Ceramic composition for dielectrics

Claim 2

A ceramic composition for an electronic circuit board, a hybrid integrated circuit, an integrated circuit package or a multilayer ceramic structure, consisting essentially of: at least one electrically insulating glass; at least one organic binder; at least 0.1% by weight of at least one inorganic peroxide; and at least 0.01% by weight of at least one material selected from the group consisting of: a metal selected from the platinum group; a compound of the platinum group; and a manganese oxide.

Claim 3

The ceramic composition of claim 1, wherein said at least one material is present in an amount by weight of 0.01-10%.

Claim 4

The ceramic composition of claim 1, wherein said at least one material is selected from the group consisting of Pt, Pd, Pt-Rh, PdO and MnO 2 .

Claim 5

The ceramic composition of claim 1, wherein said compound of the platinum group is selected from the group consisting of chloroplatinic acid; chloropalladic acid; tetrammine platinum (II) nitrate; tetrammine platinum (II) chloride; platinum hydroxide; ruthenium hydroxide; palladium nitrate; platinum chloride; dicarbonyl bis(triphenyl phosphine) platinum; iodotrimethyl platinum; dichloro (η-1, 5-cyclooctadiene) platinum; and dodecacarbonyl tri-ruthenium.

Claim 6

The ceramic composition of claim 1, wherein said at least one inorganic peroxide is present in an amount by weight of 0.1-40%.

Claim 7

The ceramic composition of claim 1, wherein said at least one inorganic peroxide is selected from the group consisting of peroxides of alkali metals, peroxides of group II elements of the Periodic Table and peroxides of heavy metals.

Claim 8

The ceramic composition of claim 6, wherein said at least one inorganic peroxide is selected from the group consisting of calcium peroxide, strontium peroxide, barium peroxide, zinc peroxide and cadmium peroxide.

Claim 9

The ceramic composition of claim 7, wherein said at least one inorganic peroxide is present in an amount by weight of 0.1-40%.

Claim 10

The ceramic composition of claim 7, wherein said at least one inorganic peroxide is selected from the group consisting of calcium peroxide and strontium peroxide in an amount by weight of 0.01-40%.

Claim 11

The ceramic composition of claim 1, wherein said at least one insulating glass is selected from the group of glasses consisting of: a silicate glass consisting essentially of SiO 2 and at least one component selected from the group consisting of Al 2 O 3 , B 2 O 3 , MgO, PbO, BaO, ZnO, Li 2 O, TiO 2 , CaO and ZrO 2 a crystallizable glass consisting essentially of SiO 2 , CaO, ZnO and TiO 2 ; a crystallizable glass consisting essentially of SiO 2 , MgO, BaO, B 2 O 3 , and ZnO; a crystallizable glass consisting essentially of SiO 2 , Al 2 O 3 , PbO, and CaO; a crystallizable glass consisting essentially of SiO 2 , Al 2 O 3 , CaO, B 2 O 3 , and MgO; and a crystallizable glass consisting essentially of SiO 2 , B 2 O 3 , PbO and CaO, wherein each of said crystallizable glasses is crystallized through heat treatment thereof.

Claim 12

The ceramic composition of claim 1, wherein said at least one organic binder is selected from the group consisting of ethyl cellulose, polyvinyl butyral resins, polyethylene resins, polystyrene resins, polyvinyl alcohol resins, acrylic resins, methacrylic resins and acrylate-methacrylate copolymers.

Claim 13

The ceramic composition of claim 1, wherein said at least one organic binder is present in an amount by weight of 0.5-30%.

Claim 14

A ceramic composition for an electronic circuit board, a hybrid integrated circuit, an integrated circuit package or a multilayer ceramic structure, consisting essentially of: at least one electrically insulating glass; at least one component selected from the group consisting of refractory fillers and oxide additives; at least one organic binder; at least 0.1% by weight of at least one inorganic peroxide; and at least 0.01% by weight of at least one material selected from the group consisting of: a metal selected from the platinum group; a compound of the platinum group; and a manganese oxide.

Claim 15

A ceramic composition for an electronic circuit board, a hybrid integrated circuit, an integrated circuit package or a multilayer ceramic structure, consisting essentially of: at least one electrically insulating glass; at least one component selected from the group consisting of refractory fillers and oxide additives; at least one organic binder; at least 0.1% by weight of at least one inorganic peroxide; and at least 0.01% by weight of at least one material selected from the group consisting of: a metal selected from the platinum group; a compound of the platinum group; and a manganese oxide.

Claim 16

The ceramic composition of claim 13, wherein said at least one material is present in an amount by weight of 0.01-10%.

Claim 17

The ceramic composition of claim 13, wherein said at least one material is selected from the group consisting of Pt, Pd, Pt-Rh, PdO and MnO 2 .

Claim 18

The ceramic composition of claim 13, wherein said compound of the platinum group is selected from the group consisting of chloroplatinic acid; chloropalladic acid; tetrammine platinum (II) nitrate; tetrammine platinum (II) chloride; platinum hydroxide; ruthenium hydroxide; palladium nitrate; platinum chloride; dicarbonyl bis(triphenyl phosphine) platinum; iodotrimethyl platinum; dichloro (η-1, 5-cyclooctadiene) platinum; and dodecacarbonyl tri-ruthenium.

