US4803542A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Carrier element for an IC-module
Assignee: GAO GESSELLSCHAFT fur AUTOMATION und ORGANISATION MBH
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Filing: 1987-05-18
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Granted: 1989-02-07
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Expires: 2007-05-18
Abstract
Abstract A carrier element for an IC-module for incorporation into an identification card. The element includes a flexible carrier film supporting conductive leads and contact pads. A semi-conductor chip is electrically connected to the leads and pads. Cast resin surrounds the chip and carrier film, including the carrier pads, to form a solid carrier element capable of resisting mechanical stresses.
Inventors
- 👤 Yahya Haghiri-Tehrani
- 👤 Joachim Hoppe
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 13:47
CPC Classifications
G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/07745; H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/699; H10W72/00; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W72/50; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
145 words
A carrier element for an IC-chip suitable for incorporation, as a unit, into a financial or identification card, said carrier element comprising: a single layer carrier stratum having an aperture with a periphery, said carrier stratum further having recesses outside the periphery of said aperture through said stratum; an electrically conductive film laminated to said carrier stratum and spanning said recesses; contact surfaces formed out of said electrically conductive film but electrically isolated therefrom, said contact surface lying outside the periphery of said aperture and accessible through said recesses; an IC-chip positioned in the aperture of said carrier stratum; connection means in said recesses for connecting said IC-chip to said contact surfaces, said connection means being unsupported by said carrier stratum; and a hardened resin filling said aperture and recesses, said resin surrounding said IC-chip in said aperture and said connection means in said recesses.
Claim 2
Dependent Claim
145 words
A carrier element for an IC-chip suitable for incorporation, as a unit, into a financial or identification card, said carrier element comprising: a single layer carrier stratum having an aperture with a periphery, said carrier stratum further having recesses outside the periphery of said aperture through said stratum; an electrically conductive film laminated to said carrier stratum and spanning said recesses; contact surfaces formed out of said electrically conductive film but electrically isolated therefrom, said contact surface lying outside the periphery of said aperture and accessible through said recesses; an IC-chip positioned in the aperture of said carrier stratum; connection means in said recesses for connecting said IC-chip to said contact surfaces, said connection means being unsupported by said carrier stratum; and a hardened resin filling said aperture and recesses, said resin surrounding said IC-chip in said aperture and said connection means in said recesses.
Claim 3
Dependent Claim
14 words
A carrier element according to claim 1 wherein said connection means are fine wires.
Claim 4
Dependent Claim
134 words
The combination of a card-like member and a carrier element contained therein: said carrier element comprising a single layer carrier stratum having an aperture with a periphery and recesses through said stratum outside the periphery of said aperture; an electrically conductive film laminated to said carrier stratum and spanning said recesses; contact surface formed out of said electrically conductive film but electrically isolated therefrom, said contact surfaces lying outside the periphery of said aperture and accessible through said recesses; an IC-chip positioned in the aperture of said carrier stratum; connection means for connecting said IC-chip to said contact surfaces in said recesses, said connection means being unsupported by said carrier stratum; and cast, hardened resin surrounding said IC-chip in said aperture and said connection means in said recesses for protecting them against mechanical forces.
Claim 5
Dependent Claim
134 words
The combination of a card-like member and a carrier element contained therein: said carrier element comprising a single layer carrier stratum having an aperture with a periphery and recesses through said stratum outside the periphery of said aperture; an electrically conductive film laminated to said carrier stratum and spanning said recesses; contact surface formed out of said electrically conductive film but electrically isolated therefrom, said contact surfaces lying outside the periphery of said aperture and accessible through said recesses; an IC-chip positioned in the aperture of said carrier stratum; connection means for connecting said IC-chip to said contact surfaces in said recesses, said connection means being unsupported by said carrier stratum; and cast, hardened resin surrounding said IC-chip in said aperture and said connection means in said recesses for protecting them against mechanical forces.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-02-07 | 1992-08-08 | 1993-02-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-02-07 | 1996-08-08 | 1997-02-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-02-07 | 2000-08-08 | 2001-02-07 | $7700.00 | Window Closed / Lapsed |