Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
168 words
A method of producing a semiconductor device for sensing light, said device having a junction between p-doped and n-doped layers of semiconductor material, and two ohmic contacts, one contact to said p-doped layer and one contact to said n-doped layer, said device being adapted to receive light through a surface of a predetermined layer and deliver photogenerated minority carriers through said junction for collection, a technique for improving quantum efficiency by providing for the depletion edge from said junction to extent to said surface of said predetermined layer, and using a metal having a larger work function than said semiconductor material, providing a metal film over said surface of said predetermined layer with a thin oxide film between said metal film and said surface of said predetermined layer, whereby the energy bands, which normally decreases near said surface of said predetermined layer to produce a trap for minority carriers, is caused to instead increase causing minority carriers to be accelerated toward the other layer of said semiconductor material.
Claim 2
Independent Claim
168 words
A method of producing a semiconductor device for sensing light, said device having a junction between p-doped and n-doped layers of semiconductor material, and two ohmic contacts, one contact to said p-doped layer and one contact to said n-doped layer, said device being adapted to receive light through a surface of a predetermined layer and deliver photogenerated minority carriers through said junction for collection, a technique for improving quantum efficiency by providing for the depletion edge from said junction to extent to said surface of said predetermined layer, and using a metal having a larger work function than said semiconductor material, providing a metal film over said surface of said predetermined layer with a thin oxide film between said metal film and said surface of said predetermined layer, whereby the energy bands, which normally decreases near said surface of said predetermined layer to produce a trap for minority carriers, is caused to instead increase causing minority carriers to be accelerated toward the other layer of said semiconductor material.
Claim 3
Dependent Claim
37 words
A method as defined in claim 1 wherein the step of providing for said depletion edge to extend to the surface of said predetermined layer is comprised of thinning said predetermined layer to less than six microns.
Claim 4
Dependent Claim
34 words
A method as defined in claim 1 wherein the step of providing for said depletion edge to extend to said surface of said predetermined layer includes applying a bias voltage to said metal film.
Claim 5
Dependent Claim
71 words
A method as defined in claim 1 wherein the step of providing for said depletion edge to extend to said surface of said predetermined layer is achieved by thinning said semiconductor device to place said depletion edge near the surface of said predetermined layer, applying a bias voltage to said metal film, and adjusting said bias voltage to control said depletion edge to be at said surface of said predetermined layer.
Claim 6
Dependent Claim
23 words
A method as defined in claim 1 wherein said step of providing said thin oxide film consists of growing a quality oxide film.
Claim 7
Dependent Claim
21 words
A method as defined in claim 5 wherein said oxide film is native oxide grown to about 30 Å by aging.
Claim 8
Dependent Claim
21 words
A method as defined in claim 5 where said oxide film is grown by treatment with nitric acid to 30 Å.
Claim 9
Dependent Claim
27 words
A method as defined in claim 5 wherein said quality oxide film is provided with an interface state density level below approximately 3×10 13 states/cm 2 -ev.
Claim 10
Dependent Claim
25 words
A method as defined in claim 1 wherein said predetermined layer is provided with a doping level less than about 10 15 cm -3 .
Claim 11
Dependent Claim
46 words
A method as defined in claim 1 wherein said predetermined layer is provided with a doping level in the order of 10 15 cm - , and said quality oxide film is provided with an interface state density level below approximately 3×10 13 states/cm 2 -ev.