US4806503A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for the replacement of semiconductor devices
Assignee: Sharp Corp
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Filing: 1986-10-23
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Granted: 1989-02-21
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Expires: 2006-10-23
Abstract
Abstract A method for the replacement of semiconductor devices in a multi-chip module that is constructed by mounting semiconductor devices on a tape carrier used as an electrical wiring substrate, wherein when at least one of said semiconductor devices develops a flaw, it is cut away at the finger sections that connect said defective semiconductor device to the tape, and then a different and non-defective semiconductor device having finger sections longer than those of said defective semiconductor device that has been removed is connected to said tape in such a manner that the finger sections of said different and non-defective semiconductor device are joined and connected to the corresponding finger sections retained on said tape.
Inventors
- 👤 Hirokazu Yoshida
- 👤 Hiroshi Nakatani
- 👤 Keiji Yamamura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 06:09
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/701; H10W72/071; H10W72/077; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/118; H05K3/00; H05K3/22; H05K3/225; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/4913; Y10T29/49133; Y10T29/49135; Y10T29/49155; Y10T29/49156; Y10T29/49165; Y10T29/49167; Y10T29/49718; Y10T29/49721; Y10T29/4973; Y10T29/53; Y10T29/53274
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
114 words
A method for the replacement of semiconductor devices in a multi-chip module that is constructed by mounting semiconductor devices on a tape carrier used as an electrical wiring substrate, wherein when at least one of said semiconductor devices develops a flaw, it is cut away at the finger sections that connect said defective semiconductor device to the tape, and then a different and non-defective semiconductor device having finger sections longer than those of said defective semiconductor device that has been removed is connected to said tape in such a manner that the finger sections of said different and non-defective semiconductor device are joined and connected to the corresponding finger sections retained on said tape.
Claim 2
Independent Claim
114 words
A method for the replacement of semiconductor devices in a multi-chip module that is constructed by mounting semiconductor devices on a tape carrier used as an electrical wiring substrate, wherein when at least one of said semiconductor devices develops a flaw, it is cut away at the finger sections that connect said defective semiconductor device to the tape, and then a different and non-defective semiconductor device having finger sections longer than those of said defective semiconductor device that has been removed is connected to said tape in such a manner that the finger sections of said different and non-defective semiconductor device are joined and connected to the corresponding finger sections retained on said tape.
Claim 3
Dependent Claim
59 words
A method according to claim 1, wherein said different and non-defective semiconductor device having the finger sections longer than those of the defective semiconductor device that has been removed is a semiconductor device which has been cut away from a different multi-chip module in which semiconductor devices are mounted on a tape carrier used as an electrical wiring substrate.
References Cited (Backward Citations)
US3969813A
Cited
JPS5232674A
Cited
US4012832A
Cited
JPS5585350A
Cited
JPS5694753A
Cited
US4567643A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-02-21 | 1992-08-22 | 1993-02-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-02-21 | 1996-08-22 | 1997-02-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-02-21 | 2000-08-22 | 2001-02-21 | $7700.00 | Window Closed / Lapsed |