H05K3/3489; H10W72/00; H10W72/01; H10W72/012; H10W72/01221; H10W72/01225
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
177 words
A method of forming solder terminals for a pinless module having solder bumps to be bonded onto printed circuit boards comprising the steps of: forming a substrate having a pattern of conductors formed onto its top surface and preformed via-holes extending from the top to bottom surface; applying a droplet of flux at at least one of said preformed via-hole openings of the bottom surface of said substrate to fill said via-holes with flux by capillarity and form a glob of flux at the bottom openings; applying a solder preform on each glob of flux to which it will adhere, the volume of each preform being substantially equal to the inner volume of the via hole plus the volume of the bump to be formed; heating to cause solder reflow of the solder preform to fill the via-hole and the inner volume of the eyelet with solder; and, cooling below the melting point of the solder so that the molten solder solidifies to form solder terminals at the via-hole locations while forming solder columns in the via-holes.
Claim 2
Independent Claim
177 words
A method of forming solder terminals for a pinless module having solder bumps to be bonded onto printed circuit boards comprising the steps of: forming a substrate having a pattern of conductors formed onto its top surface and preformed via-holes extending from the top to bottom surface; applying a droplet of flux at at least one of said preformed via-hole openings of the bottom surface of said substrate to fill said via-holes with flux by capillarity and form a glob of flux at the bottom openings; applying a solder preform on each glob of flux to which it will adhere, the volume of each preform being substantially equal to the inner volume of the via hole plus the volume of the bump to be formed; heating to cause solder reflow of the solder preform to fill the via-hole and the inner volume of the eyelet with solder; and, cooling below the melting point of the solder so that the molten solder solidifies to form solder terminals at the via-hole locations while forming solder columns in the via-holes.
Claim 3
Dependent Claim
21 words
The method of claim 1 further comprising the step of metallizing the sidewalls of said via-holes prior to applying said flux.
Claim 4
Dependent Claim
17 words
The method of claim 1 wherein said preformed via-holes are at the center of the said substrate.
Claim 5
Dependent Claim
17 words
The method of claim 2 wherein said preformed via-holes are at the center of the said substrate.
Claim 6
Dependent Claim
12 words
The method of claim 1 wherein said solder preforms are solder balls.
Claim 7
Dependent Claim
12 words
The method of claim 2 wherein said solder preforms are solder balls.
Claim 8
Dependent Claim
27 words
The method of claim 5 further comprising the step of turning said substrate upside down to have its bottom surface facing up prior to applying said flux.
Claim 9
Dependent Claim
27 words
The method of claim 6 further comprising the step of turning said substrate upside down to have its bottom surface facing up prior to applying said flux.
Claim 10
Dependent Claim
25 words
The method of claim 1 further comprising the step of joining silicon chips having solder bumps to the pattern of conductors formed atop said substrate.
Claim 11
Dependent Claim
25 words
The method of claim 2 further comprising the step of joining silicon chips having solder bumps to the pattern of conductors formed atop said substrate.
Claim 12
Dependent Claim
25 words
The method of claim 5 further comprising the step of joining silicon chips having solder bumps to the pattern of conductors formed atop said substrate.
Claim 13
Dependent Claim
25 words
The method of claim 6 further comprising the step of joining silicon chips having solder bumps to the pattern of conductors formed atop said substrate.
Claim 14
Dependent Claim
45 words
The method of claim 9 wherein said silicon chips having solder bumps are joined to the pattern of conductors formed atop said substrate during said heating step to cause solder reflow to fill the via holes and the inner volume of the eyelets with solder.
Claim 15
Dependent Claim
45 words
The method of claim 10 wherein said silicon chips having solder bumps are joined to the pattern of conductors formed atop said substrate during said heating step to cause solder reflow to fill the via holes and the inner volume of the eyelets with solder.
Claim 16
Dependent Claim
45 words
The method of claim 11 wherein said silicon chips having solder bumps are joined to the pattern of conductors formed atop said substrate during said heating step to cause solder reflow to fill the via holes and the inner volume of the eyelets with solder.
Claim 17
Dependent Claim
45 words
The method of claim 12 wherein said silicon chips having solder bumps are joined to the pattern of conductors formed atop said substrate during said heating step to cause solder reflow to fill the via holes and the inner volume of the eyelets with solder.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-05-15 | 1992-11-14 | 1993-05-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-05-15 | 1996-11-14 | 1997-05-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-05-15 | 2000-11-14 | 2001-05-16 | $7700.00 | Window Closed / Lapsed |