Claim 19

The ceramic composition of claim 13, wherein said at least one inorganic peroxide is present in an amount by weight of 0.1-40%.

Claim 20

The ceramic composition of claim 13, wherein said at least one inorganic peroxide is selected from the group consisting of peroxides of alkali metals, peroxides of group II elements of the Periodic Table and peroxides of heavy metals.

Claim 21

The ceramic composition of claim 18, wherein said at least one inorganic peroxide is selected from the group consisting of calcium peroxide, strontium peroxide, barium peroxide, zinc peroxide and cadmium peroxide.

Claim 22

The ceramic composition of claim 19, wherein said at least one inorganic peroxide is present in an amount by weight of 0.1-40%.

Claim 23

The ceramic composition of claim 19, wherein said at least one inorganic peroxide is selected from the group consisting of calcium peroxide and strontium peroxide in an amount by weight of 0.1-40%.

Claim 24

The ceramic composition of claim 13, wherein said at least one insulating glass is selected from the group of glasses consisting of: a silicate glass consisting essentially of SiO 2 and at least one component selected from the group consisting of Al 2 O 3 , B 2 O 3 , MgO, PbO, BaO, ZnO, Li 2 0, TiO 2 , CaO and ZrO 2 ; a crystallizable glass consisting essentially of SiO 2 , Al 2 O 3 , CaO, ZnO and TiO 2 ; a crystallizable glass consisting essentially of SiO 2 , MgO, BaO, B 2 O 3 , and ZnO; a crystallizable glass consisting essentially of SiO 2 , Al 2 O 3 , PbO, and CaO; a crystallizable glass consisting essentially of SiO 2 , Al 2 O 3 , CaO, B 2 O 3 , and MgO; and a crystallizable glass consisting essentially of SiO 2 , B 2 O 3 , PbO and CaO, wherein each of said crystallizable glasses is crystallized through heat treatment thereof.

Claim 25

The ceramic composition of claim 13, wherein said at least one organic binder is selected from the group consisting of ethyl cellulose, polyvinyl butyral resins, polyethylene resins, polystyrene resins, polyvinyl alcohol resins, acrylic resins, methacrylic resins and acrylatemethacrylate copolymers.

Claim 26

The ceramic composition of claim 13, wherein said at least one organic binder is present in an amount by weight of 0.5-30%.

Claim 27

The ceramic composition of claim 13, wherein said at least one component is selected from the group consisting of alumina, zirconia, silica, mullite, cordierite, zinc oxide, praseodymium oxide and bismuth oxide.

Claim 28

The ceramic composition of claim 16, wherein a ratio of weight percent of said at least one electrically insulating glass and said at least one component is 90/10-5/95.

Claim 29

A ceramic composition for an electronic circuit board, a hybrid integrated circuit, an integrated circuit package or a multilayer ceramic structure, consisting essentially of: at least one electrically insulating glass; at least one organic binder; at least 0.1% by weight of at least one inorganic peroxide; a cobalt oxide; and at least 0.01% by weight of at least one material selected from the group consisting of: a metal selected from the platinum group; a compound of the platinum group; andd a manganese oxide.

Claim 30

A ceramic composition for an electronic circuit board, a hybrid integrated circuit, an integrated circuit package or a multilayer ceramic structure, consisting essentially of: at least one electrically insulating glass; at least one organic binder; at least 0.1% by weight of at least one inorganic peroxide; a cobalt oxide; and at least 0.01% by weight of at least one material selected from the group consisting of: a metal selected from the platinum group; a compound of the platinum group; andd a manganese oxide.

Claim 31

A ceramic composition for an electronic circuit board, a hybrid integrated circuit, an integrated circuit package or a multilayer ceramic structure, consisting essentially of: at least one electrically insulating glass; at least one component selected from the group consisting of refractory fillers and oxide additives; at least one organic binder; at least 0.1% by weight of at least one inorganic peroxide; a cobalt oxide; and at least 0.01% by weight of at least one material selected from the group consisting of: a metal selected from the platinum group; a compound of the platinum group; and a manganese oxide.

Claim 32

A ceramic composition for an electronic circuit board, a hybrid integrated circuit, an integrated circuit package or a multilayer ceramic structure, consisting essentially of: at least one electrically insulating glass; at least one component selected from the group consisting of refractory fillers and oxide additives; at least one organic binder; at least 0.1% by weight of at least one inorganic peroxide; a cobalt oxide; and at least 0.01% by weight of at least one material selected from the group consisting of: a metal selected from the platinum group; a compound of the platinum group; and a manganese oxide.

Claim 33

The ceramic composition of claim 27, wherein said at least one material is selected from the group consisting of Pt, Pd, Pt-Rh, PdO and MnO 2 , and said cobalt oxide is selected from the group consisting of Co 3 O 4 and CoO.

Claim 34

The ceramic composition of claim 28, wherein said at least one material is selected from the group consisting of Pt, Pd, Pt-h, PdO and MnO 2 , and said cobalt oxide is selected from the group consisting of Co 3 O 4 and CoO.