Patent US4828948A successfully refreshed from Google Patents.
US4828948A
Expired / Lapsed
US
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Method for the production of heat-resistant structured layers
Assignee: Siemens AG
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Filing: 1986-06-24
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Granted: 1989-05-09
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Expires: 2006-06-24
Abstract
Abstract A cost-efficient method for producing dimensionally precise and high-grade heat-resistent structured layers by applying a single coating of a radiation-sensitive soluble polyether-based photopolymer in the form of a layer or foil on a substrate; irradiating the layer or foil through a negative with actinic light or by guiding a light, electron, laser, or ion beam; removing the nonirradiated layer or foil portions; and subsequent optional annealing, wherein the photopolymer comprises an addition product of an olefin-unsaturated monoisocyanate and a polether having at least one hydroxyl group. The layers provided according to the invention can withstand the thermal and mechanical stresses of dip soldering process, and protect circuit surfaces effectively and durably against moisture and corrosion; they are therefore suitable in particular as solder resist and insulating layers in microconductor technology.
Inventors
- 👤 Hellmut Ahne
- 👤 Winfried Plundrich
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 17:17
CPC Classifications
B; B41; B41M; B41M5/00; H; H01; H01B; H01B3/00; H01B3/18; H01B3/30; H01B3/42; C; C08; C08G; C08G18/00; C08G18/06; C08G18/28; C08G18/40; C08G18/48; C08G18/487; C08G18/4879; C08G18/70; C08G18/81; C08G18/8108; C08G18/8116; C08G18/8141; C08G18/815; C08G18/8158; C08G18/8175; G; G03; G03F; G03F7/00; G03F7/004; G03F7/038; G03F7/0388; H01B3/36; A; A61; A61K; A61K38/00; Y; Y10; Y10S; Y10S430/00; Y10S430/146
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
100 words
A method for the production of a heat-resistant layer which comprises applying a radiation-sensitive mixture of a soluble polyether-based photopolymer and a copolymerizable compound in the form of a layer or foil on a substrate; irradiating a portion of the layer of foil through a negative pattern with actinic light or by guiding a light, electron, laser or ion beam over the layer or foil; and removing the nonirradiated portion of the layer or foil; wherein the photopolymer is an addition product of an olefin-unsaturated monisocyanate and a phenoxy resin and the copolymerizable compound contains an acrylate or methacrylate group.
Claim 2
Independent Claim
100 words
A method for the production of a heat-resistant layer which comprises applying a radiation-sensitive mixture of a soluble polyether-based photopolymer and a copolymerizable compound in the form of a layer or foil on a substrate; irradiating a portion of the layer of foil through a negative pattern with actinic light or by guiding a light, electron, laser or ion beam over the layer or foil; and removing the nonirradiated portion of the layer or foil; wherein the photopolymer is an addition product of an olefin-unsaturated monisocyanate and a phenoxy resin and the copolymerizable compound contains an acrylate or methacrylate group.
Claim 3
Dependent Claim
24 words
A method according to claim 1, further comprising the step of tempering by heating after removing the nonirradiated portion of the layer or foil.
Claim 4
Dependent Claim
19 words
A method according to claim 1, wherein the photopolymer is employed together with a photo initiatior or photo sensitizer.
Claim 5
Dependent Claim
28 words
A method according to claim 3, wherein the photo initiator or photo sensitizer is selected from the group consisting of alpha-halogen acetophenone, dialkoxyacetophenone, benzoylphosphine oxide, and Michler's ketone.
Claim 6
Dependent Claim
19 words
A method according to claim 1, wherein the phenoxy resin has a molecular weight of between 15,000 and 30,000.
Claim 7
Dependent Claim
36 words
A method according to claim 1, wherein the olefin-unsaturated monoisocyanate is an isocyanate selected from the group consisting of an isocyanate having a methacrylate group, and the addition product of hydroxyethyl acrylate or methacrylate, and 2,4-diisocyanotoluene.
