Semiconductor device

Claim 2

In a semiconductor device comprising a plurality of first bonding pads provided on a semiconductor chip for transmitting and receiving an identical signal to and from an external apparatus, and an internal buffer circuit for transmitting and receiving said signal to and from said plurality of first bonding pads, said plurality of first bonding pads and said internal circuit being formed on the same semiconductor chip, circuitry for reducing capacitance at said first bonding pads as viewed from said external apparatus, comprising: a second bonding pad provided on said semiconductor chip for receiving an external control signal, and selection circuitry provided between said plurality of first bonding pads and said internal buffer circuit for connecting only a selected one of said plurality of first bonding pads to said internal buffer circuit in response to said control signal supplied through said second bonding pad so that capacitance at the unselected bonding pad is isolated from the selected bonding pad.

Claim 3

A semiconductor device in accordance with claim 1, wherein said selection means comprises: a first inverter (12) for inverting said control signal received through said second bonding pad and providing an output, a second inverter (13) for inverting said output of said first inverter and providing an output, a first bilateral switch (20) having an input connected to one of said first bonding pads and turning on and off in response to the outputs of said first and second inverters, said first bilateral switch being formed by a p channel MOS transistor (15) and an n channel MOS transistor (16) for selectively passing the output of said one of said first bonding pads, and a second bilateral switch (21) having an input connected to another bonding pad out of said first bonding pads and turning on and off in response to the outputs of said first and second inverters, said second bilateral switch being formed by a p channel MOS transistor (18) and an n channel MOS transistor (17) for selectively passing an output of said another bonding pad, said first and second bilateral switches being in a relation in which either one of said first and second bilateral switches is turned on while the other one of said switches is turned off, and the outputs of said first and second bilateral switches being commonly connected to said internal circuit.

Claim 4

In a semiconductor device formed on a semiconductor chip to be located within a package, said device including an internal buffer circuit and a plurality of bonding pads for transmitting signals between the internal buffer circuit and an external apparatus, first and second ones of said bonding pads to be connected to a common external signal source or load, the improvement for reducing capcitance at each of said first and second bonding pads, comprising: selecting means for selecting between first and second signal paths connecting said internal buffer circuit and the common external signal source or load, said selecting means including controllable switching means for switchably selecting between said first and second bonding pads of said semiconductor device, depending upon the types of package within which said device is located, and for providing a connection path between the selected bonding pad and said internal buffer circuit; and a control bonding pad for receiving an external control signal; said switching means responsive to said control signal at said control bonding pad for switching into connection with said internal circuit a selected one of said first and second bonding pads and an associated connection path; whereby capacitances at said first and second bonding pads, viewed by said common external signal source or load, are isolated from each.

Claim 5

In a semiconductor device formed on a semiconductor chip to be located within a package, said device including an internal buffer circuit and a plurality of bonding pads for transmitting signals between the internal buffer circuit and an external apparatus, first and second ones of said bonding pads to be connected to a common external signal source or load, the improvement for reducing capcitance at each of said first and second bonding pads, comprising: selecting means for selecting between first and second signal paths connecting said internal buffer circuit and the common external signal source or load, said selecting means including controllable switching means for switchably selecting between said first and second bonding pads of said semiconductor device, depending upon the types of package within which said device is located, and for providing a connection path between the selected bonding pad and said internal buffer circuit; and a control bonding pad for receiving an external control signal; said switching means responsive to said control signal at said control bonding pad for switching into connection with said internal circuit a selected one of said first and second bonding pads and an associated connection path; whereby capacitances at said first and second bonding pads, viewed by said common external signal source or load, are isolated from each.

Claim 6

An improved semiconductor device as recited in claim 3, wherein said controllable switching means comprises first bilateral switching means connected between said internal circuit and a first bonding pad and connecting path, and second bilateral switching means connected between said internal circuit and a second bonding pad and connecting path, said first and second bilateral switching means each responsive to said control signal on said control bonding pad means.

Claim 7

An improved semiconductor device as recited in claim 4, wherein said first and second bilateral switching means each comprises a p channel MOS transistor and an n channel MOS transistor for respectively providing said connection path bilaterally between said internal circuit and said first and second bonding pads.

Claim 8

In a semiconductor device formed on a semiconductor chip including an internal circuit and a plurality of bonding pads for transmitting signals between the internal circuit and an external apparatus, the improvement comprising: selecting means for selecting between first and second signal paths connecting said internal circuit and the external apparatus, said selecting means including controllable switching means for switchably selecting between first and second bonding pads of said semiconductor device and for providing a connection path between the selected bonding pad and said internal circuit; and control bonding pad means for receiving a control signal from an external device; said switching means responsive to said control signal of said control bonding pad for switching into connection with said internal circuit a selected one of said first and second bonding pads and an associated connection path; wherein said controllable switching means comprises a first bilateral switching means connected between said internal circuit and a first bonding pad and connecting path, and a second bilateral switching means connected between said internal circuit and a second bonding pad and connecting path; said first and second bilateral switching means each responsive to said control signal on said control bonding pad means; wherein said first and second bilateral switching means each comprises a p channel MOS transistor and an n channel MOS transistor for respectively providing said connection path bilaterally between said internal circuit and said first and second bonding pads; further comprising inverting means for providing respectively inverted forms of said control signal to said first and second bilateral switching means, whereby one of said bilateral switching means and connecting path is selected responsively to a first polarity of said control signal and the other of said bilateral switching means and connecting path is selected responsively to an opposite polarity of said control signal.

