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US4824511A Expired / Lapsed US ⏱️ 0.0 years remaining

Multilayer circuit board with fluoropolymer interlayers

Assignee: EIDP Inc
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Filing: 1987-10-19
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Granted: 1989-04-25
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Expires: 2007-10-19
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Abstract

Abstract A multilayer circuit board consisting of multiple circuit layers supported on sheets of PTFE or PTFE containing a fibrous stiffening agent, said circuit-bearing sheets being joined in fixed relative positions by means of separating layers of a adhesive unsintered tetrafluoroethylene resin.

Inventors

  • 👤 Frederick N. Hartman
  • 👤 Alan C. Knight

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-02 08:54
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K3/4652; H05K3/4655; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/032; H05K1/034; H05K1/0353; H05K1/0366; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/015; H05K2201/07; H05K2201/0707; H05K2201/0715; H05K2203/00; H05K2203/13; H05K2203/1333; H05K2203/1355; H05K3/4611; H05K3/4626; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/31504; Y10T428/3154; Y10T428/31544

Claims Analysis

Total Claims: 2
Claim 1
Independent Claim 87 words
A process of assembling circuit-bearing sheets containing surface portions of conductive circuitry and surface portions of polytetrafluoroethylene to form multilayer laminates in which unsintered tetrafluoroethylene polymer made by dispersion polymerization is inserted between the sheets, pressure is applied at 50-1000 psi at a temperature below the fusion temperature of the polymer to encapsulate the circuits, and, in a separate step at a lower pressure of 0-50 psi the assembly is heated above the fusion temperature of the polymer to fuse the polymer particles into a continuous mass.
Claim 2
Dependent Claim 87 words
A process of assembling circuit-bearing sheets containing surface portions of conductive circuitry and surface portions of polytetrafluoroethylene to form multilayer laminates in which unsintered tetrafluoroethylene polymer made by dispersion polymerization is inserted between the sheets, pressure is applied at 50-1000 psi at a temperature below the fusion temperature of the polymer to encapsulate the circuits, and, in a separate step at a lower pressure of 0-50 psi the assembly is heated above the fusion temperature of the polymer to fuse the polymer particles into a continuous mass.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1992-04-24 1992-10-24 1993-04-25 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1996-04-24 1996-10-24 1997-04-25 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2000-04-24 2000-10-24 2001-04-25 $7700.00 Window Closed / Lapsed

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