Claim 8
Dependent Claim
9 words
A heat-resistant structured layer, produced according to claim 1.
Claim 9
Independent Claim
112 words
A method for the production of a heat-resistant structured layer which comprises applying a radiation-sensitive soluble polyether-based photopolymer in the form of a layer or foil on a substrate; irradiating a portion of the layer or foil through a negative pattern with actinic light or by guiding a light, electron, laser or ion beam over the layer of foil; and removing the nonirradiated portion of the layer or foil; wherein the photopolymer is an addition product of an oelfin-unsaturated monisocyanate and a phenoxy resin and said olefin-unsaturated monoisocyanate is selected from the group consisting of an isocyanate having a methacrylate group, and the addition product of hydroxyethyl acrylate or methacrylate, and 2,4-diisocyanatotoluene.
Claim 10
Independent Claim
112 words
A method for the production of a heat-resistant structured layer which comprises applying a radiation-sensitive soluble polyether-based photopolymer in the form of a layer or foil on a substrate; irradiating a portion of the layer or foil through a negative pattern with actinic light or by guiding a light, electron, laser or ion beam over the layer of foil; and removing the nonirradiated portion of the layer or foil; wherein the photopolymer is an addition product of an oelfin-unsaturated monisocyanate and a phenoxy resin and said olefin-unsaturated monoisocyanate is selected from the group consisting of an isocyanate having a methacrylate group, and the addition product of hydroxyethyl acrylate or methacrylate, and 2,4-diisocyanatotoluene.
Claim 11
Dependent Claim
9 words
A heat-resistant structured layer produced according to claim 8.
Claim 12
Dependent Claim
42 words
A heat resistant structured layer of claim 9 wherein the substrate is a structure transfer support, the irradiated layer or foil is a resist with an intermediate protective function and the heat resistant structure layer is used in a structure transfer process.
Claim 13
Dependent Claim
27 words
A heat resistant structure layer of claim 9 wherein the substrate is a semiconductor material and the irradiated layer or foil is a protective and insulating material.
Claim 14
Dependent Claim
27 words
A heat resistant structure layer of claim 9 wherein the substrate is a surface wave filter support and the irradiated layer or foil is a damping substrate.
Claim 15
Dependent Claim
29 words
A heat resistant structured layer of claim 9 wherein the substrate is a memory component containing cell fields and the irradiated layer or foil is an alpha-ray protecting means.
Claim 16
Dependent Claim
26 words
A heat resistant structured layer of claim 9 wherein the substrate is a liquid crystal display and the irradiated layer or foil is an orientation layer.
Claim 17
Dependent Claim
29 words
A heat-resistant structured layer of claim 9 wherein the substrate is a micro-conductor board and the irradiated layer or foil is a durable, protective solder resist and insulating layer.
Claim 18
Dependent Claim
24 words
A method according to claim 8, further comprising the step of tempering by heating after removing the nonirradiated portion of the layer or foil.
Claim 19
Dependent Claim
18 words
A method according to claim 8, wherein the photopolymer is employed together with a light-or radiation-sensitive copolymerizable compound.
Claim 20
Dependent Claim
16 words
A method according to claim 17, wherein the copolymerizable compound contains an acrylate or methacrylate group.
Claim 21
Dependent Claim
19 words
A method according to claim 8, wherein the photopolymer is employed together with a photo initiatior or photo sensitizer.
Claim 22
Dependent Claim
28 words
A method according to claim 19, wherein the photo initiator or photo sensitizer is selected from the group consisting of alpha-halogen acetophenone, dialkoxyacetophenone, benzoylphosphine oxide, and Michler's ketone.
Claim 23
Dependent Claim
19 words
A method according to claim 8, wherein the phenoxy resin has a molecular weight of between 15,000 and 30,000.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-05-08 | 1992-11-07 | 1993-05-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-05-08 | 1996-11-07 | 1997-05-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-05-08 | 2000-11-07 | 2001-05-09 | $7700.00 | Window Closed / Lapsed |