Claim 9

In a semiconductor device formed on a semiconductor chip including an internal circuit and a plurality of bonding pads for transmitting signals between the internal circuit and an external apparatus, the improvement comprising: selecting means for selecting between first and second signal paths connecting said internal circuit and the external apparatus, said selecting means including controllable switching means for switchably selecting between first and second bonding pads of said semiconductor device and for providing a connection path between the selected bonding pad and said internal circuit; and control bonding pad means for receiving a control signal from an external device; said switching means responsive to said control signal of said control bonding pad for switching into connection with said internal circuit a selected one of said first and second bonding pads and an associated connection path; wherein said controllable switching means comprises a first bilateral switching means connected between said internal circuit and a first bonding pad and connecting path, and a second bilateral switching means connected between said internal circuit and a second bonding pad and connecting path; said first and second bilateral switching means each responsive to said control signal on said control bonding pad means; wherein said first and second bilateral switching means each comprises a p channel MOS transistor and an n channel MOS transistor for respectively providing said connection path bilaterally between said internal circuit and said first and second bonding pads; further comprising inverting means for providing respectively inverted forms of said control signal to said first and second bilateral switching means, whereby one of said bilateral switching means and connecting path is selected responsively to a first polarity of said control signal and the other of said bilateral switching means and connecting path is selected responsively to an opposite polarity of said control signal.

Claim 10

An improved semiconductor device as recited in claim 6 wherein said inverting means comprises: first means for providing said control signal to said p channel MOS transistor of said first bilateral switching means and to said n channel MOS transistor of said second bilateral switching means, and second means for providing an inverted form of said control signal to said n channel MOS transistor of said first bilateral switching means and to said p channel MOS transistor of said second bilateral switching means.

Claim 11

An improved semiconductor device as recited in claim 7 wherein said internal circuit comprises an internal buffer circuit.

Claim 12

An improved semiconductor device as recited in claim further comprising inverting means for providing respectively inverted forms of said control signal to said first and second bilateral switching means, whereby one of said bilateral switching means and connecting path is selected responsively to a first polarity of said control signal and the other of said bilateral switching means and connecting path is selected responsively to an opposite polarity of said control signal.

Claim 13

An improved semiconductor device as recited in claim 3 wherein said semiconductor chip is mounted in a package and said control signal is provided to said control bonding pad as a function of a configuration of said package.

Claim 14

An improved semiconductor device as recited in claim 10 wherein said internal circuit comprises an internal buffer circuit.

Claim 15

An improved semiconductor device as recited in claim 3 wherein said internal circuit comprises an internal buffer circuit.

Claim 16

A semiconductor device comprising a plurality of first bonding pads provided on a semiconductor chip for transmitting and receiving an identical signal to and from an external apparatus, and an internal buffer circuit for transmitting and receiving said signal to and from said plurality of first bonding pads, said plurality of first bonding pads and said internal circuit being formed on the same semiconductor chip, said semicondictor device further comprising: a second bonding pad provided on said semiconductor chip for receiving a control control signal supplied from an external external apparatus outside said semiconductor chip, selection means provided between said plurality of first bonding pads and said internal circuit for selectively connecting only one of said plurality of first bonding pads to said buffer circuit in response to said control signal supplied through said second bonding pad, said selection means comprises: a first inverter for inverting said control signal received through said second bonding pad and providing an output, a second inverter for inverting said output of said first inverter and providing an output, a first bilateral switch having an input connected to one of said first bonding pads and turning on and off in response to the outputs of said first and second inverters, said first bilateral switch being formed by a p channel MOS transistor and an n channel MOS transistor for selectively passing the output of said one of said first bonding pads, and a second bilateral switch having an input connected to another bonding pad out of said first bonding pads and turning on and off in response to the outputs of said first and second inverters, said second bilateral switch being formed by a p channel MOS transistor and an n channel MOS transistor for selectively passing an output of said another bonding pad, said first and second bilateral switches being in a relation in which either one of said first and second bilateral switches is turned on while the other one of said switches is turned off, and the outputs of said first and second bilateral switches being commonly connected to said internal circuit.

Claim 17

A semiconductor device comprising a plurality of first bonding pads provided on a semiconductor chip for transmitting and receiving an identical signal to and from an external apparatus, and an internal buffer circuit for transmitting and receiving said signal to and from said plurality of first bonding pads, said plurality of first bonding pads and said internal circuit being formed on the same semiconductor chip, said semicondictor device further comprising: a second bonding pad provided on said semiconductor chip for receiving a control control signal supplied from an external external apparatus outside said semiconductor chip, selection means provided between said plurality of first bonding pads and said internal circuit for selectively connecting only one of said plurality of first bonding pads to said buffer circuit in response to said control signal supplied through said second bonding pad, said selection means comprises: a first inverter for inverting said control signal received through said second bonding pad and providing an output, a second inverter for inverting said output of said first inverter and providing an output, a first bilateral switch having an input connected to one of said first bonding pads and turning on and off in response to the outputs of said first and second inverters, said first bilateral switch being formed by a p channel MOS transistor and an n channel MOS transistor for selectively passing the output of said one of said first bonding pads, and a second bilateral switch having an input connected to another bonding pad out of said first bonding pads and turning on and off in response to the outputs of said first and second inverters, said second bilateral switch being formed by a p channel MOS transistor and an n channel MOS transistor for selectively passing an output of said another bonding pad, said first and second bilateral switches being in a relation in which either one of said first and second bilateral switches is turned on while the other one of said switches is turned off, and the outputs of said first and second bilateral switches being commonly connected to said internal circuit.