Apparatus and method for applying solder flux to a printed circuit board

Claim 2

A printed circuit board foam fluxing apparatus comprising: means for passing an apertured printed circuit board through a standing wave of foamed flux to coat a surface of the board with the flux; and means for blowing a stream of air across said board against said coated surface, said stream having a relative position, velocity, orientation and shape such as to remove a portion of the flux on said coated surface and to leave on said surface a relatively thin film of the flux, and such as to blow a portion of said flux into the apertures in said board.

Claim 3

The apparatus of claim 1 wherein said means for blowing includes means for forming a plurality of equally spaced streams of air, the streams being sufficiently closed spaced and each being dimensioned and having a velocity such that together said streams form a relatively uniform stream of air extending across the width of the board, where these streams meet the foam at said surface of said board.

Claim 6

The method of claim 3 wherein said blowing step includes directing an effectively linear stream of air of substantially uniform pressure across said path against said flux deposited surface.

Claim 7

The method of claim 3 wherein said blowing step includes blowing a plurality of steams of air so as to simultaneously blow against said board surface in an effectively single stream across said surface.

Claim 8

In a wave soldering apparatus for soldering component leads to conductors on a printed circuit board, said leads being inserted in apertures in said board, said apparatus comprising conveying means for conveying said board along a given path, flux means for applying a foam flux coating to said board during said conveying, preheat means for heating said flux coated board, and wave solder means for applying hot molten solder to said heated flux coated board, the improvement therewith comprising: blower means across said path between said flux means and said preheat means for blowing air against said coated surface prior to being heated, said blower means effectively providing a continuous airstream across said path of substantially uniform velocity, said airstream being of a velocity and orientation relative to said board to reduce the coating thickness over said board surface to a relatively thin, relatively uniform layer and to blow a portion of said foam into said apertures.

Claim 9

In a wave soldering apparatus for soldering component leads to conductors on a printed circuit board, said leads being inserted in apertures in said board, said apparatus comprising conveying means for conveying said board along a given path, flux means for applying a foam flux coating to said board during said conveying, preheat means for heating said flux coated board, and wave solder means for applying hot molten solder to said heated flux coated board, the improvement therewith comprising: blower means across said path between said flux means and said preheat means for blowing air against said coated surface prior to being heated, said blower means effectively providing a continuous airstream across said path of substantially uniform velocity, said airstream being of a velocity and orientation relative to said board to reduce the coating thickness over said board surface to a relatively thin, relatively uniform layer and to blow a portion of said foam into said apertures.

Claim 10

The apparatus of claim 6 wherein said blower means comprises conduit means transverse said given path for receiving pressurized air therein and a plurality of uniformly spaced apertures aimed toward said path.

Claim 11

The apparatus of claim 7 wherein the air is at a pressure of about 6-9 psi, said apertures being about 0.010 inch in diameter and spaced approximately 1/4 inch apart across said path.

Claim 12

The apparatus of claim 6 wherein said blower means includes conduit means across said path for directing a plurality of separate equally spaced air streams aligned in a straight line at said path.

Claim 13

The apparatus of claim 9 wherein most of said airstreams are substantially uniform in velocity.

Claim 14

The apparatus of claim 9 wherein said blower means includes means for adjusting the angular position of said airstreams relative to the surface of the printed circuit board containing the coating of flux.

Claim 15

In a wave soldering apparatus including means for producing a standing wave of molten solder, carrier means for carrying an apertured substrate along a path through said wave, foam flux means for producing a standing wave of foamed flux in said path upstream from said solder wave, the improvement therewith comprising: means for directing a plurality of airstreams at and across said path, said means being located so that said airstreams cross the path between said flux wave and solder wave to form an effectively single airstream of substantially uniform velocity across said path, said airstreams for reducing the thickness of said foam on said substrate passed through said flux wave and for blowing flux into said apertures in said substrate.

Claim 16

In a wave soldering apparatus including means for producing a standing wave of molten solder, carrier means for carrying an apertured substrate along a path through said wave, foam flux means for producing a standing wave of foamed flux in said path upstream from said solder wave, the improvement therewith comprising: means for directing a plurality of airstreams at and across said path, said means being located so that said airstreams cross the path between said flux wave and solder wave to form an effectively single airstream of substantially uniform velocity across said path, said airstreams for reducing the thickness of said foam on said substrate passed through said flux wave and for blowing flux into said apertures in said substrate.

Claim 17

The apparatus of claim 12 wherein said airstreams are equally spaced across said path.

Claim 18

The apparatus of claim 12 wherein said airstreams are of sufficient velocity and of sufficiently close spacing such that they effectively act as a single airstream which meets the substrate along a line normal to said path and which extends across substantially the width of the substrate.