Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
150 words
A method of improving the quantum efficiency of a charge-coupled-device image sensor having an array of pixels and charge transfer gates for reading out image charges from wells of said array of pixels in a layer of photosensitive semiconductor material produced on a substrate material, where the quantum efficiency is improved for blue, ultraviolet, far ultraviolet and low energy x-ray wavelengths comprised of the steps of overthinning the backside of said charge-coupled-device image sensor to remove all substrate material, and covering the overthinned backside with a thin oxide film, thereby leaving a depletion region just under said thin oxide film over said overthinned photosensitive semiconductor material as a result of thinning, and flooding the backside of said thinned photosensitive semiconductor material with intense ultraviolet radiation prior to using said charge-coupled-device imaging sensor thereby producing an accumulation layer of holes to greatly increase the quantum efficiency of said charge-coupled-device imaging sensor.
Claim 2
Independent Claim
150 words
A method of improving the quantum efficiency of a charge-coupled-device image sensor having an array of pixels and charge transfer gates for reading out image charges from wells of said array of pixels in a layer of photosensitive semiconductor material produced on a substrate material, where the quantum efficiency is improved for blue, ultraviolet, far ultraviolet and low energy x-ray wavelengths comprised of the steps of overthinning the backside of said charge-coupled-device image sensor to remove all substrate material, and covering the overthinned backside with a thin oxide film, thereby leaving a depletion region just under said thin oxide film over said overthinned photosensitive semiconductor material as a result of thinning, and flooding the backside of said thinned photosensitive semiconductor material with intense ultraviolet radiation prior to using said charge-coupled-device imaging sensor thereby producing an accumulation layer of holes to greatly increase the quantum efficiency of said charge-coupled-device imaging sensor.
Claim 3
Dependent Claim
129 words
A method as defined in claim 1 wherein said photosensitive semiconductor material is p-doped silicon epitaxially grown on a p + substrate, and overthinning is carried out beyond the epitaxial interface between said substrate and said photosensitive semiconductor material, and wherein said backside flooding with ultraviolet photons produces photoemitted electrons that migrate to said oxide film where electron traps capture the migrating electrons to build up a negative charge on the surface of said oxide film, thereby promoting valence and conduction band within the silicon bending from a downward to an upward direction from the innermost part of said depletion region to said thin oxide film and an accumulation of holes at the interface of the oxide with the p-doped silicon, thereby causing unwanted backside potential wells to collapse.
Claim 4
Dependent Claim
24 words
A method as defined in claim 2 wherein said photosensitive semiconductor material is thinned to about 8 to 10 μm of said epitaxial material.
Claim 5
Dependent Claim
33 words
A method as defined in claim 1 wherein said thin oxide film is produced as a natural consequence of long exposure to oxygen and water in the atmosphere to produce a native oxide.
Claim 6
Dependent Claim
29 words
A method as defined in claim 1 wherein said thin oxide film is grown in about one hour in the presence of deionized water maintained at about 95° C.